Source: IConnect 007 article
by David Hillman, Rockwell Collins.
SMT electrolytic capacitors are a widely used component technology on IPC Class 3 avionics product designs. The body configuration of SMT electrolytic capacitors leads to solder joints that are only partially visible for optical inspection purposes. Figure 1 illustrates the obscured optical view of the capacitor lead due to the body construction/lead configuration. The capacitor lead exits from the bottom of the component and makes an “L” bend into the horizontal plane to provide surface area for the formation of a surface mount solder joint. (more…)