Capacitors

Chapter C - CAPACITORS


C1 INTRODUCTION

C2 ABBREVIATIONS

  • Concepts
  • Standards & Institutes
  • Materials

C3 CONCEPTS AND DEFINITIONS

  • Capacitance
  • Insulation resistance, IR
  • Losses
  • Energy contents / Force manifestations
  • Category concepts

C4 ELECTROSTATIC / NON-ELECTROLYTIC CAPACITORS

C5 ELECTROLYTIC CAPACITORS

C6 VARIABLE CAPACITORS

C7 MATERIAL/TYPE CHARACTERISTICS


 

C1 INTRODUCTION

Choosing the right capacitor is a difficult task and a multitude of SMD types hasn’t made it any easier. e-PassiveBook should help you find objective information about the advantages and disadvantages of the different types of capacitors. Moreover, there are relatively obscure characteristics in some types which may be dangerous in one application but quite harmless in another. e-PassiveBook describes such characteristics in such a way that you should be able to adapt the choice of component to that information and help you to derive advantage from dearly-bought experiences.

 

C2 ABBREVIATIONS

We reproduce here some of the most common abbreviations on occurring concepts and references concerning capacitors. For the sake of clarity sometimes the explanations are repeated in corresponding part.

CONCEPTS

ε             Dielectric Constant, Permittivity

@           at (ex: @25°C = at 25°C)

AC         Alternating Current

CC         Chip Carrier

D/A        Digital to Analog

DA         Dielectric absorption

DC         Direct Current

DF          Dissipation Factor / Tan

DIP        Dual-in-line Package (also DIL = Dual-In-Line)

DPA       Destructive Physical Analysis

ESD       Electrostatic Discharge

GMV     Guaranteed Minimum Value

HF          High frequency

IR          Insulation Resistance

IR           Infrared

Q            The Capacitor’s Factor of Merit (=1/tan)

RFI        Radio Frequency Interference

RH         Relative Humidity

R.M.S    Root mean square

RT          Room Temperature (» 23 °C).

SIP         Single-in-line Package (also SIL = Single-In-Line).

SM         Surface Mount

SMD      Surface Mount Devices

SMPS    Switched-Mode Power Supplies

SMT      Surface Mount Technology.

Tan δ      Dissipation Factor

TC          Temperature Coefficient

TCh       Temperature Characteristic

TCE       Temperature Coefficient of Expansion

X & Y    A kind of Interference Suppression Capacitors used in Mains applications


STANDARDS and INSTITUTES

BS          British Standards

BSI        British Standard Institution

CECC    Cenelec Electronic Components Committee.

DIN       Deutsche Industrie-Normen.          

IEC        International Electrotechnical Commission

JIS          Japanese Industrial Standards

MIL       Military Specification / USA; also applied by

other countries with this type of specifying.

UL         Underwriters´ Laboratories

VDE      Verband Deutscher Elektro-techniker

 

MATERIALS

KC         Polycarbonate with foil electrodes

KP          Polypropylene with foil electrodes

KT         Polyester with foil electrodes

MK        Metallized plastic films

MKC     Metallized polycarbonate                

MKI       Metallized Polyphenylene Sulfide                        

MKP      Metallized polypropylene

MKT      Metallized polyester

MP         Metallized paper

PC          Polycarbonate

PEN       ”Polyester” / Polyethylene Naphtalate

PET        Polyester / Mylar (Polyethylene Terephtalate)

PP          Polypropylene    

PPS        Polyphenylene Sulfide

PS          Polystyrene

PSU       Polysulfone

PTFE     Teflon (Polytetrafluor Ethylene)

PVDF    Polyvinylidene fluoride

 


rev.1.: P-O.Fagerholt., CLR Passive Components Handbook

© European Passive Components Institute