PCNS Passive Components Networking Symposium

Passive Components Networking Days

PCNS is a bi-annual international symposium organised by EPCI in co-operation with an European university.

Technical papers and articles from the past PCNS events are published at the EPCI e-Symposium section here.

NEXT EVENT: 2nd PCNS Symposium 10-13th September 2019, Bucharest, Romania

sponsored by:


media partner:

hosted by:

Electronics, Telecommunication and
Information Technology Faculty
of Politehnica University of Bucharest


10th Jan 2019    Call for Papers
12th Apr 2019     Abstract deadline
31th Apr 2019    Notice of acceptance
9th Jun 2019      Paper deadline
20th Jun 2019   Preliminary program
20th Jul 2019     Early registration up to
23rd Aug 2019    Final program
10-13th Sep 2019  Conference dates



early registration with reduced fee valid till 20th July 2019

GDPR notice: all personal information submitted by the online form is dedicated only to the 2nd PCNS evaluation and communication processes handled by EPCI. No personal information will be shared with third parties or for marketing purposes.




  • Passive Components Mounting Guidelines Workshop
  • Politehnica University Tour

Keynote Presentations:

  • Passive Components – Keys to enabling Advanced Future System Designs; Ron Demcko; AVX Corporation Fellow
  • EMI and Inductors; Stephan Menzel, Würth Elektronik eiSosWürth Elektronik eiSos
  • Passive Electronic Components Education in Romania – Facts and Achievements in the last 30 years; Paul Svasta; University Politehnica Bucharest

Advanced Passive Components Workshop

Leading passive components manufacturers will discuss their hot products, application notes and latest technology during the Advanced Passive Components Workshop as part of the upcoming 2nd PCNS Passive Components Networking Symposium on 11th September 2019 in Bucharest, Romania.

Attendees to the next 2nd PCNS Symposium will get a unique chance to meet experts from leading passive manufacturers AVX, Kemet, KOA Europe, Murata and Wuerth Elektronik and discuss the hot topics during a four-hour workshop dedicated to latest passive components and its applications.

see more details here.

Hot Panel Discussion:

MLCC Class II DC BIAS & Ageing Capacitance Loss

MLCC capacitors are dominating today’s capacitor market enabling high grade of electronics miniaturization. The continuous downsizing and use of higher and higher dielectric constant materials for MLCC class II capacitors has however resulted in worsening of some electrical parameters stability such as capacitance drop at operating conditions.

Thus, in consequence, what can be considered as an enabling technology for consumer and wearable applications may pose some risk if used in critical applications such as automotive, safety, medical or industrial sector, that are also in need for continuous miniaturization.

tutorial and topic introduction is discussed in EPCI post here

  • Panelists: Valeo, AVX, Kemet, Murata, Continental (TBC)

Technical Papers:


1.1. A Disruptive Nano-laminate Polymer Capacitor Technology for Electric Drive Applications; Angelo Yializis; POlyCharge America Inc; United States
1.2. Integrated and discrete capacitors based on carbon nanostructures with capacitance densities in excess of 200 nF/mm2; Vincent Desmaris; Smoltek AB; Sweden
1.3. Advances in Film Resistor Technology; Stephen Oxley; TT Electronics; United Kingdom


2.1. Energy Harvesting is not Fiction anymore; Lorandt Fölkel; Würth Elektronik eiSos; Germany
2.2. Analysis of Multi-Layer Ceramic Capacitors used in Power Distribution Networks; Continental; Romania
2.3. Guidelines How to Downsize MLCCs Efficiently; Ruediger Scheel; Murata; Germany
2.4. Capacitor Trends and Challenges; Martin Barta; TTI; Germany


3.1. COTS procurement for space mission; Denis Lacombe; ESA ESTEC; Netherlands
Most Reliable, Most Efficient and Price Effective Solid Tantalum Capacitors; Yuri Freeman; Kemet; United States
3.2. Real Environment Aluminium Electrolytic Capacitor LifeTime Evaluation and Modelling; Luca Primavesi; ItelCond and Univeristy of Milano; Italy
3.3. Supercapacitor Degradation and Life-time; Vlasta Sedláková; Brno University of Technology; Czech Republic


4.1. High Bs ferrite material development for high power applications; JC Sun; Power Loss Tester GmbH; Germany
4.2. High efficient new Hybrid magnetic EMI filter design for Low Voltage DC distribution; Wai Keung Mo, Kasper Paasch and Thomas Ebel; Centre for Industrial Electronics, University of Southern Denmark
4.3. Conductive hybrid threads and their applications; Tomas Blecha; University of West Bohemia; Czech Republic
4.4. Tin Whisker or not Whisker; Jean Edmond Le Calvé; Valeo; France
4.5. Stable and reliable tantalum supply chain; Roland Chavasse; T.I.C.; Belgium


5.1. Degradation of Polymer Tantalum Capacitors during High Temperature Storage; Alexander Teverovsky; NASA/GSFC; United States
5.2. Investigation and Experimental Comparison of Magnetic Core Loss for High-Saturation Ferrite Material; Chang Wang; TU of Denmark;Denmark
5.3. Evaluation of Active Balancing Circuits for Supercapacitors; Politehnica University of Bucharest, Romania


click on the image below to link to the PCNS Web App or here.

attendees will get access to PCNS mobile app to have all symposium info and directions in palm of their hands for easy networking.