source: AVX news
FOUNTAIN INN, S.C. (October 26, 2016) – AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released a new series of low profile, low pass filters with best-in-class performance.
Based on AVX’s patented and proven multilayer organic (MLO®) high density interconnect technology, the new LP Series MLO low pass filters utilize a combination of high dielectric constant and low-loss materials to enable the fabrication of multilayer, stacked passive devices, such as inductors and capacitors, with high volumetric efficiency, high Q, and exceptional electrical performance. Designed to support both a wide frequency range (0.4GHz – 6.5GHz) and several wireless standards, LP Series low pass filters feature an ultralow 0.55mm height profile, and exhibit excellent isolation, low insertion loss (≤1.3dB), low parasitics, and 50Ω impedance, making them ideal for use in a variety of wireless applications, including: mobile communication devices, global positioning systems (GPS), vehicle location systems, wireless LANs, satellite receivers, and instrumentation.
“Passives like our new LP Series MLO low pass filters provide wireless design engineers with critical enabling technology for satisfying sustained market demands for smaller, more capable wireless electronics,” said Larry Eisenberger, principal technical marketing engineer at AVX. “With LP Series filters, designers can achieve lower insertion loss, better attenuation, and better heat dissipation than they could with equivalent LTCC products.”
Featuring land grid array surface-mount packaging that’s expansion-matched to most organic PCB materials, AVX’s new LP Series MLO low pass filters also deliver improved reliability over standard silicon and ceramic devices, including low-temperature co-fired ceramic (LTCC) devices, which can also be used to realize multilayer stacked passives.
RoHS compliant and lead-free compatible, LP Series filters are currently available in four footprints with varying lengths (6.57mm, 7.38mm, 8.67mm, and 10.19mm, ±0.10mm) and fixed widths and heights (3.97mm and 0.55mm, ±0.10mm, respectively), and are supplied with gold terminations that are compatible with automatic soldering technologies including: reflow, wave soldering, vapor phase, and manual. The series is rated for operating temperatures spanning -55°C to +85°C, is 100% tested for electrical parameters, and can be shipped in waffle or bulk packaging. Lead-time for the series is currently 12 weeks.