source: EPCI
An overview presentation summarising current capacitor technologies state of the art and key application trends was presented by EPCI at IMAPS flash conference in Brno, Czech Republic on November 4th, 2016. The related paper “Capacitor Trends in Modern Electronics” is available now at the EPCI page for download.
The IMAPS flash conference in Brno on November 3-4th, 2016 was organized by a local IMAPS CZ & SK (Czech and Slovak IMAPS chapter) in cooperation with FEEC Brno University of Technology, CEITEC and DPS journal. The conference thematically focused on areas related to Microelectronics assembly, Packaging & 3D structures, Soldering & Chip attachment, Simulation & Testing, Sensors & Nanostructures and EEE Components.
The passive components were represented by Tomas Zednicek, Ph.D., EPCI president who provided an overview of the capacitor technologies and some latest application trends.
“The passive component technology has been often considered as the “easy and not so important” part of the electronic circuits while the main attention is paid to the development of active components and integrated circuits. The development of passives was mostly left in hands of industrial profit oriented companies with limited chance to heavily invest in an expensive fundamental research. Nevertheless, the complexity of passive component technologies is not trivial as it can be seen on the first moment. Features of capacitors, as the case study example, is often dependent to interfaces between the conductive metal electrodes and insulating dielectric layers. The junction, often consisting of metal sub-oxide layers with semiconducting properties, may however play a key role in the capacitor characteristic behaviour. The paper provides an overview and trends on passive component industry and specifically capacitor technologies.” is written as an introduction of the related paper.
The paper “Capacitor Trends in Modern Applications” is available at EPCI download page here.
The local IMAPS Cz & Sk chapter website (in Czech language) can be found here.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.
Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.
IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. www.imapseurope.org contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The IMAPS European chapters organize national and international seminars, workshops and conferences.
European IMAPS website can be find here.
