Source: Kemet video
Do you ever have trouble getting accurate MLCC class II X5R, X7R … capacitance measurements from your LCR? Kemet Electronics on their YouTube video is showing some key settings of LCR meter to measure MLCC capacitors accurately. (more…)
Source: Electrical Integrity article
Following EPCI initiative on MLCC BIAS issues investigation that is discussed during the PCNS 2019 symposium here, EPCI is pleased to get author’s permission to publish a paper written by Istvan Novak and col. about a real measurement on MLCC DC BIAS effect. Istvan Novak and his team in this paper measured characteristics on several different MLCC devices and compared their performance, including the effect of temperature. It will also be shown how the same nominal part from different vendors may behave very differently and also how some X7R capacitors may behave the same or even worse than X5R parts. The impact of measurement conditions, for instance preconditioning and/or dwell time, will be considered as well.
Original paper published at DesignCon East 2011 conference can be downloaded in pdf from Electrical Integrity web page here.
Source: EDN blog
by Kenneth Wyatt, president and principal consultant of Wyatt Technical Services.
The development of stealth aircraft brought about the use of ferrite absorber sheets, which have proven useful for damping cavity resonances at microwave frequencies. Since then, ferrite absorber sheets have become useful at mitigating EMI. Most absorber sheets act as magnetic shields that help “redirect” magnetic fields and become effective at gigahertz frequencies. As my measurements show, some are effective even at much lower frequencies, serving as shielding or absorbers for high-frequency EMI from clock harmonics in the hundreds of megahertz. (more…)
Source: Alter Technology blog
Assembled PCB is metallographic prepared in ALTER TECHNOLOGY Materials & Processes Laboratory, recognized as a recommended facility for such activity by ESA authority (MEMO ESA-TECMSP-MO-013165). (more…)
Source: Alter Technology article
Scanning acoustic microscopy (SAM) is used to locate the paths for water ingress in plastic encapsulated microelectronic systems. This is so thanks to the capability to analyze hidden delamination on surface-breaking parts. (more…)
Source: Alter Technology news
New space missions include more extreme requirements of storage, operational temperatures, and vacuum conditions, and all this testing can be done in our laboratories at Alter Technology. (more…)
Source: Alter Technology article
by Francisco Javier Aparicio Rebollo, Senior materials and Test Engineer at Alter Technology.
X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. (more…)
Source: Alter Technology article
by María Teresa Rodríguez.
Vibration tests are important to check the reliability of the components/assemblies. These tests can be a headache and suppose a great cost if the design of the device and the fixing tool are not properly done. Simulation tools are the key to anticipate the problems reducing costs and lead times and doEEEt gives you access, in just one site, to components and specifications from different systems and space agencies (more…)
Source: Alter Technology article
by Francisco Javier Aparicio Rebollo. Thermoreflectance Thermal Imaging is a powerful tool as a thermal characterization technique for microelectronics and discrete components. (more…)
EPCI licenced content by:
[1] EPCI European Passive Components Institute experts original articles
[2] CLR Passive Components Handbook by P-O.Fagerholt*
*used under EPCI copyright from CTI Corporation, USA
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