Source: AVX news
The new VLAS Series Low-Clamp TransGuard® Automotive MLVs provide high-reliability bidirectional overvoltage protection & broadband EMI/RFI filtering in a single, space-saving SMT device qualified to AEC-Q200 & capable of replacing much larger, two-component TVS diode & EMC capacitor solutions. (more…)
Source: Smoltek news and press release
At the beginning of September 2019 Smoltek team presented at PCNS conference their achievement of 350nF/mm2 capacitance density by their carbon nano-fiber metal-insulator-metal (CNF-MIM) technology. The company announce recently double of the capacitance density to +650nF/mm2 again. (more…)
Source: Yageo news
Yageo Corporation has just introduced the automotive grade NPO, named X8G, with maximum working temperature up to 150°C. The first released range covers 0805 1nF ~ 10nF with 100V rated voltage, later this range will be extended to 0603 and 0402. It means Yageo has both automotive grade X8R and X8G with 150°C working temperature. (more…)
Source: FT CAP news
A special stepped base, in combination with a Sil-Pad, ensures optimal thermal dissipation in the capacitors of the GW series. The use of a ring clamp allows virtually seamless mounting of the capacitors on a heat sink. (more…)
Source: Kemet news
FORT LAUDERDALE, — KEMET Corporation, a leading global supplier of electronic components, has announced a complete capacitance and voltage offering for the KC-LINK™ ceramic surface mount capacitors in the EIA 3640 case size. (more…)
Source: Panasonic news
Panasonic is releasing new GY series of its SMD conductive polymer aluminum electrolytic capacitors featuring super low ESR. (more…)
Source: Panasonic news
Panasonic is releasing new EZPV series of metallized polypropylene segmented film capacitors for industrial and automotive use. (more…)
Source: Murata news
Murata has announced a new transformer technology for high power, high frequency applications that uses a novel winding technique to allow designers to efficiently reach power and frequency levels that were never possible with conventional winding methods. (more…)
Source: EPCI e-Symposium PCNS paper
by: R. Andersson, M. Bylund, S. Krause, A. M. Saleem and V. Desmaris; Smoltek AB, Gothenburg, Sweden
presented by S.Krause at the 2nd PCNS 10-13th September 2019, Bucharest, Romania as paper 1.2.
Complete on-chip fully solid-state 3D integrated capacitors using vertically aligned carbon nanofibers as electrodes to provide a large 3D surface in a MIM configuration have been manufactured and characterized. The capacitance per device footprint area has been studied, as well as its behavior at different temperatures and frequencies. Equivalent series resistance (ESR), breakdown voltage and leakage current have also been measured. The entire manufacturing process of the capacitors is completely CMOS compatible, and in combination with the low device profile of about 4 µm this makes the devices readily available for integration on a CMOS-chip, in 3D stacking, or redistribution layers in a 2.5D interposer technology. Capacitances of ca 350 nF/mm2, ESR of about 100 mΩ, breakdown voltages of up to 25 V and leakage currents in the order of 0.004 nA/nF have been measured. (more…)
Source: KOA Europe news
For high current applications, KOA has now expanded its existing Power Shunt series by adding the PSJ2 and the PSL2. The PSJ2 (3920 inch) resistor can measure currents up to 244 A (200 μOhm). (more…)
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