Fan out of a BGA pitch 0.35mm – this is how it works!

Fan out of a BGA pitch 0.35mm – this is how it works! Würth Elektronik Webinar

Wed, May 3, 2023 11:00 AM – 12:00 PM CEST

The miniaturization of components and assembled PCBs remains an ongoing topic and often a challenge. If we look at the packaging form Ball Grid Array (BGA), for example, you can usually unbundle the footprint up to a BGA pitch of 0.8 mm with conventional BASIC technology using plated through holes (PTH).

Below that, you need laser-drilled microvias, and at a BGA pitch of 0.4 mm, advanced design requirements are already necessary. But what do you do at a BGA pitch of 0.35 mm if you cannot or are not allowed to use 25 µm structures?

Learn more in this webinar about

• suitable PCB technologies and design parameters
• solutions while maintaining the need for impedance control
• the reliability of available technologies
• the unbundling of a VFBGA component in a live demonstration.

The webinar is interesting for purchasing, developers and students. We will be happy to answer questions again in the Q&A session of the live event, which will not be included in the recording – so it’s worth joining us live.

Feel free to send us your questions in advance by email ([email protected]) or ask them live in the webinar. We look forward to hearing from you!