Wed, May 3, 2023 11:00 AM – 12:00 PM CEST
The miniaturization of components and assembled PCBs remains an ongoing topic and often a challenge. If we look at the packaging form Ball Grid Array (BGA), for example, you can usually unbundle the footprint up to a BGA pitch of 0.8 mm with conventional BASIC technology using plated through holes (PTH).
Below that, you need laser-drilled microvias, and at a BGA pitch of 0.4 mm, advanced design requirements are already necessary. But what do you do at a BGA pitch of 0.35 mm if you cannot or are not allowed to use 25 µm structures?
Learn more in this webinar about
The webinar is interesting for purchasing, developers and students. We will be happy to answer questions again in the Q&A session of the live event, which will not be included in the recording – so it’s worth joining us live.
Feel free to send us your questions in advance by email ([email protected]) or ask them live in the webinar. We look forward to hearing from you!