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PCB Production Part 4: High Density Interconnect PCBs; WE Webinar

December 7 @ 11:00 - 12:00 CET

Printed circuit board production, part 4: High Density Interconnect PCBs

We continue our series ” PCB Production” with High Density Interconnect (HDI) PCBs. Learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards.
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • Our advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

We invite you to this webinar on 07.12.2022 at 11:00 am.

Details

Date:
December 7
Time:
11:00 - 12:00 CET
Event Category:
Website:
https://attendee.gotowebinar.com/register/8319911455611397132

Venue

virtual

Organizer

Würth Elektronik
View Organizer Website