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The Future of High-Speed Interconnections
February 23 @ 14:00 - 15:00 EST
The Future of High-Speed Interconnections
There has been more attention in recent years to developing connectors able to carry the vast amount of high-speed signal and power data in electronic systems. Complex interconnection systems are now being developed to signal standards such as PAM-4.
Attend this webinar and learn:
- The current state-of-the-art in high-speed interconnections
- Some of the challenges facing future developers of interconnects
Speakers
Scott McMorrow currently serves as a Strategic Technologist at Samtec. As a consultant for years too numerous to mention, Scott has helped many companies develop high performance products, while training signal integrity engineers. Today he works for “the man,” where he continues being a problem solver, a change agent and “betting his job” every day.
Augusto Panella is Director of Interconnect Technology at Molex, a global electronics leader enabling transformative innovation across diverse industries. An electrical engineering veteran with more than 30-years of R&D experience, his knowledge of data integrity, signal integrity, power integrity, and compute architectures coupled with a system solution approach have made him a trusted source for interconnect technology for top high-performance computing companies around the world.
