Combat-Ready Interconnects: Essential Design Strategies for Tactical Gear Unlock the future of soldier-worn technology in our upcoming webinar, where we'll explore the latest advancements in design and interconnect solutions critical for modern combat. Discover essential strategies for managing power, minimizing weight, and integrating tactical gear to meet rigorous military standards and ensure peak performance in […]
Near-Field EMI Noise Suppression with 3M Solutions As electronic devices become increasingly complex, navigating the challenge of electromagnetic interference (EMI) requires precise control and innovative materials. Join Dr. Sergei Manuilov from 3M to uncover essential strategies and material insights for effective near-field EMI noise suppression, ensuring optimal performance in a high-frequency, densely packed environment. October […]
Würth Elektronik Webinar: Galvanically isolated voltage measurement made easy with digital isolators October 29, 2024 at 16:00 Interference-free data communication and personal safety are two major challenges for electronics in typical industrial environments. Strong electromagnetic fields, overvoltages, transient voltages and high EMC interference are the order of the day. The decentralised recording of physical parameters […]
Webinar: Cost-efficient flexibility: Physical PCB sample WE.bend! Wed, Nov 6, 2024 11:00 AM - 12:00 PM CET WE.flex again: Following the presentation of the two RIGID.flex samples, we are now entering the third round. Our combined WE.bend physical PCB sample shows a combination of the SEMI.flex and BEND.flex technologies and thus enables a direct comparison. […]
electronica 2024 November 12-15 World’s leading trade fair and conference for electronics Electronica in Munich is the world's leading trade fair for electronics, it covers the entire spectrum of modern electronics and offers plenty of space for professional exchange and networking with three accompanying trade conferences and its comprehensive supporting program.
Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) Instructor: Thomas Green Description: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the […]
External Visual Inspection per Mil-Std-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are […]
Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard for Smart Homes in our webinar for manufacturers! Find out how Matter improves interoperability and what framework conditions need to be considered when using it. […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing process for the production of the module or the entire electronic assembly from the PCB to the end product? True to the motto “more than […]
Space and Military Standards for Hybrids and RF Microwave Modules Instructor: Thomas Green Description: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll discuss the strategies for reducing your Bill of Materials (BoM) while enhancing Common Mode noise reduction. We will introduce a method to design compliant filters […]
