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DTSTART;TZID=America/New_York:20251219T120000
DTEND;TZID=America/New_York:20251219T140000
DTSTAMP:20260409T132744
CREATED:20250210T124135Z
LAST-MODIFIED:20251113T080720Z
UID:70084-1766145600-1766152800@passive-components.eu
SUMMARY:External Visual Inspection per MIL-STD-883 TM 2009
DESCRIPTION:External Visual Inspection per MIL-STD-883 TM 2009\nInstructor: Thomas Green \nDescription: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and the instructor explains why the defects are critical to the reliability of the end product. \nTopics include: \n\nWeld and Seal defects\nGlass and ceramic feedthrough defects e.g. meniscus cracking Package marking and pin/lead defects\nInspection Criteria for Microelectronic Packages and Covers Foreign Material Identification and Contamination Control\nReview applicable criteria in JESD 9C\nPlastic Package Defects\n\n 
URL:https://passive-components.eu/event/external-visual-inspection-per-mil-std-883-tm-2009/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251216T170000
DTEND;TZID=Europe/Prague:20251216T180000
DTSTAMP:20260409T132744
CREATED:20251208T084049Z
LAST-MODIFIED:20251208T084049Z
UID:73893-1765904400-1765908000@passive-components.eu
SUMMARY:Coaxial Connectors and How to Connect with the PCB
DESCRIPTION:Coaxial Connectors and How to Connect with the PCB\nWebinar by Würth Elektronik\nTuesday\, December 16th 2025 @ 5:00PM CET\n\n\nThis free one-hour webinar presents practical guidance for achieving low-loss connections between coaxial connectors and printed circuit boards. The session covers the most relevant parameters affecting impedance and demonstrates how these factors can influence overall performance. Methods for identifying interference points are discussed\, along with criteria for determining acceptable levels of loss in real-world applications. \n\nAttention is given to the connector characteristics that are most important for maintaining quality\, especially at high frequencies. Live simulations using CST illustrate how adjustments to the PCB layout can impact connection behavior. The presentation also outlines the design process for RF connectors\, providing a clear view of industry best practices.
URL:https://passive-components.eu/event/coaxial-connectors-and-how-to-connect-with-the-pcb/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251215T130000
DTEND;TZID=America/New_York:20251218T151500
DTSTAMP:20260409T132744
CREATED:20220909T111655Z
LAST-MODIFIED:20251113T080820Z
UID:58728-1765803600-1766070900@passive-components.eu
SUMMARY:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
DESCRIPTION:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)\nInstructor: Thomas Green \nDescription: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices. Over 250 color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of Pre Cap visual inspection and how to interpret and apply the very latest MIL-STD-883 criteria. \nThe course is intended for quality assurance personnel\, inspectors\, QEs and Process engineers\, component engineers and lead operators and others responsible for inspection of the hardware prior to the final package sealing process. \nThe following is an approximation of what will be covered in each online or “virtual” training session.  \nSession 1: Introduction and Overview \n\nMil Spec Visual Inspection Requirements Flowdown\nComponent ID\nForeign Material or F.O.D. inspection and source requirements\n\nSession 2: Component Attach \n\nTM 2017 Low mag IC/MMIC die and substrate attach inspection criteria and non-planar capacitor/resistor criteria\nSolder Criteria\n\nSession 3: Wire and Ribbon Bonding \n\nTM 2017 Low mag wire and ribbon bond inspection criteria\n\nSession 4: High Mag IC Die and MMIC Inspection and Passives \n\nTM 2010 IC High Mag Inspection criteria\nMIL-STD-750 Die level Inspection Criteria TM 2017 Table 1\nTM 2032 Passive Component inspection criteria for substrates\, capacitors\, inductors and resistors
URL:https://passive-components.eu/event/pre-cap-visual-inspection-per-mil-std-883-tm-2017/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251210T160000
DTEND;TZID=Europe/Prague:20251210T170000
DTSTAMP:20260409T132744
CREATED:20250915T083108Z
LAST-MODIFIED:20250915T083108Z
UID:72563-1765382400-1765386000@passive-components.eu
SUMMARY:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization
DESCRIPTION:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization\nWebinar by Würth Elektronik\nWednesday\, December 10th 2025 @ 4:00PM CET\n\n\nCurious about Qi2 wireless power design? Join this webinar to dive into practical development insights and EMC strategies for your next project.\n\nWhat you’ll learn:\n\n·         How to build a Qi2 wireless power transmitter from the ground up – from FET selection to control architecture.\n·         Key features of the WE Qi2 MPP Tx Coil and how to integrate it effectively.\n·         PCB layout tips to boost performance and minimize losses.\n·         How to measure and reduce conducted emissions with smart filter design.\n·         Interactive Q&A session to get your questions answered live.
URL:https://passive-components.eu/event/designing-qi2-wireless-power-systems-practical-development-and-emc-optimization/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251209T120000
DTEND;TZID=America/New_York:20251211T141500
DTSTAMP:20260409T132744
CREATED:20220909T110834Z
LAST-MODIFIED:20251113T080614Z
UID:58720-1765281600-1765462500@passive-components.eu
SUMMARY:Space and Military Standards for Hybrids and RF Microwave Modules
DESCRIPTION:Space and Military Standards for Hybrids and RF Microwave Modules\nInstructor: Thomas Green \nDescription: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class K hybrids for military and space applications. \nThe governing document is MIL-PRF-38534 Hybrid Performance Specification\, which in turn further calls out specific test methods in MIL-STD-883L Test Methods and Procedures for Microelectronic Devices. Mil 883 is a collection of destruct and non-destruct test methods used as screening and qualification tests to verify microelectronic performance requirements and to assess the reliability of finished modules. \nThe course is intended for anyone interested in gaining better insight and understanding of the quality and process control requirements for hi reliability space and military products\, specifically component and quality engineers working in this industry. \nTopics include: \nTopic 1: Overview of MIL-PRF-38534 Hybrid Performance Specification \nTopic 2: MIL-PRF-38534 General Hybrid Specification \nTopic 3: Overview of MIL-STD-883 test methods and procedures required for Space qualified Hybrids and RF MMIC Modules \nTopic 4: Group B\, C and D Periodic Inspection Test Methods Failure Analysis Tools and Techniques
URL:https://passive-components.eu/event/space-and-military-standards-for-hybrids-and-rf-microwave-modules/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251203T170000
DTEND;TZID=Europe/Prague:20251203T180000
DTSTAMP:20260409T132744
CREATED:20251128T081133Z
LAST-MODIFIED:20251128T081133Z
UID:73807-1764781200-1764784800@passive-components.eu
SUMMARY:The Hidden Secret of the Magnetic Transformer and example of its use
DESCRIPTION:The Hidden Secret of the Magnetic Transformer and example of its use\nFrenetic is hosting a special educational session with Prof. Sam Ben-Yaakov\, one of the most respected voices in magnetics and power electronics. \n\nWed\, Dec 03\n\n\n5:00 PM – 6:00 PM CET\n\n\n\n\n\n\nIn this webinar\, Prof. Ben-Yaakov will explain a fundamental — and often overlooked — property of magnetic transformers. \nYou’ll learn how this principle led to the development of a new magnetic reluctance model and even the invention of a new type of controlled inductor. \nWhat to expect: \n\nA clear explanation of this “hidden” magnetic property\nHow it connects to real transformer behavior\nHow it enables new magnetic modeling approaches\nA practical example of its use\n45–60 minutes of deep insight + Q&A\n\nIf you’re curious about what this hidden property is — and how it may change the way you think about magnetics — you don’t want to miss this session.
URL:https://passive-components.eu/event/the-hidden-secret-of-the-magnetic-transformer-and-example-of-its-use/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251202T120000
DTEND;TZID=Europe/Prague:20251204T141500
DTSTAMP:20260409T132744
CREATED:20251113T081426Z
LAST-MODIFIED:20251113T081426Z
UID:73663-1764676800-1764857700@passive-components.eu
SUMMARY:Microwave Packaging Technology
DESCRIPTION:Microwave Packaging Technology\nInstructor: Thomas Green \nDescription: Microwave Hybrids\, MICs\, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments\, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues\, material tradeoffs\, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military\, space and other hi reliability commercial and medical device applications. \nThe course is intended as an introductory to intermediate level course for process engineers\, designers\, quality engineers\, and managers responsible for design and manufacture of microwave hybrids. \n\nTopics include: \nSession 1 \n\nIntroduction to Microwave Technology\nMilitary Requirements Flow Down and Design Guidelines\nManufacturing Assembly Process Overview\nWafer Fabrication Processes\nSubstrate Technology\nThin Film Processes on Ceramic\nMaterial and Process Fundamentals for Component Attach\nEutectic Soldering Processes\n\nSession 2 \n\nDie\, substrate and package compatibility\nThermal Impedance and Importance of Minimizing Junction Temperature\nPackaging Design Considerations\nReview of Defects from the Component Attach Process\nOverview of Common Cleaning Processes and Potential Problems\nWirebonding and Interconnect Process Overview\nGap Welding\nFactors that affect yield and reliability\n\nSession 3 \n\nHermetic Packaging Process Overview\nHermeticity Testing\nNear Hermetic Packaging Options\nDesign for Manufacturability (DFM)
URL:https://passive-components.eu/event/microwave-packaging-technology/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251113T110000
DTEND;TZID=Europe/Prague:20251113T113000
DTSTAMP:20260409T132744
CREATED:20251110T082631Z
LAST-MODIFIED:20251110T082631Z
UID:73619-1763031600-1763033400@passive-components.eu
SUMMARY:DC/DC Converters in Automotive Applications
DESCRIPTION:Würth Elektronik Webinar: Bridging the Voltage Gap: DC/DC Converters in Automotive Applications\n\n\n\n\n\n\n\n\n\nThu\, Nov 13\, 2025 11:00 AM – 11:30 AM CET\n\n\n\n\n\n\n\n\nJoin us for an insightful webinar on the silent performers behind modern electrical systems: DC/DC Converters.\n\nIn this webinar\, our experts Daniel Wilder (Product Manager Function-Specific Modules) and Arnaud Wendling (Head of Application Engineering and Product Manager Electronics) explain why these components are essential for reliable power distribution in mobile machines and commercial vehicles.\nYou will learn about the basic principles of common converter types\, their functionality and features\, practical examples from commercial vehicle engineering\, and typical challenges in integration and operation. This webinar offers valuable knowledge and insights from practical experiences.\n\nAgenda:\n1. Introduction\n2. Fundamentals of vehicle electrical systems\n3. DC/DC Converters: types\, features and quality parameters\n4. Application examples & solutions\n5. Live Q&A
URL:https://passive-components.eu/event/dc-dc-converters-in-automotive-applications/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251112T120000
DTEND;TZID=America/New_York:20251113T141500
DTSTAMP:20260409T132744
CREATED:20220909T110643Z
LAST-MODIFIED:20250728T071303Z
UID:58718-1762948800-1763043300@passive-components.eu
SUMMARY:Microelectronic Packaging Failure Modes and Analysis
DESCRIPTION:VIRTUAL: Microelectronic Packaging Failure Modes and Analysis\nInstructors: Thomas Green and Robert Lowry \nDescription: \nThe design and packaging of microelectronic devices such as hybrids\, RF microwave modules\, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing\, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs. \nThe instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid\, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and\, resist the temptation to rush to judgment\, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. \nThe course is intended for FA engineers\, component engineers\, reliability engineers\, design\, quality and process engineers involved in microelectronic packaging. \nTopics include: \n\nIntroduction to Microelectronic Packaging\nTerminology and Product Definitions\nTypical Package Related Defects and Failures\nFailure Analysis (FA) Process Flow\nSpecific Examples of Package Related Failures and FA Investigation\nFailure Analysis Tools and Techniques
URL:https://passive-components.eu/event/microelectronic-packaging-failure-modes-and-analysis/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251112T110000
DTEND;TZID=Europe/Prague:20251112T120000
DTSTAMP:20260409T132744
CREATED:20251020T071645Z
LAST-MODIFIED:20251029T173433Z
UID:73279-1762945200-1762948800@passive-components.eu
SUMMARY:PCB Design: Impedance is for everyone!
DESCRIPTION:Würth Elektronik Webinar: Impedance is for everyone!\n\n\n\n\n\n\n\n\n\nWed\, Nov 12\, 2025 11:00 AM – 12:00 PM CET\n\n\n\n\n\n\n\n\nAs data rates increase\, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion\, the impedance requirements of the assembly or application must be properly considered in the PCB design. In this webinar\, we will show how an impedance-defined stackup is created based on simulation results and electrical boundary conditions – a stackup precisely matched to the required impedance. The key lies in careful design and manufacturing\, including verification through electrical measurements on test coupons when needed. Building on this foundation\, we will demonstrate how Design for Manufacturing (DfM) and tolerance management can improve production.\n\nJoin our webinar on November 12\, 2025\, at 11:00 a.m.\, and learn about:\n\nThe fundamentals of impedance and signal integrity\nHow to create an impedance-defined stackup for the technologies • BASIC • MICROVIA.hdi and • STARR.flex\nDesign for Manufacturing and tolerance considerations\nPractical tips and tricks from the field\nWhen to switch to high-speed base materials\nA look at special applications\, such as impedance in antenna structures Gain a comprehensive understanding of different PCB technologies and their specific requirements\nall from a holistic perspective: Impedance is for everyone!\n\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students.
URL:https://passive-components.eu/event/pcb-design-impedance-is-for-everyone/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251111T170000
DTEND;TZID=Europe/Prague:20251111T180000
DTSTAMP:20260409T132744
CREATED:20251029T173129Z
LAST-MODIFIED:20251029T173129Z
UID:73460-1762880400-1762884000@passive-components.eu
SUMMARY:Industrial Applications Demand More from Interconnects in Next-Gen Designs
DESCRIPTION:Industrial Applications Demand More from Interconnects in Next-Gen Designs\nby Samtec \nTuesday\, November 11\, 2025 · 5:00 p.m. CET \nNeed to specify interconnects for industrial applications like automation\, robotics\, embedded vision\, IoT\, lighting\, smart cities\, grids\, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting the most suitable rugged interconnects for your industrial products. \nTopics covered include: \n\nMechanical considerations: shock and vibration\, plating\, mechanical strength of the connector on the PCB\, secure coupling\nElectrical considerations: current carrying capacity\, designs for high-speed applications\nEnvironmental considerations: performance in harsh conditions\, design flexibility\, protection against dust and moisture\n\nSpeaker: \n\n\n\nJan Hrouda \n\nIndustry Manager for Industrial Applications\n\n\n\n\nJan Hrouda\, a native of Germany\, completed his B.S. in International Business at Aquinas College in Grand Rapids\, Michigan. After joining Samtec in 1996\, he served in various roles\, including Customer Service\, Application-Specific Engineering
URL:https://passive-components.eu/event/industrial-applications-demand-more-from-interconnects-in-next-gen-designs/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251106T143000
DTEND;TZID=Europe/Prague:20251106T160000
DTSTAMP:20260409T132744
CREATED:20250925T111037Z
LAST-MODIFIED:20250925T111037Z
UID:72716-1762439400-1762444800@passive-components.eu
SUMMARY:Self-healing polymer materials for the next generation of high-temperature power capacitors
DESCRIPTION:Self-healing polymer materials for the next generation of high-temperature power capacitors\nThursday\, 6 November 2025\, 14:30-16:00 (CET)\, M304-M307\, Alsion\, SDU Sønderborg with online join option for registered attendees. \nAbout the event\n\nPolymer-based power capacitors have long struggled with combining high temperatures with good breakdown strength and reliability. With the increasing adoption of wide-band-gap semiconductors in convertors for e-mobility\, HVDC\, etc\, there is a need for high voltage capacitors that can withstand ever higher temperatures\, without compromising on reliability or breakdown voltage. We present a new class of polymer dielectric material\, developed in collaboration between the DTU Department of Chemical and Biochemical Engineering and the SDU Centre for Industrial Electronics based on self-healing cross-linked polymer networks. These materials can self-heal at temperatures well beyond BOPP\, exhibiting increased breakdown voltages at elevated temperatures and the ability to heal post-breakdown. If implemented in converters\, these materials would result in substantial gains in energy efficiency and device lifetime. \n\n\nTo learn more\, please join us at SDU Sønderborg or online on 6 November! \n\n\n\nEvent programme\n\n\n\n14:30 Welcome to SDU (Thomas Ebel\, SDU) \n14:35 Introducing the X-linkCap project (Anders Egede Daugaard\, DTU and William Greenbank\, SDU) \n14:50 Chemistry and properties of the cross-linked polymer systems (Neha Manojkumar Mulchandani\, DTU) \n15:10 Fabrication and testing of high temperature\, self-healing capacitors (Bartosz Gackowski\, SDU) \n15:30 Summary of project and future perspectives (Anders Egede Daugaard\, DTU\, Thomas Ebel\, SDU and William Greenbank\, SDU) \n15:40 Q&A with in-person and online audience \n16:00 Refreshments for in-person attendees \n\n\n\nRegistration\n\nJoin us for the Self-Healing Polymers for Next-Gen Power Capacitors event on 6 November 2025. Participation is free\, but registration is required. \nThe Zoom link for online participants will be shared prior to the meeting. \nRegister by 30 October 2025 to secure your spot!
URL:https://passive-components.eu/event/self-healing-polymer-materials-for-the-next-generation-of-high-temperature-power-capacitors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251104T120000
DTEND;TZID=America/New_York:20251106T141500
DTSTAMP:20260409T132744
CREATED:20240812T074032Z
LAST-MODIFIED:20250728T071207Z
UID:67085-1762257600-1762438500@passive-components.eu
SUMMARY:Wirebond Materials\, Processes\, Reliability and Testing
DESCRIPTION:Wirebond Materials\, Processes\, Reliability and Testing\nInstructor: Lee Levine \nDescription: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past\, gold wire was the dominant material in use\, but in 2015 copper and palladium coated copper wire captured more than 51% of the total market. Copper provides benefits in cost\, improved conductivity\, stiffness and reliability. However\, it is significantly harder than gold and achieving a robust\, reliable process is more challenging.\nWith the high productivity and growth rate of wire bonding\, it is one of the most reliable manufacturing processes. Achieving high yields requires rigorous attention to details and excellent statistical process control. Wire bonding high-volume lead-frames often generates defect rates below 10ppm\, this presents a significant barrier to entry for any process competitor\, but copper is meeting the challenge in high-volume manufacturing. \nThis course is intended for wire bond process engineers\, technicians\, quality control engineers and managers. \n\nThe course will cover: \nIntroduction \n\nA snapshot of some microelectronic packages\nSize of the market\nCost of a wire bond\n\nUltrasonic Welding \n\nHow ultrasonics effects a materials deformation\nThe principal ultrasonic welding parameters\nDiffusion\n\nIntermetallics and Intermetallic Failures- Gold and Copper \n\nFormation of intermetallic alloys\nDiffusion transformations during the life and death of a bond\n\nCopper wire bonding \n\nEffects of bonding parameters\nGetting started with copper ball bonding\n\nWire\nWedge bond vs ball bond parameters and comparison\nBall Bumping
URL:https://passive-components.eu/event/wirebond-materials-processes-reliability-and-testing-2/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251104T100000
DTEND;TZID=America/Los_Angeles:20251104T110000
DTSTAMP:20260409T132744
CREATED:20251023T133559Z
LAST-MODIFIED:20251023T133559Z
UID:73435-1762250400-1762254000@passive-components.eu
SUMMARY:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
DESCRIPTION:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools\nNovember 4\, 2025 | 10:00 AM PST\n\n\n\n\nThis webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced stability analysis using the WS-probe in Keysight Technologies’ Advanced Design System software. \nDesigning stable circuits is becoming harder as communication systems evolve. Instability derives from a combination of gain and feedback. Higher-frequency systems demand faster devices (more gain)\, while advanced functionality calls for tighter integration (more feedback). In this evolving landscape\, traditional techniques are no longer sufficient. But the sheer number of alternative approaches and their perceived complexity leave them unused by many designers. This talk aims to demystify instability so you can design circuits that are actually amplifiers (not oscillators) from the start. We’ll walk through the root causes of instability and the shortcomings of popular RF and Microwave stability analysis techniques. Then\, we’ll revisit prior fundamental work to provide\, through examples\, a simple\, reliable process for rigorous stability analysis—enabled by the new WS-Probe simulation tool. \nWho should attend this webinar? This Electronic Design Automation (EDA) webinar is ideal for RF and microwave engineers or anyone looking to gain a deeper understanding of amplifier stability and high-frequency circuit design.
URL:https://passive-components.eu/event/design-and-stability-analysis-of-gan-power-amplifiers-using-advanced-simulation-tools/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251030T110000
DTEND;TZID=Europe/Prague:20251030T120000
DTSTAMP:20260409T132744
CREATED:20251016T065521Z
LAST-MODIFIED:20251016T065521Z
UID:73206-1761822000-1761825600@passive-components.eu
SUMMARY:Space Ceramic Capacitors with Flexible Testing
DESCRIPTION:Space Ceramic Capacitors with Flexible Testing\nThursday\, 30. 10. 2025\, 11:00 – 12:00 CET \nSRT-Microcéramique ceramic capacitor manufacturer benefits from extensive experience in the high-reliability sector\, supplying components to leading customers in the Defense\, Medical\, and Industrial markets\, thanks to our fully integrated PME manufacturing process and in-house testing capabilities. \nThis webinar will present the technical aspects of choosing ceramic capacitors for space applications\, highlight SRT-Microcéramique’s offering and approach\, and explain how it compares and differs from current market proposals. We will also cover how to best procure and order selected components through the ALTER DoEEt listing\, as well as how to contact the SRT engineering team for special designs
URL:https://passive-components.eu/event/space-ceramic-capacitors-with-flexible-testing/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251028T080000
DTEND;TZID=Europe/Prague:20251028T150000
DTSTAMP:20260409T132744
CREATED:20250818T105942Z
LAST-MODIFIED:20250818T105942Z
UID:72394-1761638400-1761663600@passive-components.eu
SUMMARY:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit
DESCRIPTION:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit\nWebinar Presented by Würth Elektronik & Texas Instruments\nTuesday\, October 28th 2025 @ 3:00PM CET\n\nIn this webinar\, we explore the market trends driving the need for compact\, efficient isolated power solutions and how the SN6507 helps address them. We’ll discuss real-world applications\, walk through the benefits of the SN6507\, and introduce a co-developed development kit built to accelerate your design process. \nYou’ll also learn how Würth Elektronik engineered a full line of transformers optimized for this solution (WE-PPTI) and how to select the right one for your needs. Join us for the live presentation to gain practical insights\, ask your questions\, and see how this collaboration helps you design faster and smarter.
URL:https://passive-components.eu/event/power-up-your-design-sn6507-and-the-ready-to-use-development-kit/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251021T120000
DTEND;TZID=America/New_York:20251023T141500
DTSTAMP:20260409T132744
CREATED:20240803T070206Z
LAST-MODIFIED:20251113T080424Z
UID:67288-1761048000-1761228900@passive-components.eu
SUMMARY:Design and Test of Non-Hermetic Microelectronics
DESCRIPTION:Design and Test of Non-Hermetic Microelectronics\nInstructors: Thomas Green and Robert Lowry \nDescription: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals\, ceramics\, and glasses) require a different approach from a design\, production\, testing\, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law of diffusion and the interaction of moisture and other gases with the plastic package\, with or without a cavity\, is of primary importance. \nThis course begins with a brief overview of hermetic packaging and associated testing methods that have been developed over the years\, some of which are applicable to cavity style non-hermetic enclosures. Then the focus is primarily on the materials used to build non-hermetic packages and the variety of testing methods available to evaluate the non-hermetic package. A review of the techniques and methods to evaluate a “non-hermetic” approach is discussed with a special emphasis on cleaning of the device prior to encapsulation and alternate test methods to evaluate reliability. \nThe course is intended for process engineers\, designers\, quality engineers\, and managers responsible for design\, test and production of cavity and non-cavity style non-hermetic packages intended for use in high reliability military and Class 3 medical implants. \n\nTopics include: \n\nWhat is “hermeticity” and how to test for it (brief overview)\nHow it is different from “non-hermetic” packaging and test\nNon-hermetic Materials and Processes\n\nFick’s law fo diffusion\nThin films and coatings e.g. ALD and Parylene-C\nPEEK\, LCP\, Kapton\, Silicones thick coatings and potting compounds\n\n\nImportance of Surface Cleanliness\n\nHow to evaluate surface cleanliness\n\n\nCoating material evaluation and effectiveness\n\nAdhesion\, pinholes\, cracks\n\n\nNon- Hermetic Packaging and Testing\n\nWVTR\,  IPC-CC-830\nMoisture uptake (absorption) by materials TGA/TML\, WVR\n\n\nTest methods applicable to non-hermetics\n\nA Critical Review of Waterproof Testing Standards IP 67/68\nTM 5011 and NASA outgassing Specs\nRGA for non-hermetic cavities\nMoisture sensors\n\n\nQualification test methods and standards\n\nMil grade Non-hermetic qual standards…e.g. Class Y\nJEDEC STANDARDS…EIA STANDARDS SSB-1
URL:https://passive-components.eu/event/design-and-test-of-non-hermetic-microelectronics/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251024
DTSTAMP:20260409T132744
CREATED:20250902T074110Z
LAST-MODIFIED:20250902T074110Z
UID:72480-1760918400-1761263999@passive-components.eu
SUMMARY:Digital WE Days 2025 - Virtual Conference
DESCRIPTION:Digital WE Days 2025 – Virtual Conference\nOctober 20 – 23\, 2025\nWhat are the Digital WE Days? \nIt’s a digital event with a comprehensive conference programme with practice-oriented presentations for you to enjoy. All presentations are live and totally free. \nClick here for the FAQs.
URL:https://passive-components.eu/event/digital-we-days-2025-virtual-conference/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251015T200000
DTEND;TZID=Europe/Prague:20251015T203000
DTSTAMP:20260409T132744
CREATED:20251014T070248Z
LAST-MODIFIED:20251014T070248Z
UID:73062-1760558400-1760560200@passive-components.eu
SUMMARY:Planar Design & Simulation
DESCRIPTION:Planar Design & Simulation – New tool reveal\nIn this Frenetic session leaded by our CEO Chema Molina and Jonas Müehlethaler\, CTO at Frenetic\, we will unveil our new Planar Design and Simulation tool\, showing how you can design\, specify\, and simulate planar magnetics directly in just minutes. \n\nWed\, Oct 15\n\n\n8:00 PM – 8:30 PM CET
URL:https://passive-components.eu/event/planar-design-simulation/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251014T160000
DTEND;TZID=Europe/Prague:20251014T170000
DTSTAMP:20260409T132744
CREATED:20250923T083357Z
LAST-MODIFIED:20250923T083357Z
UID:72652-1760457600-1760461200@passive-components.eu
SUMMARY:Smart Sensors\, Smarter AI: Building Reliable Edge Systems
DESCRIPTION:Smart Sensors\, Smarter AI: Building Reliable Edge Systems\, Würth Elektronik Webinar\nTuesday\, October 14th 2025 @ 4:00PM CEST \nAs the demand for Edge AI deployments continues to grow\, ensuring the reliability and performance of these systems is more crucial than ever. In this webinar\, we’ll explore the intersection of Edge AI processing and electromagnetic compatibility (EMC) / electromagnetic interference (EMI) testing. We’ll delve into the world of 10BASE-T1L with PoDL transmission\, sensor board design\, and practical EMC/EMI challenges faced during laboratory testing. Learn how to overcome these obstacles and deploy robust\, high-performing Edge AI systems that drive real-world results. \nSpeakers \nThomas Mauer\nSystem Engineer\nThomas Mauer is a System Engineer with Texas Instruments in Germany.\n\nOctavian Stroe\nProduct Definition Engineer\nAs a Product Definition Engineer at Würth Elektronik\, Octavian is a multidisciplinary engineer with deep expertise in sound engineering\, audio electronics\, and mechanical design. He holds a degree in Sound Engineering with a specialization in audio electronics from the University of Huddersfield and a master’s degree with a focus on optical compression.
URL:https://passive-components.eu/event/smart-sensors-smarter-ai-building-reliable-edge-systems/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251008T110000
DTEND;TZID=Europe/Prague:20251008T120000
DTSTAMP:20260409T132744
CREATED:20250923T083020Z
LAST-MODIFIED:20250923T083020Z
UID:72650-1759921200-1759924800@passive-components.eu
SUMMARY:PCB Online Shop – simply “Made in Germany” by Würth Elektronik
DESCRIPTION:PCB Online Shop – simply “Made in Germany” by Würth Elektronik\n  \n  \nWed\, Oct 8\, 2025 11:00 AM – 12:00 PM CEST \nDo you know this situation? It’s late at night; the PCB layout is finally finished – but the project is already behind schedule. The trade fair with the product launch is coming up\, and prototypes are needed as quickly as possible. Now every hour counts: order easily\, have it manufactured securely\, get it delivered fast. This is exactly where the WEdirekt Online Shop from Würth Elektronik comes in. In our webinar\, we’ll show you live how to order prototypes and small series without detours – from data upload to the express option. \nLook forward to our webinar with: \n\nInsights into the ordering proces – demonstrated live\nTips on how prototypes can seamlessly transition into series production\nAnswers to your questions: our German service team is there for you\nA first glimpse of how API integration will make ordering even easier in the future\nPlus: discover new possibilities we are currently preparing and how you as a developer\, university\, or company can benefit from them\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students. \n  \n 
URL:https://passive-components.eu/event/pcb-online-shop-simply-made-in-germany-by-wurth-elektronik/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20250930T120000
DTEND;TZID=America/New_York:20251002T140000
DTSTAMP:20260409T132744
CREATED:20220909T111849Z
LAST-MODIFIED:20250728T071547Z
UID:58730-1759233600-1759413600@passive-components.eu
SUMMARY:MIL-Std-883 TM 2010
DESCRIPTION:MIL-STD-883 TM 2010\nInstructor: Thomas Green \nDescription: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual inspection is a flow down requirement from Mil-Prf-38535. The primary focus of this session will be on the “low mag” visual requirements for component attach and wire bond\, which differ from the TM 2017 hybrid visual inspection criteria. TM 2010 also contains additional die attach and wire bond requirements not addressed in TM 2017. We will also briefly review the high mag inspection requirements for ICs and MMICs with a special emphasis on Class S products. \nTopics include: \n\nMil-Prf-38535 Integrated Circuit (Microcircuits) General Spec flow down\nrequirements for visual inspection\nLow Mag Criteria (30-60X)\nDie Attach(eutectic and non-eutectic criteria)\nWirebond General (gold ball\, wedge\, and tailless)\nRebonding of monolithic devices.\nFlip chip solder bump die (para 3.2.1.6)\nForeign material (para. 3.2.5)\nForeign Material Die Coated devices (para 3.2.5.1)\nHigh Mag Criteria (special emphasis on Class S)\nPara 3.1.1-3.4 High Mag IC and MMIC Inspection\nPara. 3.1.6. Film resistors\nPara 3.1.7 Laser trimmed thin film resistors\nFlip Chip Defects Scribe and Edge Cracks\nClass Review with Q&A
URL:https://passive-components.eu/event/mil-std-883-tm-2010/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250916T200000
DTEND;TZID=Europe/Prague:20250916T210000
DTSTAMP:20260409T132744
CREATED:20250916T070117Z
LAST-MODIFIED:20250916T070117Z
UID:72573-1758052800-1758056400@passive-components.eu
SUMMARY:Reduce SMT Parasitic Design Failures with Innovative Filter Topologies
DESCRIPTION:Reduce SMT Parasitic Design Failures with Innovative Filter Topologies\n\nThis webinar explores strategies for optimizing SMT filter designs\, addressing spurious responses\, parasitic behaviors\, and PCB layout challenges using Cadence’s Microwave Office and Modelithics simulation models to ensure accurate and reliable performance. \n\n\n\nSeptember 16\, 8:00 PM — 9:00 PM CEST \n\n\n\n\n\nJoin our webinar to discover challenges and optimization strategies for designing reliable and efficient filters using SMT capacitors and inductors. A lumped prototype is monotonic in the stopbands\, while an SMT filter may have spurious responses\, which can be affected by topology changes and capacitor placement. Additionally\, simple S-parameter representations do not account for variations in parasitic behavior due to substrate thickness\, dielectric constant\, and solder pad dimensions. Ultimately\, PCB layout parasitics can lead to significant differences between simulations based on lumped prototype values and final measured results based on actual SMT component values\, leading to potential product delays and/or system failure. \n  \nLearn how to manage and modify spurious performances effectively through innovative SMT filter topologies. Gain insights into how PCB layout contributes to parasitic behaviors that affect your SMT component values. Understand how to enhance your design’s performance with Cadence’s Microwave Office software and highly accurate Modelithics simulation models\, ensuring your designs are right the first time. \n\n\n\n\n\n\n\n\n\nSpeakers \n\nDavid Vye\, Product Management Director\, Cadence \nDan Swanson\, Owner\, DGS Associates\, LLC \nChris DeMartino\, Applications Engineer\, Modelithics
URL:https://passive-components.eu/event/reduce-smt-parasitic-design-failures-with-innovative-filter-topologies/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250916T170000
DTEND;TZID=Europe/Prague:20250916T180000
DTSTAMP:20260409T132744
CREATED:20250818T105706Z
LAST-MODIFIED:20250818T105706Z
UID:72392-1758042000-1758045600@passive-components.eu
SUMMARY:EMI Shielding Challenges
DESCRIPTION:EMI Shielding Challenges\nWebinar by Würth Elektronik\nTuesday\, September 16th 2025 @ 5:00PM CEST\n\nExplore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics. This webinar will dig into practical strategies in housing and PCB for mitigating EMI challenges\, never losing sight of solutions for emerging technologies like 5G\, IoT\, Industry IoT\, etc.\, and the challenge they bring to Electromagnetic Compatibility.
URL:https://passive-components.eu/event/emi-shielding-challenges/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250903T153000
DTEND;TZID=Europe/Prague:20250903T173000
DTSTAMP:20260409T132744
CREATED:20250815T082948Z
LAST-MODIFIED:20250815T082948Z
UID:72385-1756913400-1756920600@passive-components.eu
SUMMARY:How to Choose Your Magnetic Supplier
DESCRIPTION:How to Choose Your Magnetic Supplier\n\nWed 03. 9.\n\n\n15:30 – 17:30 CEST\n\nChoosing the right magnetic supplier can define the success — or failure — of your project. \nIn this special 2-hour webinar\, we’ll bring together three perspectives from across the industry: \n\nSupplier selection & production insights: How to go from engineering requirements to mass production\, balancing cost\, regulatory compliance\, environmental footprint\, and supply chain risks.\nAdvanced magnetic materials expertise: Strategies for selecting soft magnetic materials in transformers\, inductors\, and filters for high-performance power electronics.\nReal-world manufacturer’s case study: See how a manufacturer used Frenetic Magnetic Simulator to design a component\, and how that design is now offered to the market.\n\nSpeakers: \n\nRafael Jiménez\, Systems Chief Engineer Electrification Expert\nFlorian Fenske & Jan Wanior from MB Electronics\nMagnetics Manufacturer\, leader in the industry (TBD)\n\nModerator: Dr. Chema Molina (CEO\, Frenetic)
URL:https://passive-components.eu/event/how-to-choose-your-magnetic-supplier/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250827T170000
DTEND;TZID=Europe/Prague:20250827T180000
DTSTAMP:20260409T132744
CREATED:20250815T075726Z
LAST-MODIFIED:20250815T075726Z
UID:72383-1756314000-1756317600@passive-components.eu
SUMMARY:Capacitor Assemblies for High-Power Circuit Designs
DESCRIPTION:Capacitor Assemblies for High-Power Circuit Designs\nDate: August 27\, 2025\nTime: 11 AM EDT (8 AM PDT / 5:00 PM CEST)\n\n\n\nAttendees will learn how Knowles’ RF capacitor assemblies deliver superior performance in high-frequency and high-power circuit designs through optimal low-loss\, high-Q ceramic materials and innovative assembly configurations. Real-world examples and case studies will show how engineers can address common design challenges\, and surviving harsh environments\, by leveraging Knowles’ expertise and vertically-integrated solutions \n\nThis webinar will showcase how Knowles’ RF capacitor assemblies redefine what’s possible in RF and high-power electronics by combining advanced ceramic dielectrics\, precision stacking technology\, and vertical integration within manufacturing. Attendees will explore design strategies for improving circuit efficiency\, EMI suppression\, and energy density using Knowles’ broad portfolio\, including High Q RF Capacitor assemblies. The session will break down technical specifications\, selection criteria\, and real-world application examples. Participants will also discover how Knowles’ ability to customize mechanical and electrical attributes can solve specific engineering problems—delivering greater reliability and regulatory peace of mind. By joining\, attendees can hear directly from application experts and come away with practical tools and insights to enhance performance\, accelerate product development\, and differentiate in competitive markets. \n\n\nKey Takeaways\n\nUnderstand the critical performance parameters that make RF capacitor assemblies a preferred choice for demanding applications in aerospace\, industrial\, and medtech sectors.\nGain insight into customizable solutions—such as tailored stack sizes\, voltage ratings\, and mechanical formats—enabling optimized designs for board space constraints and harsh operating conditions.\nLearn how collaborating with Knowles’ application engineers leads to accelerated prototyping\, reduced risk of field failure\, and streamlined paths to regulatory compliance and high-reliability deployments.\n\n\n\nSpeaker\nMatt Ellis\, Senior Director of Product Line Management\, HIREL\, Knowles
URL:https://passive-components.eu/event/capacitor-assemblies-for-high-power-circuit-designs/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250820T160000
DTEND;TZID=Europe/Prague:20250820T163000
DTSTAMP:20260409T132744
CREATED:20250819T145002Z
LAST-MODIFIED:20250819T145002Z
UID:72412-1755705600-1755707400@passive-components.eu
SUMMARY:Pulse transformer design for RLC loads
DESCRIPTION:Pulse transformer design for RLC loads\n\nWed 20. 8.\n\n\n16:00 – 16:30 CET\n\noin this session on a pulse driving applications. An RLC load can be anything really\, like a gate driving scheme\, a Butterworth-Van Dyke transducer model\, maybe parasitic inductances that form an RLC network and so on. Transformer power losses modeling is key to the ‘R’ element of these circuits. \nSpeaker: Sotiris Zorbas\, Power Electronics Design Engineer expert at Frenetic
URL:https://passive-components.eu/event/pulse-transformer-design-for-rlc-loads/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250730T190000
DTEND;TZID=Europe/Prague:20250730T193000
DTSTAMP:20260409T132744
CREATED:20250728T120901Z
LAST-MODIFIED:20250728T120901Z
UID:72175-1753902000-1753903800@passive-components.eu
SUMMARY:Dimension constrains in 500W PSFB Transformer Design
DESCRIPTION:Dimension constrains in 500W PSFB Transformer Design\n\nWed\, Jul 30\n\n\n7:00 PM – 7:30 PM GMT+2\n\nDiscover the mechanical\, magnetic\, and electrical limitations engineers face when miniaturizing a high-efficiency converter.\n\nSpeaker: Dr. Chema Molina – CEO @ Frenetic
URL:https://passive-components.eu/event/dimension-constrains-in-500w-psfb-transformer-design/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250729T160000
DTEND;TZID=Europe/Prague:20250729T170000
DTSTAMP:20260409T132744
CREATED:20250701T112223Z
LAST-MODIFIED:20250701T112223Z
UID:71945-1753804800-1753808400@passive-components.eu
SUMMARY:Impact of Elevated Voltage and Temperature on Molded Power Inductors in DC/DC converters
DESCRIPTION:Impact of Elevated Voltage and Temperature on Molded Power Inductors in DC/DC converters\nWebinar by Würth Elektronik\nTuesday\, July 29th 2025 @ 4:00PM CEST\n\n\nFor DC/DC converter applications molded inductors enable smaller footprints and lower profile due to the properties of the magnetic material. This allow the inductors to be used in more harsh environments. The higher electrical and thermal stresses over time can lead to an increase in magnetic core loss due to the degradation of the insulation between magnetic particles. \n\nWürth Elektronik defines this degradation as a percolation phenomenon. But what exactly is percolation and what are its repercussions? And more importantly\, how does it affect the long-term performance of a DC/DC converter?
URL:https://passive-components.eu/event/impact-of-elevated-voltage-and-temperature-on-molded-power-inductors-in-dc-dc-converters/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250723T170000
DTEND;TZID=Europe/Prague:20250723T174000
DTSTAMP:20260409T132744
CREATED:20250722T141107Z
LAST-MODIFIED:20250722T141107Z
UID:72090-1753290000-1753292400@passive-components.eu
SUMMARY:Could Piezoelectric Devices replace Magnetics in Power Converters?
DESCRIPTION:Could Piezoelectric Devices replace Magnetics in Power Converters?\n\nWed\, Jul 23\n\n\n5:00 PM – 5:40 PM GMT+2\n\n\n\nIn applications from consumer electronics to transportation\, compact and lightweight systems are essential.  As power converter designs move higher in switching frequency to achieve smaller form factors and meet this goal\, magnetics often constrain converter efficiency and miniaturization. Piezoelectric devices offer a promising alternative to inductors and transformers\, exhibiting higher power density\, smaller form factors\, and greater efficiency at high frequency. \nThis talk will offer:  \n\nAn introduction to piezoelectric power converters\nTouching on piezoelectric device design and fabrication\nConverter topologies\nDevice nonidealities\nFuture avenues\nQ&A at the end\n\nSpeakers: \nHeather Chang and Clarissa Daniel are PhD candidates in electrical engineering at Stanford University.  They both conduct research under Professor Juan Rivas-Davila in the Stanford University Power Electronics Research (SUPER) lab on piezoelectric power converters.
URL:https://passive-components.eu/event/could-piezoelectric-devices-replace-magnetics-in-power-converters/
LOCATION:virtual
END:VEVENT
END:VCALENDAR