BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Passive Components Blog - ECPv6.15.20//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Passive Components Blog
X-ORIGINAL-URL:https://passive-components.eu
X-WR-CALDESC:Events for Passive Components Blog
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Europe/Prague
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20240331T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20241027T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20250330T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20251026T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20260329T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20261025T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20270328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20271031T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20240310T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20241103T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20250309T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20251102T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20260308T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20261101T060000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20240310T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20241103T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20260308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20261101T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20270314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20271107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251014T160000
DTEND;TZID=Europe/Prague:20251014T170000
DTSTAMP:20260409T121151
CREATED:20250923T083357Z
LAST-MODIFIED:20250923T083357Z
UID:72652-1760457600-1760461200@passive-components.eu
SUMMARY:Smart Sensors\, Smarter AI: Building Reliable Edge Systems
DESCRIPTION:Smart Sensors\, Smarter AI: Building Reliable Edge Systems\, Würth Elektronik Webinar\nTuesday\, October 14th 2025 @ 4:00PM CEST \nAs the demand for Edge AI deployments continues to grow\, ensuring the reliability and performance of these systems is more crucial than ever. In this webinar\, we’ll explore the intersection of Edge AI processing and electromagnetic compatibility (EMC) / electromagnetic interference (EMI) testing. We’ll delve into the world of 10BASE-T1L with PoDL transmission\, sensor board design\, and practical EMC/EMI challenges faced during laboratory testing. Learn how to overcome these obstacles and deploy robust\, high-performing Edge AI systems that drive real-world results. \nSpeakers \nThomas Mauer\nSystem Engineer\nThomas Mauer is a System Engineer with Texas Instruments in Germany.\n\nOctavian Stroe\nProduct Definition Engineer\nAs a Product Definition Engineer at Würth Elektronik\, Octavian is a multidisciplinary engineer with deep expertise in sound engineering\, audio electronics\, and mechanical design. He holds a degree in Sound Engineering with a specialization in audio electronics from the University of Huddersfield and a master’s degree with a focus on optical compression.
URL:https://passive-components.eu/event/smart-sensors-smarter-ai-building-reliable-edge-systems/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251015T200000
DTEND;TZID=Europe/Prague:20251015T203000
DTSTAMP:20260409T121151
CREATED:20251014T070248Z
LAST-MODIFIED:20251014T070248Z
UID:73062-1760558400-1760560200@passive-components.eu
SUMMARY:Planar Design & Simulation
DESCRIPTION:Planar Design & Simulation – New tool reveal\nIn this Frenetic session leaded by our CEO Chema Molina and Jonas Müehlethaler\, CTO at Frenetic\, we will unveil our new Planar Design and Simulation tool\, showing how you can design\, specify\, and simulate planar magnetics directly in just minutes. \n\nWed\, Oct 15\n\n\n8:00 PM – 8:30 PM CET
URL:https://passive-components.eu/event/planar-design-simulation/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251024
DTSTAMP:20260409T121151
CREATED:20250902T074110Z
LAST-MODIFIED:20250902T074110Z
UID:72480-1760918400-1761263999@passive-components.eu
SUMMARY:Digital WE Days 2025 - Virtual Conference
DESCRIPTION:Digital WE Days 2025 – Virtual Conference\nOctober 20 – 23\, 2025\nWhat are the Digital WE Days? \nIt’s a digital event with a comprehensive conference programme with practice-oriented presentations for you to enjoy. All presentations are live and totally free. \nClick here for the FAQs.
URL:https://passive-components.eu/event/digital-we-days-2025-virtual-conference/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251021T120000
DTEND;TZID=America/New_York:20251023T141500
DTSTAMP:20260409T121151
CREATED:20240803T070206Z
LAST-MODIFIED:20251113T080424Z
UID:67288-1761048000-1761228900@passive-components.eu
SUMMARY:Design and Test of Non-Hermetic Microelectronics
DESCRIPTION:Design and Test of Non-Hermetic Microelectronics\nInstructors: Thomas Green and Robert Lowry \nDescription: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals\, ceramics\, and glasses) require a different approach from a design\, production\, testing\, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law of diffusion and the interaction of moisture and other gases with the plastic package\, with or without a cavity\, is of primary importance. \nThis course begins with a brief overview of hermetic packaging and associated testing methods that have been developed over the years\, some of which are applicable to cavity style non-hermetic enclosures. Then the focus is primarily on the materials used to build non-hermetic packages and the variety of testing methods available to evaluate the non-hermetic package. A review of the techniques and methods to evaluate a “non-hermetic” approach is discussed with a special emphasis on cleaning of the device prior to encapsulation and alternate test methods to evaluate reliability. \nThe course is intended for process engineers\, designers\, quality engineers\, and managers responsible for design\, test and production of cavity and non-cavity style non-hermetic packages intended for use in high reliability military and Class 3 medical implants. \n\nTopics include: \n\nWhat is “hermeticity” and how to test for it (brief overview)\nHow it is different from “non-hermetic” packaging and test\nNon-hermetic Materials and Processes\n\nFick’s law fo diffusion\nThin films and coatings e.g. ALD and Parylene-C\nPEEK\, LCP\, Kapton\, Silicones thick coatings and potting compounds\n\n\nImportance of Surface Cleanliness\n\nHow to evaluate surface cleanliness\n\n\nCoating material evaluation and effectiveness\n\nAdhesion\, pinholes\, cracks\n\n\nNon- Hermetic Packaging and Testing\n\nWVTR\,  IPC-CC-830\nMoisture uptake (absorption) by materials TGA/TML\, WVR\n\n\nTest methods applicable to non-hermetics\n\nA Critical Review of Waterproof Testing Standards IP 67/68\nTM 5011 and NASA outgassing Specs\nRGA for non-hermetic cavities\nMoisture sensors\n\n\nQualification test methods and standards\n\nMil grade Non-hermetic qual standards…e.g. Class Y\nJEDEC STANDARDS…EIA STANDARDS SSB-1
URL:https://passive-components.eu/event/design-and-test-of-non-hermetic-microelectronics/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251028T080000
DTEND;TZID=Europe/Prague:20251028T150000
DTSTAMP:20260409T121151
CREATED:20250818T105942Z
LAST-MODIFIED:20250818T105942Z
UID:72394-1761638400-1761663600@passive-components.eu
SUMMARY:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit
DESCRIPTION:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit\nWebinar Presented by Würth Elektronik & Texas Instruments\nTuesday\, October 28th 2025 @ 3:00PM CET\n\nIn this webinar\, we explore the market trends driving the need for compact\, efficient isolated power solutions and how the SN6507 helps address them. We’ll discuss real-world applications\, walk through the benefits of the SN6507\, and introduce a co-developed development kit built to accelerate your design process. \nYou’ll also learn how Würth Elektronik engineered a full line of transformers optimized for this solution (WE-PPTI) and how to select the right one for your needs. Join us for the live presentation to gain practical insights\, ask your questions\, and see how this collaboration helps you design faster and smarter.
URL:https://passive-components.eu/event/power-up-your-design-sn6507-and-the-ready-to-use-development-kit/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251030T110000
DTEND;TZID=Europe/Prague:20251030T120000
DTSTAMP:20260409T121151
CREATED:20251016T065521Z
LAST-MODIFIED:20251016T065521Z
UID:73206-1761822000-1761825600@passive-components.eu
SUMMARY:Space Ceramic Capacitors with Flexible Testing
DESCRIPTION:Space Ceramic Capacitors with Flexible Testing\nThursday\, 30. 10. 2025\, 11:00 – 12:00 CET \nSRT-Microcéramique ceramic capacitor manufacturer benefits from extensive experience in the high-reliability sector\, supplying components to leading customers in the Defense\, Medical\, and Industrial markets\, thanks to our fully integrated PME manufacturing process and in-house testing capabilities. \nThis webinar will present the technical aspects of choosing ceramic capacitors for space applications\, highlight SRT-Microcéramique’s offering and approach\, and explain how it compares and differs from current market proposals. We will also cover how to best procure and order selected components through the ALTER DoEEt listing\, as well as how to contact the SRT engineering team for special designs
URL:https://passive-components.eu/event/space-ceramic-capacitors-with-flexible-testing/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251104T100000
DTEND;TZID=America/Los_Angeles:20251104T110000
DTSTAMP:20260409T121151
CREATED:20251023T133559Z
LAST-MODIFIED:20251023T133559Z
UID:73435-1762250400-1762254000@passive-components.eu
SUMMARY:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
DESCRIPTION:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools\nNovember 4\, 2025 | 10:00 AM PST\n\n\n\n\nThis webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced stability analysis using the WS-probe in Keysight Technologies’ Advanced Design System software. \nDesigning stable circuits is becoming harder as communication systems evolve. Instability derives from a combination of gain and feedback. Higher-frequency systems demand faster devices (more gain)\, while advanced functionality calls for tighter integration (more feedback). In this evolving landscape\, traditional techniques are no longer sufficient. But the sheer number of alternative approaches and their perceived complexity leave them unused by many designers. This talk aims to demystify instability so you can design circuits that are actually amplifiers (not oscillators) from the start. We’ll walk through the root causes of instability and the shortcomings of popular RF and Microwave stability analysis techniques. Then\, we’ll revisit prior fundamental work to provide\, through examples\, a simple\, reliable process for rigorous stability analysis—enabled by the new WS-Probe simulation tool. \nWho should attend this webinar? This Electronic Design Automation (EDA) webinar is ideal for RF and microwave engineers or anyone looking to gain a deeper understanding of amplifier stability and high-frequency circuit design.
URL:https://passive-components.eu/event/design-and-stability-analysis-of-gan-power-amplifiers-using-advanced-simulation-tools/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251104T120000
DTEND;TZID=America/New_York:20251106T141500
DTSTAMP:20260409T121151
CREATED:20240812T074032Z
LAST-MODIFIED:20250728T071207Z
UID:67085-1762257600-1762438500@passive-components.eu
SUMMARY:Wirebond Materials\, Processes\, Reliability and Testing
DESCRIPTION:Wirebond Materials\, Processes\, Reliability and Testing\nInstructor: Lee Levine \nDescription: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past\, gold wire was the dominant material in use\, but in 2015 copper and palladium coated copper wire captured more than 51% of the total market. Copper provides benefits in cost\, improved conductivity\, stiffness and reliability. However\, it is significantly harder than gold and achieving a robust\, reliable process is more challenging.\nWith the high productivity and growth rate of wire bonding\, it is one of the most reliable manufacturing processes. Achieving high yields requires rigorous attention to details and excellent statistical process control. Wire bonding high-volume lead-frames often generates defect rates below 10ppm\, this presents a significant barrier to entry for any process competitor\, but copper is meeting the challenge in high-volume manufacturing. \nThis course is intended for wire bond process engineers\, technicians\, quality control engineers and managers. \n\nThe course will cover: \nIntroduction \n\nA snapshot of some microelectronic packages\nSize of the market\nCost of a wire bond\n\nUltrasonic Welding \n\nHow ultrasonics effects a materials deformation\nThe principal ultrasonic welding parameters\nDiffusion\n\nIntermetallics and Intermetallic Failures- Gold and Copper \n\nFormation of intermetallic alloys\nDiffusion transformations during the life and death of a bond\n\nCopper wire bonding \n\nEffects of bonding parameters\nGetting started with copper ball bonding\n\nWire\nWedge bond vs ball bond parameters and comparison\nBall Bumping
URL:https://passive-components.eu/event/wirebond-materials-processes-reliability-and-testing-2/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251106T143000
DTEND;TZID=Europe/Prague:20251106T160000
DTSTAMP:20260409T121151
CREATED:20250925T111037Z
LAST-MODIFIED:20250925T111037Z
UID:72716-1762439400-1762444800@passive-components.eu
SUMMARY:Self-healing polymer materials for the next generation of high-temperature power capacitors
DESCRIPTION:Self-healing polymer materials for the next generation of high-temperature power capacitors\nThursday\, 6 November 2025\, 14:30-16:00 (CET)\, M304-M307\, Alsion\, SDU Sønderborg with online join option for registered attendees. \nAbout the event\n\nPolymer-based power capacitors have long struggled with combining high temperatures with good breakdown strength and reliability. With the increasing adoption of wide-band-gap semiconductors in convertors for e-mobility\, HVDC\, etc\, there is a need for high voltage capacitors that can withstand ever higher temperatures\, without compromising on reliability or breakdown voltage. We present a new class of polymer dielectric material\, developed in collaboration between the DTU Department of Chemical and Biochemical Engineering and the SDU Centre for Industrial Electronics based on self-healing cross-linked polymer networks. These materials can self-heal at temperatures well beyond BOPP\, exhibiting increased breakdown voltages at elevated temperatures and the ability to heal post-breakdown. If implemented in converters\, these materials would result in substantial gains in energy efficiency and device lifetime. \n\n\nTo learn more\, please join us at SDU Sønderborg or online on 6 November! \n\n\n\nEvent programme\n\n\n\n14:30 Welcome to SDU (Thomas Ebel\, SDU) \n14:35 Introducing the X-linkCap project (Anders Egede Daugaard\, DTU and William Greenbank\, SDU) \n14:50 Chemistry and properties of the cross-linked polymer systems (Neha Manojkumar Mulchandani\, DTU) \n15:10 Fabrication and testing of high temperature\, self-healing capacitors (Bartosz Gackowski\, SDU) \n15:30 Summary of project and future perspectives (Anders Egede Daugaard\, DTU\, Thomas Ebel\, SDU and William Greenbank\, SDU) \n15:40 Q&A with in-person and online audience \n16:00 Refreshments for in-person attendees \n\n\n\nRegistration\n\nJoin us for the Self-Healing Polymers for Next-Gen Power Capacitors event on 6 November 2025. Participation is free\, but registration is required. \nThe Zoom link for online participants will be shared prior to the meeting. \nRegister by 30 October 2025 to secure your spot!
URL:https://passive-components.eu/event/self-healing-polymer-materials-for-the-next-generation-of-high-temperature-power-capacitors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251111T170000
DTEND;TZID=Europe/Prague:20251111T180000
DTSTAMP:20260409T121151
CREATED:20251029T173129Z
LAST-MODIFIED:20251029T173129Z
UID:73460-1762880400-1762884000@passive-components.eu
SUMMARY:Industrial Applications Demand More from Interconnects in Next-Gen Designs
DESCRIPTION:Industrial Applications Demand More from Interconnects in Next-Gen Designs\nby Samtec \nTuesday\, November 11\, 2025 · 5:00 p.m. CET \nNeed to specify interconnects for industrial applications like automation\, robotics\, embedded vision\, IoT\, lighting\, smart cities\, grids\, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting the most suitable rugged interconnects for your industrial products. \nTopics covered include: \n\nMechanical considerations: shock and vibration\, plating\, mechanical strength of the connector on the PCB\, secure coupling\nElectrical considerations: current carrying capacity\, designs for high-speed applications\nEnvironmental considerations: performance in harsh conditions\, design flexibility\, protection against dust and moisture\n\nSpeaker: \n\n\n\nJan Hrouda \n\nIndustry Manager for Industrial Applications\n\n\n\n\nJan Hrouda\, a native of Germany\, completed his B.S. in International Business at Aquinas College in Grand Rapids\, Michigan. After joining Samtec in 1996\, he served in various roles\, including Customer Service\, Application-Specific Engineering
URL:https://passive-components.eu/event/industrial-applications-demand-more-from-interconnects-in-next-gen-designs/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251112T110000
DTEND;TZID=Europe/Prague:20251112T120000
DTSTAMP:20260409T121151
CREATED:20251020T071645Z
LAST-MODIFIED:20251029T173433Z
UID:73279-1762945200-1762948800@passive-components.eu
SUMMARY:PCB Design: Impedance is for everyone!
DESCRIPTION:Würth Elektronik Webinar: Impedance is for everyone!\n\n\n\n\n\n\n\n\n\nWed\, Nov 12\, 2025 11:00 AM – 12:00 PM CET\n\n\n\n\n\n\n\n\nAs data rates increase\, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion\, the impedance requirements of the assembly or application must be properly considered in the PCB design. In this webinar\, we will show how an impedance-defined stackup is created based on simulation results and electrical boundary conditions – a stackup precisely matched to the required impedance. The key lies in careful design and manufacturing\, including verification through electrical measurements on test coupons when needed. Building on this foundation\, we will demonstrate how Design for Manufacturing (DfM) and tolerance management can improve production.\n\nJoin our webinar on November 12\, 2025\, at 11:00 a.m.\, and learn about:\n\nThe fundamentals of impedance and signal integrity\nHow to create an impedance-defined stackup for the technologies • BASIC • MICROVIA.hdi and • STARR.flex\nDesign for Manufacturing and tolerance considerations\nPractical tips and tricks from the field\nWhen to switch to high-speed base materials\nA look at special applications\, such as impedance in antenna structures Gain a comprehensive understanding of different PCB technologies and their specific requirements\nall from a holistic perspective: Impedance is for everyone!\n\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students.
URL:https://passive-components.eu/event/pcb-design-impedance-is-for-everyone/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251112T120000
DTEND;TZID=America/New_York:20251113T141500
DTSTAMP:20260409T121151
CREATED:20220909T110643Z
LAST-MODIFIED:20250728T071303Z
UID:58718-1762948800-1763043300@passive-components.eu
SUMMARY:Microelectronic Packaging Failure Modes and Analysis
DESCRIPTION:VIRTUAL: Microelectronic Packaging Failure Modes and Analysis\nInstructors: Thomas Green and Robert Lowry \nDescription: \nThe design and packaging of microelectronic devices such as hybrids\, RF microwave modules\, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing\, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs. \nThe instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid\, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and\, resist the temptation to rush to judgment\, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. \nThe course is intended for FA engineers\, component engineers\, reliability engineers\, design\, quality and process engineers involved in microelectronic packaging. \nTopics include: \n\nIntroduction to Microelectronic Packaging\nTerminology and Product Definitions\nTypical Package Related Defects and Failures\nFailure Analysis (FA) Process Flow\nSpecific Examples of Package Related Failures and FA Investigation\nFailure Analysis Tools and Techniques
URL:https://passive-components.eu/event/microelectronic-packaging-failure-modes-and-analysis/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251113T110000
DTEND;TZID=Europe/Prague:20251113T113000
DTSTAMP:20260409T121151
CREATED:20251110T082631Z
LAST-MODIFIED:20251110T082631Z
UID:73619-1763031600-1763033400@passive-components.eu
SUMMARY:DC/DC Converters in Automotive Applications
DESCRIPTION:Würth Elektronik Webinar: Bridging the Voltage Gap: DC/DC Converters in Automotive Applications\n\n\n\n\n\n\n\n\n\nThu\, Nov 13\, 2025 11:00 AM – 11:30 AM CET\n\n\n\n\n\n\n\n\nJoin us for an insightful webinar on the silent performers behind modern electrical systems: DC/DC Converters.\n\nIn this webinar\, our experts Daniel Wilder (Product Manager Function-Specific Modules) and Arnaud Wendling (Head of Application Engineering and Product Manager Electronics) explain why these components are essential for reliable power distribution in mobile machines and commercial vehicles.\nYou will learn about the basic principles of common converter types\, their functionality and features\, practical examples from commercial vehicle engineering\, and typical challenges in integration and operation. This webinar offers valuable knowledge and insights from practical experiences.\n\nAgenda:\n1. Introduction\n2. Fundamentals of vehicle electrical systems\n3. DC/DC Converters: types\, features and quality parameters\n4. Application examples & solutions\n5. Live Q&A
URL:https://passive-components.eu/event/dc-dc-converters-in-automotive-applications/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251202T120000
DTEND;TZID=Europe/Prague:20251204T141500
DTSTAMP:20260409T121151
CREATED:20251113T081426Z
LAST-MODIFIED:20251113T081426Z
UID:73663-1764676800-1764857700@passive-components.eu
SUMMARY:Microwave Packaging Technology
DESCRIPTION:Microwave Packaging Technology\nInstructor: Thomas Green \nDescription: Microwave Hybrids\, MICs\, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments\, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues\, material tradeoffs\, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military\, space and other hi reliability commercial and medical device applications. \nThe course is intended as an introductory to intermediate level course for process engineers\, designers\, quality engineers\, and managers responsible for design and manufacture of microwave hybrids. \n\nTopics include: \nSession 1 \n\nIntroduction to Microwave Technology\nMilitary Requirements Flow Down and Design Guidelines\nManufacturing Assembly Process Overview\nWafer Fabrication Processes\nSubstrate Technology\nThin Film Processes on Ceramic\nMaterial and Process Fundamentals for Component Attach\nEutectic Soldering Processes\n\nSession 2 \n\nDie\, substrate and package compatibility\nThermal Impedance and Importance of Minimizing Junction Temperature\nPackaging Design Considerations\nReview of Defects from the Component Attach Process\nOverview of Common Cleaning Processes and Potential Problems\nWirebonding and Interconnect Process Overview\nGap Welding\nFactors that affect yield and reliability\n\nSession 3 \n\nHermetic Packaging Process Overview\nHermeticity Testing\nNear Hermetic Packaging Options\nDesign for Manufacturability (DFM)
URL:https://passive-components.eu/event/microwave-packaging-technology/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251203T170000
DTEND;TZID=Europe/Prague:20251203T180000
DTSTAMP:20260409T121151
CREATED:20251128T081133Z
LAST-MODIFIED:20251128T081133Z
UID:73807-1764781200-1764784800@passive-components.eu
SUMMARY:The Hidden Secret of the Magnetic Transformer and example of its use
DESCRIPTION:The Hidden Secret of the Magnetic Transformer and example of its use\nFrenetic is hosting a special educational session with Prof. Sam Ben-Yaakov\, one of the most respected voices in magnetics and power electronics. \n\nWed\, Dec 03\n\n\n5:00 PM – 6:00 PM CET\n\n\n\n\n\n\nIn this webinar\, Prof. Ben-Yaakov will explain a fundamental — and often overlooked — property of magnetic transformers. \nYou’ll learn how this principle led to the development of a new magnetic reluctance model and even the invention of a new type of controlled inductor. \nWhat to expect: \n\nA clear explanation of this “hidden” magnetic property\nHow it connects to real transformer behavior\nHow it enables new magnetic modeling approaches\nA practical example of its use\n45–60 minutes of deep insight + Q&A\n\nIf you’re curious about what this hidden property is — and how it may change the way you think about magnetics — you don’t want to miss this session.
URL:https://passive-components.eu/event/the-hidden-secret-of-the-magnetic-transformer-and-example-of-its-use/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251209T120000
DTEND;TZID=America/New_York:20251211T141500
DTSTAMP:20260409T121151
CREATED:20220909T110834Z
LAST-MODIFIED:20251113T080614Z
UID:58720-1765281600-1765462500@passive-components.eu
SUMMARY:Space and Military Standards for Hybrids and RF Microwave Modules
DESCRIPTION:Space and Military Standards for Hybrids and RF Microwave Modules\nInstructor: Thomas Green \nDescription: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class K hybrids for military and space applications. \nThe governing document is MIL-PRF-38534 Hybrid Performance Specification\, which in turn further calls out specific test methods in MIL-STD-883L Test Methods and Procedures for Microelectronic Devices. Mil 883 is a collection of destruct and non-destruct test methods used as screening and qualification tests to verify microelectronic performance requirements and to assess the reliability of finished modules. \nThe course is intended for anyone interested in gaining better insight and understanding of the quality and process control requirements for hi reliability space and military products\, specifically component and quality engineers working in this industry. \nTopics include: \nTopic 1: Overview of MIL-PRF-38534 Hybrid Performance Specification \nTopic 2: MIL-PRF-38534 General Hybrid Specification \nTopic 3: Overview of MIL-STD-883 test methods and procedures required for Space qualified Hybrids and RF MMIC Modules \nTopic 4: Group B\, C and D Periodic Inspection Test Methods Failure Analysis Tools and Techniques
URL:https://passive-components.eu/event/space-and-military-standards-for-hybrids-and-rf-microwave-modules/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251210T160000
DTEND;TZID=Europe/Prague:20251210T170000
DTSTAMP:20260409T121151
CREATED:20250915T083108Z
LAST-MODIFIED:20250915T083108Z
UID:72563-1765382400-1765386000@passive-components.eu
SUMMARY:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization
DESCRIPTION:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization\nWebinar by Würth Elektronik\nWednesday\, December 10th 2025 @ 4:00PM CET\n\n\nCurious about Qi2 wireless power design? Join this webinar to dive into practical development insights and EMC strategies for your next project.\n\nWhat you’ll learn:\n\n·         How to build a Qi2 wireless power transmitter from the ground up – from FET selection to control architecture.\n·         Key features of the WE Qi2 MPP Tx Coil and how to integrate it effectively.\n·         PCB layout tips to boost performance and minimize losses.\n·         How to measure and reduce conducted emissions with smart filter design.\n·         Interactive Q&A session to get your questions answered live.
URL:https://passive-components.eu/event/designing-qi2-wireless-power-systems-practical-development-and-emc-optimization/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251215T130000
DTEND;TZID=America/New_York:20251218T151500
DTSTAMP:20260409T121151
CREATED:20220909T111655Z
LAST-MODIFIED:20251113T080820Z
UID:58728-1765803600-1766070900@passive-components.eu
SUMMARY:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
DESCRIPTION:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)\nInstructor: Thomas Green \nDescription: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices. Over 250 color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of Pre Cap visual inspection and how to interpret and apply the very latest MIL-STD-883 criteria. \nThe course is intended for quality assurance personnel\, inspectors\, QEs and Process engineers\, component engineers and lead operators and others responsible for inspection of the hardware prior to the final package sealing process. \nThe following is an approximation of what will be covered in each online or “virtual” training session.  \nSession 1: Introduction and Overview \n\nMil Spec Visual Inspection Requirements Flowdown\nComponent ID\nForeign Material or F.O.D. inspection and source requirements\n\nSession 2: Component Attach \n\nTM 2017 Low mag IC/MMIC die and substrate attach inspection criteria and non-planar capacitor/resistor criteria\nSolder Criteria\n\nSession 3: Wire and Ribbon Bonding \n\nTM 2017 Low mag wire and ribbon bond inspection criteria\n\nSession 4: High Mag IC Die and MMIC Inspection and Passives \n\nTM 2010 IC High Mag Inspection criteria\nMIL-STD-750 Die level Inspection Criteria TM 2017 Table 1\nTM 2032 Passive Component inspection criteria for substrates\, capacitors\, inductors and resistors
URL:https://passive-components.eu/event/pre-cap-visual-inspection-per-mil-std-883-tm-2017/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251216T170000
DTEND;TZID=Europe/Prague:20251216T180000
DTSTAMP:20260409T121151
CREATED:20251208T084049Z
LAST-MODIFIED:20251208T084049Z
UID:73893-1765904400-1765908000@passive-components.eu
SUMMARY:Coaxial Connectors and How to Connect with the PCB
DESCRIPTION:Coaxial Connectors and How to Connect with the PCB\nWebinar by Würth Elektronik\nTuesday\, December 16th 2025 @ 5:00PM CET\n\n\nThis free one-hour webinar presents practical guidance for achieving low-loss connections between coaxial connectors and printed circuit boards. The session covers the most relevant parameters affecting impedance and demonstrates how these factors can influence overall performance. Methods for identifying interference points are discussed\, along with criteria for determining acceptable levels of loss in real-world applications. \n\nAttention is given to the connector characteristics that are most important for maintaining quality\, especially at high frequencies. Live simulations using CST illustrate how adjustments to the PCB layout can impact connection behavior. The presentation also outlines the design process for RF connectors\, providing a clear view of industry best practices.
URL:https://passive-components.eu/event/coaxial-connectors-and-how-to-connect-with-the-pcb/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251219T120000
DTEND;TZID=America/New_York:20251219T140000
DTSTAMP:20260409T121151
CREATED:20250210T124135Z
LAST-MODIFIED:20251113T080720Z
UID:70084-1766145600-1766152800@passive-components.eu
SUMMARY:External Visual Inspection per MIL-STD-883 TM 2009
DESCRIPTION:External Visual Inspection per MIL-STD-883 TM 2009\nInstructor: Thomas Green \nDescription: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and the instructor explains why the defects are critical to the reliability of the end product. \nTopics include: \n\nWeld and Seal defects\nGlass and ceramic feedthrough defects e.g. meniscus cracking Package marking and pin/lead defects\nInspection Criteria for Microelectronic Packages and Covers Foreign Material Identification and Contamination Control\nReview applicable criteria in JESD 9C\nPlastic Package Defects\n\n 
URL:https://passive-components.eu/event/external-visual-inspection-per-mil-std-883-tm-2009/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260121T180000
DTEND;TZID=Europe/Prague:20260121T184500
DTSTAMP:20260409T121151
CREATED:20260114T094529Z
LAST-MODIFIED:20260114T094529Z
UID:74275-1769018400-1769021100@passive-components.eu
SUMMARY:To Rogowski or not to Rogowski
DESCRIPTION:Rohde & Schwarz Webinar: To Rogowski or not to Rogowski\, that’s the question (North America / Europe)\n\n\nWednesday\, January 21\, 2026 \n\n\n12:00 PM Eastern Standard Time \n\n\n45 minutes \n\n\nThis webinar uncovers the fundamentals of Rogowski coil technology. Our oscilloscope expert together with a guest speaker from Power Electronic Measurements Ltd (PEM) will explore unique characteristics of Rogowski coil technology\, its technical advantages and specific applications where it can be best used in. In the course of the presentation viewers  will learn when and why should Rogowski technology for current measurements be chosen and gain a comprehensive overview of Rogowski probes that are now available for purchase through Rohde & Schwarz. \nThis webinar will cover: \n\nRogowski coil fundamentals\nUnique characteristics and technical advantages of Rogowski probes\nApplications scenarios\nRogowski probe portfolio available from Rohde & Schwarz
URL:https://passive-components.eu/event/to-rogowski-or-not-to-rogowski/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260127T080000
DTEND;TZID=Europe/Prague:20260127T170000
DTSTAMP:20260409T121151
CREATED:20260127T145620Z
LAST-MODIFIED:20260127T145620Z
UID:74498-1769500800-1769533200@passive-components.eu
SUMMARY:COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
DESCRIPTION:COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening; DOEET Webinar\n\nThursday\, 19th February\n3 pm (CET)\n\nMini-Circuits is the world’s preferred supplier of radio frequency (RF)\, microwave\, and millimeter-wave components and systems. Mini-Circuits provides advanced high-reliability screening and qualification services designed to support mission-critical applications across aerospace\, defense\, space\, and other demanding environments. To enable mission readiness\, Mini-Circuits offers flexible screening flow templates that may be tailored to customer standards by adding or removing tests\, adjusting sample sizes\, and modifying stress conditions such as temperature\, duration\, and humidity based on mission requirements. \nWith a commitment to traceability\, compliance\, and long-term mission reliability\, Mini-Circuits has provided hundreds of up-screened models primarily across our µCeramIQ™ (LTCC)\, Core & Wire\, and PEM technology families. \nThis webinar will focus on the use of custom screening and qualification workflows tailored to customer-provided requirements or their Source Control Drawings (SCDs). The presentation will also highlight Mini-Circuits’ key space-capable technologies and readiness to collaborate with customers to create mission-critical products and applications. \n\n\nAgenda\n\n\n\n\n\nWelcome and Introduction\nAbout Mini-Circuits\nHighReliability Components Screening\nCustomization of Qualifications\nCore Technologies Up-Screening Flows\nQuality Assurance\nSummary Overview\nQ&A\n\nSpeaker \nBoris Benger\n\nPrincipal Applications Engineer \nBoris Benger is a Principal Applications Engineer at Mini-Circuits\, where he supports space up-screening for Mini-Circuits COTS components based on customer reliability requirements. He is a seasoned RF and IF signal processing engineer with extensive expertise in microwave components\, system-level integration\, and custom solutions. He came to Mini-Circuits from L3-Narda-MITEQ\, where he had been legacy MITEQ’s youngest ever Department Head. He has worked extensively on high-performance RF/IF solutions for demanding commercial and defence applications since he entered the electronics industry in 1983.
URL:https://passive-components.eu/event/cots-devices-for-space-missions-flexible-and-cost-efficient-up-screening/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260127T160000
DTEND;TZID=Europe/Prague:20260127T170000
DTSTAMP:20260409T121151
CREATED:20251215T095827Z
LAST-MODIFIED:20251215T095827Z
UID:73997-1769529600-1769533200@passive-components.eu
SUMMARY:Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies
DESCRIPTION:Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies\nWebinar Presented by Würth Elektronik & onsemi\nTuesday\, January 27th 2026 @ 4:00PM CET\n\nCar makers are increasingly embracing software-defined vehicle architectures to elevate the driving experience while streamlining development and reducing costs associated with traditional hardware-centric systems. Innovative features—such as customizable lighting patterns—can now be deployed on existing ECU hardware without modifying the ECU software\, significantly cutting down software validation efforts and accelerating time to market. Zonal electrical/electronic (E/E) architectures not only enable these software-defined capabilities but also simplify power distribution\, leading to reduced vehicle weight\, lower costs\, and enhanced safety and performance. \nJoin Würth Elektronik and onsemi to explore dynamic zonal and power distribution strategies and discover how our smart switch solutions can help you tackle design challenges in next-generation automotive platforms.
URL:https://passive-components.eu/event/simplifying-vehicle-development-with-automotive-ethernet-and-zonal-smart-switch-technologies/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260211T160000
DTEND;TZID=Europe/Prague:20260211T170000
DTSTAMP:20260409T121151
CREATED:20260205T135654Z
LAST-MODIFIED:20260205T135654Z
UID:74688-1770825600-1770829200@passive-components.eu
SUMMARY:What’s Next in Power Electronics Design
DESCRIPTION:Frenetic 2026: What’s Next in Power Electronics Design\nWednesday\, February 11\, 4:00 PM \nPower electronics design is evolving fast\, not because of trends\, but because real constraints are getting tighter: higher power density\, shorter timelines\, stricter validation requirements\, and growing pressure to move designs from concept to production with fewer iterations. \n  \nIn this 30-minute session\, we’ll share a clear and realistic view of what we’re seeing across the industry\, how those signals are shaping Frenetic’s product direction\, and which technical conversations we believe will matter most in 2026. \n  \nWe’ll discuss about: \n\nHow recent customer feedback has influenced the latest updates in Frenetic Magnetic Simulator\nA short and transparent look at the 2026 product roadmap\nKey trends already emerging in automotive\, aerospace & defense\, and manufacturing\, grounded in real projects and market signals\nHow we’re evolving our webinar program\, regional sessions\, and technical discussions this year\n\nJoin a conversation about where power electronics design is heading\, and how teams are adapting in real-world conditions.
URL:https://passive-components.eu/event/whats-next-in-power-electronics-design/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260224T160000
DTEND;TZID=Europe/Prague:20260224T170000
DTSTAMP:20260409T121151
CREATED:20260216T080816Z
LAST-MODIFIED:20260216T080816Z
UID:74763-1771948800-1771952400@passive-components.eu
SUMMARY:Mastering Galvanic Isolation: Ensuring Safety in Power Electronics
DESCRIPTION:Mastering Galvanic Isolation: Ensuring Safety in Power Electronics with Würth Elektronik products\nTuesday\, February 24th 2026 @ 4:00PM CET \nDiscover the fundamentals of galvanic isolation in power electronics and learn how it ensures maximum safety by securely separating circuits while maintaining reliable signal transmission. \n\nExplore various isolation methods\, from optocouplers to modern digital isolators\, and understand their individual strengths\, application areas\, and limitations. With technologies from Würth Elektronik\, you will find the ideal isolation solution for industrial applications\, demanding control systems\, and robust energy environments.
URL:https://passive-components.eu/event/mastering-galvanic-isolation-ensuring-safety-in-power-electronics/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260225T160000
DTEND;TZID=Europe/Prague:20260225T170000
DTSTAMP:20260409T121151
CREATED:20260223T083648Z
LAST-MODIFIED:20260223T083648Z
UID:74826-1772035200-1772038800@passive-components.eu
SUMMARY:Magnetic Modeling - How Frenetic Models Magnetics
DESCRIPTION:How Frenetic Models Magnetics — a transparent deep-dive\n\n\nWednesday\, February 25\, 4:00 PM\nWhat actually happens when Frenetic simulates a magnetic component? \n  \nBehind every inductance value\, loss estimation\, and thermal prediction\, there is a modeling approach built on physical assumptions. Understanding how those models work — and where they reach their limits — is essential for designing with confidence. \n  \nIn this 30-minute session\, Jonas Mühlethaler\, CTO of Frenetic and Professor of Electrical Engineering at Lucerne University of Applied Sciences and Arts (HSLU)\, will break down Frenetic’s modeling approach step by step — from reluctance and loss calculations to thermal predictions — illustrated with a concrete example. \n  \nHe will also explain where analytical models reach their limits\, and why planar magnetics often call for FEM due to their geometric complexity and strong coupling effects. \n  \nWhat you’ll learn: \n\nHow Frenetic builds magnetic circuit models using reluctance methods\nHow core and copper losses are calculated\nHow thermal predictions are derived\nWhere analytical models perform reliably\nWhy certain geometries — especially planar magnetics — challenge simplified assumptions\n\nThis session is not about comparing modeling tools. \nIt’s a transparent look at how physical modeling is applied in real magnetic design.
URL:https://passive-components.eu/event/magnetic-modeling-how-frenetic-models-magnetics/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260303T160000
DTEND;TZID=Europe/Prague:20260303T170000
DTSTAMP:20260409T121151
CREATED:20260126T081010Z
LAST-MODIFIED:20260126T081010Z
UID:74442-1772553600-1772557200@passive-components.eu
SUMMARY:Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion
DESCRIPTION:Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion\, Würth Elektronik Webinar\nTuesday\, March 3rd 2026 @ 4:00PM CET \nCybersecurity is no longer a topic of the future – it’s a pressing reality. With the RED Delegated Regulation and the Cyber Resilience Act (CRA)\, companies are facing new regulatory requirements that significantly impact product development and compliance strategies. But what exactly is required? How should risks be assessed? And what about existing systems?\n\nThis webinar builds on the previously published introductory session on cybersecurity\, which you can find here in Würth Elektronik’s Video Center. Now\, we take the next step – with deeper insights\, practical examples\, and space for open discussion. \n\nWürth Elektronik together with Phoenix Testlab and the German Federal Network Agency (Bundesnetzagentur) as guest\, invites you to join a focused exchange with experts from industry\, testing bodies\, and regulatory authorities.
URL:https://passive-components.eu/event/cybersecurity-at-the-eleventh-hour-from-red-to-cra-information-and-discussion/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260310T170000
DTEND;TZID=Europe/Prague:20260310T180000
DTSTAMP:20260409T121151
CREATED:20260310T171805Z
LAST-MODIFIED:20260310T171805Z
UID:75049-1773162000-1773165600@passive-components.eu
SUMMARY:Simplifying design with easy-to-configure modular connectors
DESCRIPTION:Simplifying design with easy-to-configure modular connectors featuring Hyperboloid contact technology\nDate: April 14\, 2026\nTime: 11:00 AM ET | 10:00 AM CT | 8:00 AM PT\nDuration: 60 Minutes \nPresented By: \nJoydip Sanyal  (Product Group Manager\, General Industrial and Aerospace and Defense  – Connectors BU\, Smiths Interconnect) \nSmiths Interconnect’s new optimized\, versatile and high-density modular connector series is rugged\, easy to configure and employs a do-it-yourself system. The connector series is based on the principle of building blocks which consists mainly of two elements: modules and frames. It’s flexible\, which allows the ability to mix and match modules for signal\, power\, coaxial\, pneumatic and high-speed data contact technologies into different configurations within a single connector frame including a vast selection of hoods. \nA key feature of the series is the high reliability due to hyperboloid contacts which qualify it to operate for high vibration applications like missile launchers or test and measurement use that require up to 100\,000 mating cycles to allow high mean time between failure reducing downtime in operations. \nThe series was recently enhanced with the introduction of the new Cat5e and Cat6A ethernet data in accordance with IEEE 802.3 transmission modules. These new modules combine the proven technical characteristics of the hyperboloid contact with the use of high-quality and compliant insulator material – like the polycarbonate family – to offer industry compliance and high performance. Customers can now easily configure modular connectivity solutions for their designs using to the new online configurator for the fully integrated modular L series. \nKey takeaways: \n\nModular Design\nVersatility and Customization\nHigh Reliability\nEnhanced Data Capability\nNew Online Configurator
URL:https://passive-components.eu/event/simplifying-design-with-easy-to-configure-modular-connectors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260319T130000
DTEND;TZID=America/Chicago:20260319T140000
DTSTAMP:20260409T121151
CREATED:20260305T075016Z
LAST-MODIFIED:20260305T075016Z
UID:74998-1773925200-1773928800@passive-components.eu
SUMMARY:Smart Consideration of Inductor Thermal Performance
DESCRIPTION:Smart Consideration of Inductor Thermal Performance\n\nThursday\, March 19\, 2026 \n\n\n1:00 PM Central Daylight Time \nnlock the secrets to informed power inductor selection in our upcoming webinar\, Smart Consideration of Inductor Thermal Performance. This event is designed for professionals like you who are eager to optimize their DC-DC converter performance by better use of inductors. \nWhat You’ll Learn:\n\nKeys that make inductor thermal performance different from other devices.\nStrategies for accurate calculation of inductor thermal performance.\nPractical tips and real-world examples.\n\nSpeaker\nLen Crane has more than 45 years of high frequency switching power inductor design and application experience with Coilcraft. Len focuses on assisting customers with continuing magnetics education and consulting on specific projects.
URL:https://passive-components.eu/event/smart-consideration-of-inductor-thermal-performance/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260321
DTEND;VALUE=DATE:20260322
DTSTAMP:20260409T121151
CREATED:20260120T144436Z
LAST-MODIFIED:20260120T144436Z
UID:74316-1774051200-1774137599@passive-components.eu
SUMMARY:PSMA Capacitor Workshop 2026
DESCRIPTION:Capacitors in Modern Power Electronics – Design\, Reliability\, Sustainability\nSaturday March 21 2026\nPrior to APEC 2026\nHenry B. Gonzales Convention Center\nSan Antonio\, TX 78205 \nWelcome to the PSMA Capacitor Committee Workshop 2026 \nThe PSMA Capacitor Committee\, in cooperation with IEEE PELS\, warmly invites you to the next Capacitor Workshop\, which will take place on Saturday\, March 21\, 2026\, at the Henry B. González Convention Center in San Antonio\, Texas. This workshop has become a well-established pre-event of APEC week and is recognized as one of the central gatherings for designers\, manufacturers\, researchers\, and users of capacitors. \nFollowing successful workshops in Anaheim\, San Antonio\, Houston\, we are excited to present another high-level program in 2026\, bringing together the state of the art in technology\, the latest research results\, and practical application insights. Whether you are a power electronics designer\, component purchaser\, researcher\, or end user\, this workshop offers deep technical knowledge\, inspiring perspectives\, and valuable networking opportunities. \nThe 2026 agenda will once again feature world-class speakers. Planned presentations include\, but are not limited to: \n\nElectrolytic Capacitor Technology in Multilevel Inverters\nCapacitor Selection for Resonant Converter Design\n3 Days to 30 Seconds Capacitor Array Design\nModeling and Validation for Class-2 MLCCs\nLifetime Analysis of Electrolytics Including Mission Profiles\nDesigning for Environmental Compatibility – Towards Sustainable Power Electronics\nWhy Capacitors Do What They Do\nSwitched-Capacitor Based Topologies and Circuit Techniques for High-Performance Power Conversion
URL:https://passive-components.eu/event/psma-capacitor-workshop-2026/
LOCATION:San Antonio\, Texas\, Henry B. Gonzales Convention Center\, San Antonio\, TX\, United States
END:VEVENT
END:VCALENDAR