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UID:73435-1762250400-1762254000@passive-components.eu
SUMMARY:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
DESCRIPTION:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools\nNovember 4\, 2025 | 10:00 AM PST\n\n\n\n\nThis webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced stability analysis using the WS-probe in Keysight Technologies’ Advanced Design System software. \nDesigning stable circuits is becoming harder as communication systems evolve. Instability derives from a combination of gain and feedback. Higher-frequency systems demand faster devices (more gain)\, while advanced functionality calls for tighter integration (more feedback). In this evolving landscape\, traditional techniques are no longer sufficient. But the sheer number of alternative approaches and their perceived complexity leave them unused by many designers. This talk aims to demystify instability so you can design circuits that are actually amplifiers (not oscillators) from the start. We’ll walk through the root causes of instability and the shortcomings of popular RF and Microwave stability analysis techniques. Then\, we’ll revisit prior fundamental work to provide\, through examples\, a simple\, reliable process for rigorous stability analysis—enabled by the new WS-Probe simulation tool. \nWho should attend this webinar? This Electronic Design Automation (EDA) webinar is ideal for RF and microwave engineers or anyone looking to gain a deeper understanding of amplifier stability and high-frequency circuit design.
URL:https://passive-components.eu/event/design-and-stability-analysis-of-gan-power-amplifiers-using-advanced-simulation-tools/
LOCATION:virtual
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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251030T110000
DTEND;TZID=Europe/Prague:20251030T120000
DTSTAMP:20251016T065521Z
CREATED:20251016T065521Z
LAST-MODIFIED:20251016T065521Z
UID:73206-1761822000-1761825600@passive-components.eu
SUMMARY:Space Ceramic Capacitors with Flexible Testing
DESCRIPTION:Space Ceramic Capacitors with Flexible Testing\nThursday\, 30. 10. 2025\, 11:00 – 12:00 CET \nSRT-Microcéramique ceramic capacitor manufacturer benefits from extensive experience in the high-reliability sector\, supplying components to leading customers in the Defense\, Medical\, and Industrial markets\, thanks to our fully integrated PME manufacturing process and in-house testing capabilities. \nThis webinar will present the technical aspects of choosing ceramic capacitors for space applications\, highlight SRT-Microcéramique’s offering and approach\, and explain how it compares and differs from current market proposals. We will also cover how to best procure and order selected components through the ALTER DoEEt listing\, as well as how to contact the SRT engineering team for special designs
URL:https://passive-components.eu/event/space-ceramic-capacitors-with-flexible-testing/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20251028T080000
DTEND;TZID=Europe/Prague:20251028T150000
DTSTAMP:20250818T105942Z
CREATED:20250818T105942Z
LAST-MODIFIED:20250818T105942Z
UID:72394-1761638400-1761663600@passive-components.eu
SUMMARY:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit
DESCRIPTION:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit\nWebinar Presented by Würth Elektronik & Texas Instruments\nTuesday\, October 28th 2025 @ 3:00PM CET\n\nIn this webinar\, we explore the market trends driving the need for compact\, efficient isolated power solutions and how the SN6507 helps address them. We’ll discuss real-world applications\, walk through the benefits of the SN6507\, and introduce a co-developed development kit built to accelerate your design process. \nYou’ll also learn how Würth Elektronik engineered a full line of transformers optimized for this solution (WE-PPTI) and how to select the right one for your needs. Join us for the live presentation to gain practical insights\, ask your questions\, and see how this collaboration helps you design faster and smarter.
URL:https://passive-components.eu/event/power-up-your-design-sn6507-and-the-ready-to-use-development-kit/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251021T120000
DTEND;TZID=America/New_York:20251023T141500
DTSTAMP:20251113T080424Z
CREATED:20240803T070206Z
LAST-MODIFIED:20251113T080424Z
UID:67288-1761048000-1761228900@passive-components.eu
SUMMARY:Design and Test of Non-Hermetic Microelectronics
DESCRIPTION:Design and Test of Non-Hermetic Microelectronics\nInstructors: Thomas Green and Robert Lowry \nDescription: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals\, ceramics\, and glasses) require a different approach from a design\, production\, testing\, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law of diffusion and the interaction of moisture and other gases with the plastic package\, with or without a cavity\, is of primary importance. \nThis course begins with a brief overview of hermetic packaging and associated testing methods that have been developed over the years\, some of which are applicable to cavity style non-hermetic enclosures. Then the focus is primarily on the materials used to build non-hermetic packages and the variety of testing methods available to evaluate the non-hermetic package. A review of the techniques and methods to evaluate a “non-hermetic” approach is discussed with a special emphasis on cleaning of the device prior to encapsulation and alternate test methods to evaluate reliability. \nThe course is intended for process engineers\, designers\, quality engineers\, and managers responsible for design\, test and production of cavity and non-cavity style non-hermetic packages intended for use in high reliability military and Class 3 medical implants. \n\nTopics include: \n\nWhat is “hermeticity” and how to test for it (brief overview)\nHow it is different from “non-hermetic” packaging and test\nNon-hermetic Materials and Processes\n\nFick’s law fo diffusion\nThin films and coatings e.g. ALD and Parylene-C\nPEEK\, LCP\, Kapton\, Silicones thick coatings and potting compounds\n\n\nImportance of Surface Cleanliness\n\nHow to evaluate surface cleanliness\n\n\nCoating material evaluation and effectiveness\n\nAdhesion\, pinholes\, cracks\n\n\nNon- Hermetic Packaging and Testing\n\nWVTR\,  IPC-CC-830\nMoisture uptake (absorption) by materials TGA/TML\, WVR\n\n\nTest methods applicable to non-hermetics\n\nA Critical Review of Waterproof Testing Standards IP 67/68\nTM 5011 and NASA outgassing Specs\nRGA for non-hermetic cavities\nMoisture sensors\n\n\nQualification test methods and standards\n\nMil grade Non-hermetic qual standards…e.g. Class Y\nJEDEC STANDARDS…EIA STANDARDS SSB-1
URL:https://passive-components.eu/event/design-and-test-of-non-hermetic-microelectronics/
LOCATION:virtual
CATEGORIES:TJGreen
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251024
DTSTAMP:20250902T074110Z
CREATED:20250902T074110Z
LAST-MODIFIED:20250902T074110Z
UID:72480-1760918400-1761263999@passive-components.eu
SUMMARY:Digital WE Days 2025 - Virtual Conference
DESCRIPTION:Digital WE Days 2025 – Virtual Conference\nOctober 20 – 23\, 2025\nWhat are the Digital WE Days? \nIt’s a digital event with a comprehensive conference programme with practice-oriented presentations for you to enjoy. All presentations are live and totally free. \nClick here for the FAQs.
URL:https://passive-components.eu/event/digital-we-days-2025-virtual-conference/
LOCATION:virtual
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