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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260211T160000
DTEND;TZID=Europe/Prague:20260211T170000
DTSTAMP:20260205T135654Z
CREATED:20260205T135654Z
LAST-MODIFIED:20260205T135654Z
UID:74688-1770825600-1770829200@passive-components.eu
SUMMARY:What’s Next in Power Electronics Design
DESCRIPTION:Frenetic 2026: What’s Next in Power Electronics Design\nWednesday\, February 11\, 4:00 PM \nPower electronics design is evolving fast\, not because of trends\, but because real constraints are getting tighter: higher power density\, shorter timelines\, stricter validation requirements\, and growing pressure to move designs from concept to production with fewer iterations. \n  \nIn this 30-minute session\, we’ll share a clear and realistic view of what we’re seeing across the industry\, how those signals are shaping Frenetic’s product direction\, and which technical conversations we believe will matter most in 2026. \n  \nWe’ll discuss about: \n\nHow recent customer feedback has influenced the latest updates in Frenetic Magnetic Simulator\nA short and transparent look at the 2026 product roadmap\nKey trends already emerging in automotive\, aerospace & defense\, and manufacturing\, grounded in real projects and market signals\nHow we’re evolving our webinar program\, regional sessions\, and technical discussions this year\n\nJoin a conversation about where power electronics design is heading\, and how teams are adapting in real-world conditions.
URL:https://passive-components.eu/event/whats-next-in-power-electronics-design/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260127T160000
DTEND;TZID=Europe/Prague:20260127T170000
DTSTAMP:20251215T095827Z
CREATED:20251215T095827Z
LAST-MODIFIED:20251215T095827Z
UID:73997-1769529600-1769533200@passive-components.eu
SUMMARY:Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies
DESCRIPTION:Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies\nWebinar Presented by Würth Elektronik & onsemi\nTuesday\, January 27th 2026 @ 4:00PM CET\n\nCar makers are increasingly embracing software-defined vehicle architectures to elevate the driving experience while streamlining development and reducing costs associated with traditional hardware-centric systems. Innovative features—such as customizable lighting patterns—can now be deployed on existing ECU hardware without modifying the ECU software\, significantly cutting down software validation efforts and accelerating time to market. Zonal electrical/electronic (E/E) architectures not only enable these software-defined capabilities but also simplify power distribution\, leading to reduced vehicle weight\, lower costs\, and enhanced safety and performance. \nJoin Würth Elektronik and onsemi to explore dynamic zonal and power distribution strategies and discover how our smart switch solutions can help you tackle design challenges in next-generation automotive platforms.
URL:https://passive-components.eu/event/simplifying-vehicle-development-with-automotive-ethernet-and-zonal-smart-switch-technologies/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260127T080000
DTEND;TZID=Europe/Prague:20260127T170000
DTSTAMP:20260127T145620Z
CREATED:20260127T145620Z
LAST-MODIFIED:20260127T145620Z
UID:74498-1769500800-1769533200@passive-components.eu
SUMMARY:COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening
DESCRIPTION:COTS devices for Space Missions: Flexible and Cost-Efficient Up-Screening; DOEET Webinar\n\nThursday\, 19th February\n3 pm (CET)\n\nMini-Circuits is the world’s preferred supplier of radio frequency (RF)\, microwave\, and millimeter-wave components and systems. Mini-Circuits provides advanced high-reliability screening and qualification services designed to support mission-critical applications across aerospace\, defense\, space\, and other demanding environments. To enable mission readiness\, Mini-Circuits offers flexible screening flow templates that may be tailored to customer standards by adding or removing tests\, adjusting sample sizes\, and modifying stress conditions such as temperature\, duration\, and humidity based on mission requirements. \nWith a commitment to traceability\, compliance\, and long-term mission reliability\, Mini-Circuits has provided hundreds of up-screened models primarily across our µCeramIQ™ (LTCC)\, Core & Wire\, and PEM technology families. \nThis webinar will focus on the use of custom screening and qualification workflows tailored to customer-provided requirements or their Source Control Drawings (SCDs). The presentation will also highlight Mini-Circuits’ key space-capable technologies and readiness to collaborate with customers to create mission-critical products and applications. \n\n\nAgenda\n\n\n\n\n\nWelcome and Introduction\nAbout Mini-Circuits\nHighReliability Components Screening\nCustomization of Qualifications\nCore Technologies Up-Screening Flows\nQuality Assurance\nSummary Overview\nQ&A\n\nSpeaker \nBoris Benger\n\nPrincipal Applications Engineer \nBoris Benger is a Principal Applications Engineer at Mini-Circuits\, where he supports space up-screening for Mini-Circuits COTS components based on customer reliability requirements. He is a seasoned RF and IF signal processing engineer with extensive expertise in microwave components\, system-level integration\, and custom solutions. He came to Mini-Circuits from L3-Narda-MITEQ\, where he had been legacy MITEQ’s youngest ever Department Head. He has worked extensively on high-performance RF/IF solutions for demanding commercial and defence applications since he entered the electronics industry in 1983.
URL:https://passive-components.eu/event/cots-devices-for-space-missions-flexible-and-cost-efficient-up-screening/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260121T180000
DTEND;TZID=Europe/Prague:20260121T184500
DTSTAMP:20260114T094529Z
CREATED:20260114T094529Z
LAST-MODIFIED:20260114T094529Z
UID:74275-1769018400-1769021100@passive-components.eu
SUMMARY:To Rogowski or not to Rogowski
DESCRIPTION:Rohde & Schwarz Webinar: To Rogowski or not to Rogowski\, that’s the question (North America / Europe)\n\n\nWednesday\, January 21\, 2026 \n\n\n12:00 PM Eastern Standard Time \n\n\n45 minutes \n\n\nThis webinar uncovers the fundamentals of Rogowski coil technology. Our oscilloscope expert together with a guest speaker from Power Electronic Measurements Ltd (PEM) will explore unique characteristics of Rogowski coil technology\, its technical advantages and specific applications where it can be best used in. In the course of the presentation viewers  will learn when and why should Rogowski technology for current measurements be chosen and gain a comprehensive overview of Rogowski probes that are now available for purchase through Rohde & Schwarz. \nThis webinar will cover: \n\nRogowski coil fundamentals\nUnique characteristics and technical advantages of Rogowski probes\nApplications scenarios\nRogowski probe portfolio available from Rohde & Schwarz
URL:https://passive-components.eu/event/to-rogowski-or-not-to-rogowski/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251219T120000
DTEND;TZID=America/New_York:20251219T140000
DTSTAMP:20251113T080720Z
CREATED:20250210T124135Z
LAST-MODIFIED:20251113T080720Z
UID:70084-1766145600-1766152800@passive-components.eu
SUMMARY:External Visual Inspection per MIL-STD-883 TM 2009
DESCRIPTION:External Visual Inspection per MIL-STD-883 TM 2009\nInstructor: Thomas Green \nDescription: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and the instructor explains why the defects are critical to the reliability of the end product. \nTopics include: \n\nWeld and Seal defects\nGlass and ceramic feedthrough defects e.g. meniscus cracking Package marking and pin/lead defects\nInspection Criteria for Microelectronic Packages and Covers Foreign Material Identification and Contamination Control\nReview applicable criteria in JESD 9C\nPlastic Package Defects\n\n 
URL:https://passive-components.eu/event/external-visual-inspection-per-mil-std-883-tm-2009/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251216T170000
DTEND;TZID=Europe/Prague:20251216T180000
DTSTAMP:20251208T084049Z
CREATED:20251208T084049Z
LAST-MODIFIED:20251208T084049Z
UID:73893-1765904400-1765908000@passive-components.eu
SUMMARY:Coaxial Connectors and How to Connect with the PCB
DESCRIPTION:Coaxial Connectors and How to Connect with the PCB\nWebinar by Würth Elektronik\nTuesday\, December 16th 2025 @ 5:00PM CET\n\n\nThis free one-hour webinar presents practical guidance for achieving low-loss connections between coaxial connectors and printed circuit boards. The session covers the most relevant parameters affecting impedance and demonstrates how these factors can influence overall performance. Methods for identifying interference points are discussed\, along with criteria for determining acceptable levels of loss in real-world applications. \n\nAttention is given to the connector characteristics that are most important for maintaining quality\, especially at high frequencies. Live simulations using CST illustrate how adjustments to the PCB layout can impact connection behavior. The presentation also outlines the design process for RF connectors\, providing a clear view of industry best practices.
URL:https://passive-components.eu/event/coaxial-connectors-and-how-to-connect-with-the-pcb/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251215T130000
DTEND;TZID=America/New_York:20251218T151500
DTSTAMP:20251113T080820Z
CREATED:20220909T111655Z
LAST-MODIFIED:20251113T080820Z
UID:58728-1765803600-1766070900@passive-components.eu
SUMMARY:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
DESCRIPTION:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)\nInstructor: Thomas Green \nDescription: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices. Over 250 color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of Pre Cap visual inspection and how to interpret and apply the very latest MIL-STD-883 criteria. \nThe course is intended for quality assurance personnel\, inspectors\, QEs and Process engineers\, component engineers and lead operators and others responsible for inspection of the hardware prior to the final package sealing process. \nThe following is an approximation of what will be covered in each online or “virtual” training session.  \nSession 1: Introduction and Overview \n\nMil Spec Visual Inspection Requirements Flowdown\nComponent ID\nForeign Material or F.O.D. inspection and source requirements\n\nSession 2: Component Attach \n\nTM 2017 Low mag IC/MMIC die and substrate attach inspection criteria and non-planar capacitor/resistor criteria\nSolder Criteria\n\nSession 3: Wire and Ribbon Bonding \n\nTM 2017 Low mag wire and ribbon bond inspection criteria\n\nSession 4: High Mag IC Die and MMIC Inspection and Passives \n\nTM 2010 IC High Mag Inspection criteria\nMIL-STD-750 Die level Inspection Criteria TM 2017 Table 1\nTM 2032 Passive Component inspection criteria for substrates\, capacitors\, inductors and resistors
URL:https://passive-components.eu/event/pre-cap-visual-inspection-per-mil-std-883-tm-2017/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251210T160000
DTEND;TZID=Europe/Prague:20251210T170000
DTSTAMP:20250915T083108Z
CREATED:20250915T083108Z
LAST-MODIFIED:20250915T083108Z
UID:72563-1765382400-1765386000@passive-components.eu
SUMMARY:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization
DESCRIPTION:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization\nWebinar by Würth Elektronik\nWednesday\, December 10th 2025 @ 4:00PM CET\n\n\nCurious about Qi2 wireless power design? Join this webinar to dive into practical development insights and EMC strategies for your next project.\n\nWhat you’ll learn:\n\n·         How to build a Qi2 wireless power transmitter from the ground up – from FET selection to control architecture.\n·         Key features of the WE Qi2 MPP Tx Coil and how to integrate it effectively.\n·         PCB layout tips to boost performance and minimize losses.\n·         How to measure and reduce conducted emissions with smart filter design.\n·         Interactive Q&A session to get your questions answered live.
URL:https://passive-components.eu/event/designing-qi2-wireless-power-systems-practical-development-and-emc-optimization/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251209T120000
DTEND;TZID=America/New_York:20251211T141500
DTSTAMP:20251113T080614Z
CREATED:20220909T110834Z
LAST-MODIFIED:20251113T080614Z
UID:58720-1765281600-1765462500@passive-components.eu
SUMMARY:Space and Military Standards for Hybrids and RF Microwave Modules
DESCRIPTION:Space and Military Standards for Hybrids and RF Microwave Modules\nInstructor: Thomas Green \nDescription: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class K hybrids for military and space applications. \nThe governing document is MIL-PRF-38534 Hybrid Performance Specification\, which in turn further calls out specific test methods in MIL-STD-883L Test Methods and Procedures for Microelectronic Devices. Mil 883 is a collection of destruct and non-destruct test methods used as screening and qualification tests to verify microelectronic performance requirements and to assess the reliability of finished modules. \nThe course is intended for anyone interested in gaining better insight and understanding of the quality and process control requirements for hi reliability space and military products\, specifically component and quality engineers working in this industry. \nTopics include: \nTopic 1: Overview of MIL-PRF-38534 Hybrid Performance Specification \nTopic 2: MIL-PRF-38534 General Hybrid Specification \nTopic 3: Overview of MIL-STD-883 test methods and procedures required for Space qualified Hybrids and RF MMIC Modules \nTopic 4: Group B\, C and D Periodic Inspection Test Methods Failure Analysis Tools and Techniques
URL:https://passive-components.eu/event/space-and-military-standards-for-hybrids-and-rf-microwave-modules/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251203T170000
DTEND;TZID=Europe/Prague:20251203T180000
DTSTAMP:20251128T081133Z
CREATED:20251128T081133Z
LAST-MODIFIED:20251128T081133Z
UID:73807-1764781200-1764784800@passive-components.eu
SUMMARY:The Hidden Secret of the Magnetic Transformer and example of its use
DESCRIPTION:The Hidden Secret of the Magnetic Transformer and example of its use\nFrenetic is hosting a special educational session with Prof. Sam Ben-Yaakov\, one of the most respected voices in magnetics and power electronics. \n\nWed\, Dec 03\n\n\n5:00 PM – 6:00 PM CET\n\n\n\n\n\n\nIn this webinar\, Prof. Ben-Yaakov will explain a fundamental — and often overlooked — property of magnetic transformers. \nYou’ll learn how this principle led to the development of a new magnetic reluctance model and even the invention of a new type of controlled inductor. \nWhat to expect: \n\nA clear explanation of this “hidden” magnetic property\nHow it connects to real transformer behavior\nHow it enables new magnetic modeling approaches\nA practical example of its use\n45–60 minutes of deep insight + Q&A\n\nIf you’re curious about what this hidden property is — and how it may change the way you think about magnetics — you don’t want to miss this session.
URL:https://passive-components.eu/event/the-hidden-secret-of-the-magnetic-transformer-and-example-of-its-use/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251202T120000
DTEND;TZID=Europe/Prague:20251204T141500
DTSTAMP:20251113T081426Z
CREATED:20251113T081426Z
LAST-MODIFIED:20251113T081426Z
UID:73663-1764676800-1764857700@passive-components.eu
SUMMARY:Microwave Packaging Technology
DESCRIPTION:Microwave Packaging Technology\nInstructor: Thomas Green \nDescription: Microwave Hybrids\, MICs\, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments\, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues\, material tradeoffs\, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military\, space and other hi reliability commercial and medical device applications. \nThe course is intended as an introductory to intermediate level course for process engineers\, designers\, quality engineers\, and managers responsible for design and manufacture of microwave hybrids. \n\nTopics include: \nSession 1 \n\nIntroduction to Microwave Technology\nMilitary Requirements Flow Down and Design Guidelines\nManufacturing Assembly Process Overview\nWafer Fabrication Processes\nSubstrate Technology\nThin Film Processes on Ceramic\nMaterial and Process Fundamentals for Component Attach\nEutectic Soldering Processes\n\nSession 2 \n\nDie\, substrate and package compatibility\nThermal Impedance and Importance of Minimizing Junction Temperature\nPackaging Design Considerations\nReview of Defects from the Component Attach Process\nOverview of Common Cleaning Processes and Potential Problems\nWirebonding and Interconnect Process Overview\nGap Welding\nFactors that affect yield and reliability\n\nSession 3 \n\nHermetic Packaging Process Overview\nHermeticity Testing\nNear Hermetic Packaging Options\nDesign for Manufacturability (DFM)
URL:https://passive-components.eu/event/microwave-packaging-technology/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251113T110000
DTEND;TZID=Europe/Prague:20251113T113000
DTSTAMP:20251110T082631Z
CREATED:20251110T082631Z
LAST-MODIFIED:20251110T082631Z
UID:73619-1763031600-1763033400@passive-components.eu
SUMMARY:DC/DC Converters in Automotive Applications
DESCRIPTION:Würth Elektronik Webinar: Bridging the Voltage Gap: DC/DC Converters in Automotive Applications\n\n\n\n\n\n\n\n\n\nThu\, Nov 13\, 2025 11:00 AM – 11:30 AM CET\n\n\n\n\n\n\n\n\nJoin us for an insightful webinar on the silent performers behind modern electrical systems: DC/DC Converters.\n\nIn this webinar\, our experts Daniel Wilder (Product Manager Function-Specific Modules) and Arnaud Wendling (Head of Application Engineering and Product Manager Electronics) explain why these components are essential for reliable power distribution in mobile machines and commercial vehicles.\nYou will learn about the basic principles of common converter types\, their functionality and features\, practical examples from commercial vehicle engineering\, and typical challenges in integration and operation. This webinar offers valuable knowledge and insights from practical experiences.\n\nAgenda:\n1. Introduction\n2. Fundamentals of vehicle electrical systems\n3. DC/DC Converters: types\, features and quality parameters\n4. Application examples & solutions\n5. Live Q&A
URL:https://passive-components.eu/event/dc-dc-converters-in-automotive-applications/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251112T120000
DTEND;TZID=America/New_York:20251113T141500
DTSTAMP:20250728T071303Z
CREATED:20220909T110643Z
LAST-MODIFIED:20250728T071303Z
UID:58718-1762948800-1763043300@passive-components.eu
SUMMARY:Microelectronic Packaging Failure Modes and Analysis
DESCRIPTION:VIRTUAL: Microelectronic Packaging Failure Modes and Analysis\nInstructors: Thomas Green and Robert Lowry \nDescription: \nThe design and packaging of microelectronic devices such as hybrids\, RF microwave modules\, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing\, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs. \nThe instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid\, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and\, resist the temptation to rush to judgment\, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. \nThe course is intended for FA engineers\, component engineers\, reliability engineers\, design\, quality and process engineers involved in microelectronic packaging. \nTopics include: \n\nIntroduction to Microelectronic Packaging\nTerminology and Product Definitions\nTypical Package Related Defects and Failures\nFailure Analysis (FA) Process Flow\nSpecific Examples of Package Related Failures and FA Investigation\nFailure Analysis Tools and Techniques
URL:https://passive-components.eu/event/microelectronic-packaging-failure-modes-and-analysis/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251112T110000
DTEND;TZID=Europe/Prague:20251112T120000
DTSTAMP:20251029T173433Z
CREATED:20251020T071645Z
LAST-MODIFIED:20251029T173433Z
UID:73279-1762945200-1762948800@passive-components.eu
SUMMARY:PCB Design: Impedance is for everyone!
DESCRIPTION:Würth Elektronik Webinar: Impedance is for everyone!\n\n\n\n\n\n\n\n\n\nWed\, Nov 12\, 2025 11:00 AM – 12:00 PM CET\n\n\n\n\n\n\n\n\nAs data rates increase\, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion\, the impedance requirements of the assembly or application must be properly considered in the PCB design. In this webinar\, we will show how an impedance-defined stackup is created based on simulation results and electrical boundary conditions – a stackup precisely matched to the required impedance. The key lies in careful design and manufacturing\, including verification through electrical measurements on test coupons when needed. Building on this foundation\, we will demonstrate how Design for Manufacturing (DfM) and tolerance management can improve production.\n\nJoin our webinar on November 12\, 2025\, at 11:00 a.m.\, and learn about:\n\nThe fundamentals of impedance and signal integrity\nHow to create an impedance-defined stackup for the technologies • BASIC • MICROVIA.hdi and • STARR.flex\nDesign for Manufacturing and tolerance considerations\nPractical tips and tricks from the field\nWhen to switch to high-speed base materials\nA look at special applications\, such as impedance in antenna structures Gain a comprehensive understanding of different PCB technologies and their specific requirements\nall from a holistic perspective: Impedance is for everyone!\n\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students.
URL:https://passive-components.eu/event/pcb-design-impedance-is-for-everyone/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251111T170000
DTEND;TZID=Europe/Prague:20251111T180000
DTSTAMP:20251029T173129Z
CREATED:20251029T173129Z
LAST-MODIFIED:20251029T173129Z
UID:73460-1762880400-1762884000@passive-components.eu
SUMMARY:Industrial Applications Demand More from Interconnects in Next-Gen Designs
DESCRIPTION:Industrial Applications Demand More from Interconnects in Next-Gen Designs\nby Samtec \nTuesday\, November 11\, 2025 · 5:00 p.m. CET \nNeed to specify interconnects for industrial applications like automation\, robotics\, embedded vision\, IoT\, lighting\, smart cities\, grids\, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting the most suitable rugged interconnects for your industrial products. \nTopics covered include: \n\nMechanical considerations: shock and vibration\, plating\, mechanical strength of the connector on the PCB\, secure coupling\nElectrical considerations: current carrying capacity\, designs for high-speed applications\nEnvironmental considerations: performance in harsh conditions\, design flexibility\, protection against dust and moisture\n\nSpeaker: \n\n\n\nJan Hrouda \n\nIndustry Manager for Industrial Applications\n\n\n\n\nJan Hrouda\, a native of Germany\, completed his B.S. in International Business at Aquinas College in Grand Rapids\, Michigan. After joining Samtec in 1996\, he served in various roles\, including Customer Service\, Application-Specific Engineering
URL:https://passive-components.eu/event/industrial-applications-demand-more-from-interconnects-in-next-gen-designs/
LOCATION:virtual
END:VEVENT
END:VCALENDAR