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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251015T200000
DTEND;TZID=Europe/Prague:20251015T203000
DTSTAMP:20260520T032751
CREATED:20251014T070248Z
LAST-MODIFIED:20251014T070248Z
UID:73062-1760558400-1760560200@passive-components.eu
SUMMARY:Planar Design & Simulation
DESCRIPTION:Planar Design & Simulation – New tool reveal\nIn this Frenetic session leaded by our CEO Chema Molina and Jonas Müehlethaler\, CTO at Frenetic\, we will unveil our new Planar Design and Simulation tool\, showing how you can design\, specify\, and simulate planar magnetics directly in just minutes. \n\nWed\, Oct 15\n\n\n8:00 PM – 8:30 PM CET
URL:https://passive-components.eu/event/planar-design-simulation/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251014T160000
DTEND;TZID=Europe/Prague:20251014T170000
DTSTAMP:20260520T032751
CREATED:20250923T083357Z
LAST-MODIFIED:20250923T083357Z
UID:72652-1760457600-1760461200@passive-components.eu
SUMMARY:Smart Sensors\, Smarter AI: Building Reliable Edge Systems
DESCRIPTION:Smart Sensors\, Smarter AI: Building Reliable Edge Systems\, Würth Elektronik Webinar\nTuesday\, October 14th 2025 @ 4:00PM CEST \nAs the demand for Edge AI deployments continues to grow\, ensuring the reliability and performance of these systems is more crucial than ever. In this webinar\, we’ll explore the intersection of Edge AI processing and electromagnetic compatibility (EMC) / electromagnetic interference (EMI) testing. We’ll delve into the world of 10BASE-T1L with PoDL transmission\, sensor board design\, and practical EMC/EMI challenges faced during laboratory testing. Learn how to overcome these obstacles and deploy robust\, high-performing Edge AI systems that drive real-world results. \nSpeakers \nThomas Mauer\nSystem Engineer\nThomas Mauer is a System Engineer with Texas Instruments in Germany.\n\nOctavian Stroe\nProduct Definition Engineer\nAs a Product Definition Engineer at Würth Elektronik\, Octavian is a multidisciplinary engineer with deep expertise in sound engineering\, audio electronics\, and mechanical design. He holds a degree in Sound Engineering with a specialization in audio electronics from the University of Huddersfield and a master’s degree with a focus on optical compression.
URL:https://passive-components.eu/event/smart-sensors-smarter-ai-building-reliable-edge-systems/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251008T110000
DTEND;TZID=Europe/Prague:20251008T120000
DTSTAMP:20260520T032751
CREATED:20250923T083020Z
LAST-MODIFIED:20250923T083020Z
UID:72650-1759921200-1759924800@passive-components.eu
SUMMARY:PCB Online Shop – simply “Made in Germany” by Würth Elektronik
DESCRIPTION:PCB Online Shop – simply “Made in Germany” by Würth Elektronik\n  \n  \nWed\, Oct 8\, 2025 11:00 AM – 12:00 PM CEST \nDo you know this situation? It’s late at night; the PCB layout is finally finished – but the project is already behind schedule. The trade fair with the product launch is coming up\, and prototypes are needed as quickly as possible. Now every hour counts: order easily\, have it manufactured securely\, get it delivered fast. This is exactly where the WEdirekt Online Shop from Würth Elektronik comes in. In our webinar\, we’ll show you live how to order prototypes and small series without detours – from data upload to the express option. \nLook forward to our webinar with: \n\nInsights into the ordering proces – demonstrated live\nTips on how prototypes can seamlessly transition into series production\nAnswers to your questions: our German service team is there for you\nA first glimpse of how API integration will make ordering even easier in the future\nPlus: discover new possibilities we are currently preparing and how you as a developer\, university\, or company can benefit from them\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students. \n  \n 
URL:https://passive-components.eu/event/pcb-online-shop-simply-made-in-germany-by-wurth-elektronik/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20250930T120000
DTEND;TZID=America/New_York:20251002T140000
DTSTAMP:20260520T032751
CREATED:20220909T111849Z
LAST-MODIFIED:20250728T071547Z
UID:58730-1759233600-1759413600@passive-components.eu
SUMMARY:MIL-Std-883 TM 2010
DESCRIPTION:MIL-STD-883 TM 2010\nInstructor: Thomas Green \nDescription: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual inspection is a flow down requirement from Mil-Prf-38535. The primary focus of this session will be on the “low mag” visual requirements for component attach and wire bond\, which differ from the TM 2017 hybrid visual inspection criteria. TM 2010 also contains additional die attach and wire bond requirements not addressed in TM 2017. We will also briefly review the high mag inspection requirements for ICs and MMICs with a special emphasis on Class S products. \nTopics include: \n\nMil-Prf-38535 Integrated Circuit (Microcircuits) General Spec flow down\nrequirements for visual inspection\nLow Mag Criteria (30-60X)\nDie Attach(eutectic and non-eutectic criteria)\nWirebond General (gold ball\, wedge\, and tailless)\nRebonding of monolithic devices.\nFlip chip solder bump die (para 3.2.1.6)\nForeign material (para. 3.2.5)\nForeign Material Die Coated devices (para 3.2.5.1)\nHigh Mag Criteria (special emphasis on Class S)\nPara 3.1.1-3.4 High Mag IC and MMIC Inspection\nPara. 3.1.6. Film resistors\nPara 3.1.7 Laser trimmed thin film resistors\nFlip Chip Defects Scribe and Edge Cracks\nClass Review with Q&A
URL:https://passive-components.eu/event/mil-std-883-tm-2010/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250916T200000
DTEND;TZID=Europe/Prague:20250916T210000
DTSTAMP:20260520T032751
CREATED:20250916T070117Z
LAST-MODIFIED:20250916T070117Z
UID:72573-1758052800-1758056400@passive-components.eu
SUMMARY:Reduce SMT Parasitic Design Failures with Innovative Filter Topologies
DESCRIPTION:Reduce SMT Parasitic Design Failures with Innovative Filter Topologies\n\nThis webinar explores strategies for optimizing SMT filter designs\, addressing spurious responses\, parasitic behaviors\, and PCB layout challenges using Cadence’s Microwave Office and Modelithics simulation models to ensure accurate and reliable performance. \n\n\n\nSeptember 16\, 8:00 PM — 9:00 PM CEST \n\n\n\n\n\nJoin our webinar to discover challenges and optimization strategies for designing reliable and efficient filters using SMT capacitors and inductors. A lumped prototype is monotonic in the stopbands\, while an SMT filter may have spurious responses\, which can be affected by topology changes and capacitor placement. Additionally\, simple S-parameter representations do not account for variations in parasitic behavior due to substrate thickness\, dielectric constant\, and solder pad dimensions. Ultimately\, PCB layout parasitics can lead to significant differences between simulations based on lumped prototype values and final measured results based on actual SMT component values\, leading to potential product delays and/or system failure. \n  \nLearn how to manage and modify spurious performances effectively through innovative SMT filter topologies. Gain insights into how PCB layout contributes to parasitic behaviors that affect your SMT component values. Understand how to enhance your design’s performance with Cadence’s Microwave Office software and highly accurate Modelithics simulation models\, ensuring your designs are right the first time. \n\n\n\n\n\n\n\n\n\nSpeakers \n\nDavid Vye\, Product Management Director\, Cadence \nDan Swanson\, Owner\, DGS Associates\, LLC \nChris DeMartino\, Applications Engineer\, Modelithics
URL:https://passive-components.eu/event/reduce-smt-parasitic-design-failures-with-innovative-filter-topologies/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250916T170000
DTEND;TZID=Europe/Prague:20250916T180000
DTSTAMP:20260520T032751
CREATED:20250818T105706Z
LAST-MODIFIED:20250818T105706Z
UID:72392-1758042000-1758045600@passive-components.eu
SUMMARY:EMI Shielding Challenges
DESCRIPTION:EMI Shielding Challenges\nWebinar by Würth Elektronik\nTuesday\, September 16th 2025 @ 5:00PM CEST\n\nExplore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics. This webinar will dig into practical strategies in housing and PCB for mitigating EMI challenges\, never losing sight of solutions for emerging technologies like 5G\, IoT\, Industry IoT\, etc.\, and the challenge they bring to Electromagnetic Compatibility.
URL:https://passive-components.eu/event/emi-shielding-challenges/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250903T153000
DTEND;TZID=Europe/Prague:20250903T173000
DTSTAMP:20260520T032751
CREATED:20250815T082948Z
LAST-MODIFIED:20250815T082948Z
UID:72385-1756913400-1756920600@passive-components.eu
SUMMARY:How to Choose Your Magnetic Supplier
DESCRIPTION:How to Choose Your Magnetic Supplier\n\nWed 03. 9.\n\n\n15:30 – 17:30 CEST\n\nChoosing the right magnetic supplier can define the success — or failure — of your project. \nIn this special 2-hour webinar\, we’ll bring together three perspectives from across the industry: \n\nSupplier selection & production insights: How to go from engineering requirements to mass production\, balancing cost\, regulatory compliance\, environmental footprint\, and supply chain risks.\nAdvanced magnetic materials expertise: Strategies for selecting soft magnetic materials in transformers\, inductors\, and filters for high-performance power electronics.\nReal-world manufacturer’s case study: See how a manufacturer used Frenetic Magnetic Simulator to design a component\, and how that design is now offered to the market.\n\nSpeakers: \n\nRafael Jiménez\, Systems Chief Engineer Electrification Expert\nFlorian Fenske & Jan Wanior from MB Electronics\nMagnetics Manufacturer\, leader in the industry (TBD)\n\nModerator: Dr. Chema Molina (CEO\, Frenetic)
URL:https://passive-components.eu/event/how-to-choose-your-magnetic-supplier/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250827T170000
DTEND;TZID=Europe/Prague:20250827T180000
DTSTAMP:20260520T032751
CREATED:20250815T075726Z
LAST-MODIFIED:20250815T075726Z
UID:72383-1756314000-1756317600@passive-components.eu
SUMMARY:Capacitor Assemblies for High-Power Circuit Designs
DESCRIPTION:Capacitor Assemblies for High-Power Circuit Designs\nDate: August 27\, 2025\nTime: 11 AM EDT (8 AM PDT / 5:00 PM CEST)\n\n\n\nAttendees will learn how Knowles’ RF capacitor assemblies deliver superior performance in high-frequency and high-power circuit designs through optimal low-loss\, high-Q ceramic materials and innovative assembly configurations. Real-world examples and case studies will show how engineers can address common design challenges\, and surviving harsh environments\, by leveraging Knowles’ expertise and vertically-integrated solutions \n\nThis webinar will showcase how Knowles’ RF capacitor assemblies redefine what’s possible in RF and high-power electronics by combining advanced ceramic dielectrics\, precision stacking technology\, and vertical integration within manufacturing. Attendees will explore design strategies for improving circuit efficiency\, EMI suppression\, and energy density using Knowles’ broad portfolio\, including High Q RF Capacitor assemblies. The session will break down technical specifications\, selection criteria\, and real-world application examples. Participants will also discover how Knowles’ ability to customize mechanical and electrical attributes can solve specific engineering problems—delivering greater reliability and regulatory peace of mind. By joining\, attendees can hear directly from application experts and come away with practical tools and insights to enhance performance\, accelerate product development\, and differentiate in competitive markets. \n\n\nKey Takeaways\n\nUnderstand the critical performance parameters that make RF capacitor assemblies a preferred choice for demanding applications in aerospace\, industrial\, and medtech sectors.\nGain insight into customizable solutions—such as tailored stack sizes\, voltage ratings\, and mechanical formats—enabling optimized designs for board space constraints and harsh operating conditions.\nLearn how collaborating with Knowles’ application engineers leads to accelerated prototyping\, reduced risk of field failure\, and streamlined paths to regulatory compliance and high-reliability deployments.\n\n\n\nSpeaker\nMatt Ellis\, Senior Director of Product Line Management\, HIREL\, Knowles
URL:https://passive-components.eu/event/capacitor-assemblies-for-high-power-circuit-designs/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20250820T160000
DTEND;TZID=Europe/Prague:20250820T163000
DTSTAMP:20260520T032751
CREATED:20250819T145002Z
LAST-MODIFIED:20250819T145002Z
UID:72412-1755705600-1755707400@passive-components.eu
SUMMARY:Pulse transformer design for RLC loads
DESCRIPTION:Pulse transformer design for RLC loads\n\nWed 20. 8.\n\n\n16:00 – 16:30 CET\n\noin this session on a pulse driving applications. An RLC load can be anything really\, like a gate driving scheme\, a Butterworth-Van Dyke transducer model\, maybe parasitic inductances that form an RLC network and so on. Transformer power losses modeling is key to the ‘R’ element of these circuits. \nSpeaker: Sotiris Zorbas\, Power Electronics Design Engineer expert at Frenetic
URL:https://passive-components.eu/event/pulse-transformer-design-for-rlc-loads/
LOCATION:virtual
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