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SUMMARY:Microelectronic Packaging Failure Modes and Analysis
DESCRIPTION:VIRTUAL: Microelectronic Packaging Failure Modes and Analysis\nInstructors: Thomas Green and Robert Lowry \nDescription: \nThe design and packaging of microelectronic devices such as hybrids\, RF microwave modules\, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing\, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs. \nThe instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid\, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and\, resist the temptation to rush to judgment\, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. \nThe course is intended for FA engineers\, component engineers\, reliability engineers\, design\, quality and process engineers involved in microelectronic packaging. \nTopics include: \n\nIntroduction to Microelectronic Packaging\nTerminology and Product Definitions\nTypical Package Related Defects and Failures\nFailure Analysis (FA) Process Flow\nSpecific Examples of Package Related Failures and FA Investigation\nFailure Analysis Tools and Techniques
URL:https://passive-components.eu/event/microelectronic-packaging-failure-modes-and-analysis/
LOCATION:virtual
CATEGORIES:TJGreen
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DTSTART;TZID=Europe/Prague:20251112T110000
DTEND;TZID=Europe/Prague:20251112T120000
DTSTAMP:20251029T173433Z
CREATED:20251020T071645Z
LAST-MODIFIED:20251029T173433Z
UID:73279-1762945200-1762948800@passive-components.eu
SUMMARY:PCB Design: Impedance is for everyone!
DESCRIPTION:Würth Elektronik Webinar: Impedance is for everyone!\n\n\n\n\n\n\n\n\n\nWed\, Nov 12\, 2025 11:00 AM – 12:00 PM CET\n\n\n\n\n\n\n\n\nAs data rates increase\, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion\, the impedance requirements of the assembly or application must be properly considered in the PCB design. In this webinar\, we will show how an impedance-defined stackup is created based on simulation results and electrical boundary conditions – a stackup precisely matched to the required impedance. The key lies in careful design and manufacturing\, including verification through electrical measurements on test coupons when needed. Building on this foundation\, we will demonstrate how Design for Manufacturing (DfM) and tolerance management can improve production.\n\nJoin our webinar on November 12\, 2025\, at 11:00 a.m.\, and learn about:\n\nThe fundamentals of impedance and signal integrity\nHow to create an impedance-defined stackup for the technologies • BASIC • MICROVIA.hdi and • STARR.flex\nDesign for Manufacturing and tolerance considerations\nPractical tips and tricks from the field\nWhen to switch to high-speed base materials\nA look at special applications\, such as impedance in antenna structures Gain a comprehensive understanding of different PCB technologies and their specific requirements\nall from a holistic perspective: Impedance is for everyone!\n\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students.
URL:https://passive-components.eu/event/pcb-design-impedance-is-for-everyone/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20251111T170000
DTEND;TZID=Europe/Prague:20251111T180000
DTSTAMP:20251029T173129Z
CREATED:20251029T173129Z
LAST-MODIFIED:20251029T173129Z
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SUMMARY:Industrial Applications Demand More from Interconnects in Next-Gen Designs
DESCRIPTION:Industrial Applications Demand More from Interconnects in Next-Gen Designs\nby Samtec \nTuesday\, November 11\, 2025 · 5:00 p.m. CET \nNeed to specify interconnects for industrial applications like automation\, robotics\, embedded vision\, IoT\, lighting\, smart cities\, grids\, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting the most suitable rugged interconnects for your industrial products. \nTopics covered include: \n\nMechanical considerations: shock and vibration\, plating\, mechanical strength of the connector on the PCB\, secure coupling\nElectrical considerations: current carrying capacity\, designs for high-speed applications\nEnvironmental considerations: performance in harsh conditions\, design flexibility\, protection against dust and moisture\n\nSpeaker: \n\n\n\nJan Hrouda \n\nIndustry Manager for Industrial Applications\n\n\n\n\nJan Hrouda\, a native of Germany\, completed his B.S. in International Business at Aquinas College in Grand Rapids\, Michigan. After joining Samtec in 1996\, he served in various roles\, including Customer Service\, Application-Specific Engineering
URL:https://passive-components.eu/event/industrial-applications-demand-more-from-interconnects-in-next-gen-designs/
LOCATION:virtual
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