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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260310T170000
DTEND;TZID=Europe/Prague:20260310T180000
DTSTAMP:20260426T122219
CREATED:20260310T171805Z
LAST-MODIFIED:20260310T171805Z
UID:75049-1773162000-1773165600@passive-components.eu
SUMMARY:Simplifying design with easy-to-configure modular connectors
DESCRIPTION:Simplifying design with easy-to-configure modular connectors featuring Hyperboloid contact technology\nDate: April 14\, 2026\nTime: 11:00 AM ET | 10:00 AM CT | 8:00 AM PT\nDuration: 60 Minutes \nPresented By: \nJoydip Sanyal  (Product Group Manager\, General Industrial and Aerospace and Defense  – Connectors BU\, Smiths Interconnect) \nSmiths Interconnect’s new optimized\, versatile and high-density modular connector series is rugged\, easy to configure and employs a do-it-yourself system. The connector series is based on the principle of building blocks which consists mainly of two elements: modules and frames. It’s flexible\, which allows the ability to mix and match modules for signal\, power\, coaxial\, pneumatic and high-speed data contact technologies into different configurations within a single connector frame including a vast selection of hoods. \nA key feature of the series is the high reliability due to hyperboloid contacts which qualify it to operate for high vibration applications like missile launchers or test and measurement use that require up to 100\,000 mating cycles to allow high mean time between failure reducing downtime in operations. \nThe series was recently enhanced with the introduction of the new Cat5e and Cat6A ethernet data in accordance with IEEE 802.3 transmission modules. These new modules combine the proven technical characteristics of the hyperboloid contact with the use of high-quality and compliant insulator material – like the polycarbonate family – to offer industry compliance and high performance. Customers can now easily configure modular connectivity solutions for their designs using to the new online configurator for the fully integrated modular L series. \nKey takeaways: \n\nModular Design\nVersatility and Customization\nHigh Reliability\nEnhanced Data Capability\nNew Online Configurator
URL:https://passive-components.eu/event/simplifying-design-with-easy-to-configure-modular-connectors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260319T130000
DTEND;TZID=America/Chicago:20260319T140000
DTSTAMP:20260426T122219
CREATED:20260305T075016Z
LAST-MODIFIED:20260305T075016Z
UID:74998-1773925200-1773928800@passive-components.eu
SUMMARY:Smart Consideration of Inductor Thermal Performance
DESCRIPTION:Smart Consideration of Inductor Thermal Performance\n\nThursday\, March 19\, 2026 \n\n\n1:00 PM Central Daylight Time \nnlock the secrets to informed power inductor selection in our upcoming webinar\, Smart Consideration of Inductor Thermal Performance. This event is designed for professionals like you who are eager to optimize their DC-DC converter performance by better use of inductors. \nWhat You’ll Learn:\n\nKeys that make inductor thermal performance different from other devices.\nStrategies for accurate calculation of inductor thermal performance.\nPractical tips and real-world examples.\n\nSpeaker\nLen Crane has more than 45 years of high frequency switching power inductor design and application experience with Coilcraft. Len focuses on assisting customers with continuing magnetics education and consulting on specific projects.
URL:https://passive-components.eu/event/smart-consideration-of-inductor-thermal-performance/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260321
DTEND;VALUE=DATE:20260322
DTSTAMP:20260426T122219
CREATED:20260120T144436Z
LAST-MODIFIED:20260120T144436Z
UID:74316-1774051200-1774137599@passive-components.eu
SUMMARY:PSMA Capacitor Workshop 2026
DESCRIPTION:Capacitors in Modern Power Electronics – Design\, Reliability\, Sustainability\nSaturday March 21 2026\nPrior to APEC 2026\nHenry B. Gonzales Convention Center\nSan Antonio\, TX 78205 \nWelcome to the PSMA Capacitor Committee Workshop 2026 \nThe PSMA Capacitor Committee\, in cooperation with IEEE PELS\, warmly invites you to the next Capacitor Workshop\, which will take place on Saturday\, March 21\, 2026\, at the Henry B. González Convention Center in San Antonio\, Texas. This workshop has become a well-established pre-event of APEC week and is recognized as one of the central gatherings for designers\, manufacturers\, researchers\, and users of capacitors. \nFollowing successful workshops in Anaheim\, San Antonio\, Houston\, we are excited to present another high-level program in 2026\, bringing together the state of the art in technology\, the latest research results\, and practical application insights. Whether you are a power electronics designer\, component purchaser\, researcher\, or end user\, this workshop offers deep technical knowledge\, inspiring perspectives\, and valuable networking opportunities. \nThe 2026 agenda will once again feature world-class speakers. Planned presentations include\, but are not limited to: \n\nElectrolytic Capacitor Technology in Multilevel Inverters\nCapacitor Selection for Resonant Converter Design\n3 Days to 30 Seconds Capacitor Array Design\nModeling and Validation for Class-2 MLCCs\nLifetime Analysis of Electrolytics Including Mission Profiles\nDesigning for Environmental Compatibility – Towards Sustainable Power Electronics\nWhy Capacitors Do What They Do\nSwitched-Capacitor Based Topologies and Circuit Techniques for High-Performance Power Conversion
URL:https://passive-components.eu/event/psma-capacitor-workshop-2026/
LOCATION:San Antonio\, Texas\, Henry B. Gonzales Convention Center\, San Antonio\, TX\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260324T090000
DTEND;TZID=Europe/Prague:20260324T100000
DTSTAMP:20260426T122219
CREATED:20260317T093746Z
LAST-MODIFIED:20260317T093746Z
UID:75097-1774342800-1774346400@passive-components.eu
SUMMARY:Power protection in the digital age - eFuse and hot-swap strategies for modern data center design
DESCRIPTION:Infineon Webinar: Power protection in the digital age – eFuse and hot-swap strategies for modern data center design\nMarch 24th – 2 sessions available \nSession 1: March 24th\, 2026\, 9am (CET) \nSession 2: March 24th\, 2026\, 6pm (CET) \nThis webinar provides an in-depth discussion about the challenges posed by data center and AI data center infrastructure to power system reliability and availability. It then explores innovative eFuse and hot swap protection technologies designed to address these challenges. The hot-swap controller and eFuse features ensuring reliable and efficient power delivery in data centers and AI applications are then highlighted. \nAgenda: \nPurpose of protection ICs\nInfineon’s hot-swap controller portfolio & key features\nInfineon’s eFuse portfolios & key features\nProtection ICs collaterals and support \n 
URL:https://passive-components.eu/event/power-protection-in-the-digital-age-efuse-and-hot-swap-strategies-for-modern-data-center-design/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260408T170000
DTEND;TZID=Europe/Prague:20260408T180000
DTSTAMP:20260426T122219
CREATED:20260401T105742Z
LAST-MODIFIED:20260401T105742Z
UID:75449-1775667600-1775671200@passive-components.eu
SUMMARY:Trade Secrets of the Flyback Converter
DESCRIPTION:Trade Secrets of the Flyback Converter: Theory and Simulation – by Chris Basso\n\n📅 April 8th \n🕔 5:00 PM (Spain / France) | 11:00 AM EDT | 8:00 AM PDT \n⏱️ Duration: 1 hour \n\n\n\nSimulation plays a critical role in power supply design\, but using it effectively requires more than just running models. \nIn this session\, Christophe Basso\, Business Development Manager at Future Electronics and author of Simulating Switching Converters with LTspice (2025)\, will share practical approaches to simulating switching converters using LTspice. With over 25 years of experience in power electronics and a long track record in developing PWM controllers and publishing technical books\, Christophe will guide you through how simulation can support real design decisions. \nThis session is especially relevant for engineers looking to strengthen their understanding of converter behavior through simulation and reduce uncertainty during the design process. \n  \nWhat we’ll cover \n\nHow to approach switching converter simulation using LTspice\nKey considerations when modeling real converter behavior\nCommon pitfalls when simulating power supplies\nHow simulation supports validation before hardware testing\nPractical insights based on real design experience
URL:https://passive-components.eu/event/trade-secrets-of-the-flyback-converter/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260421T160000
DTEND;TZID=Europe/Prague:20260421T170000
DTSTAMP:20260426T122219
CREATED:20260216T081018Z
LAST-MODIFIED:20260216T081018Z
UID:74766-1776787200-1776790800@passive-components.eu
SUMMARY:Heatsink Solutions: Thermal Management in electronic devices
DESCRIPTION:Heatsink Solutions: Thermal Management in our electronic devices\nWürth Elektronik eiSos\n\nTuesday\, April 21st 2026 @ 4:00PM CEST\n\nThermal management is a challenge for any electronics designer. Among the possible solutions\, heatsinks are a key element that aids in heat dissipation. Combining them with thermal materials achieves optimal contact between the component and the cooling device. \nIn this webinar\, we’ll show you what a heatsink is for\, how to choose one\, and the importance of combining it with a thermal interface material.
URL:https://passive-components.eu/event/heatsink-solutions-thermal-management-in-electronic-devices/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260422T170000
DTEND;TZID=Europe/Prague:20260422T173000
DTSTAMP:20260426T122219
CREATED:20260416T111954Z
LAST-MODIFIED:20260416T111954Z
UID:75595-1776877200-1776879000@passive-components.eu
SUMMARY:Magnetics in a high frequency GaN era
DESCRIPTION:Magnetics in a high frequency GaN era\nFrenetic Webinar \nWednesday\, April 22\, 5:00 PM – 5:30 PM \nGaN technology has pushed switching frequencies into the MHz range\, fundamentally changing the constraints on magnetic component design. \nAs AI data centers scale toward multi-100kW racks\, and even 1MW in the near horizon\, power architectures are evolving fast: fewer stages\, higher frequencies\, and increasing pressure on every component in the chain. \nBut what does this really mean for magnetics? \nIn this webinar\, our Power Electronics expert Sotiris Zorbas\, will examine the modeling requirements and common pitfalls in high-frequency power magnetics\, and how engineers can keep up with the pace of semiconductor innovation.
URL:https://passive-components.eu/event/magnetics-in-a-high-frequency-gan-era/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260422T170000
DTEND;TZID=Europe/Prague:20260422T180000
DTSTAMP:20260426T122219
CREATED:20260416T082736Z
LAST-MODIFIED:20260416T082736Z
UID:75564-1776877200-1776880800@passive-components.eu
SUMMARY:Derating Tantalum\, Film\, and Ceramic Capacitors
DESCRIPTION:Designing for Reliability: Derating Tantalum\, Film\, and Ceramic Capacitors\nEvans Group Webinar \nWed\, Apr 22\, 2026 5:00 PM CEST\nProper capacitor derating is a foundational reliability practice in aerospace and defense electronics\, where component stress margins directly affect long-term performance and mission readiness.This webinar provides a practical review of derating guidelines for tantalum\, film\, and ceramic capacitors\, with emphasis on volage derating\, temperature effects\, ripple current limits\, and the interaction between electrical stress and failure mechanisms. Rather than broad rules of thumb\, the session focuses on how derating recommendations vary by dielectric system and construction\, and how those differences influence real-world design decisions. \n  \nAttendees will gain a clearer understanding of how to apply technology-specific derating strategies within high-reliability designs\, balancing performance\, size\, efficiency\, and risk.The discussion will include application considerations relevant to aerospace and defense environments\, helping engineers evaluate tradeoffs and implement defensible component selection criteria. \n  \nThis Grid webinar is presented by Misha Pierre-Mike\, Director of Business Development at the Evans Group.
URL:https://passive-components.eu/event/derating-tantalum-film-and-ceramic-capacitors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260427T150000
DTEND;TZID=Europe/Prague:20260427T160000
DTSTAMP:20260426T122219
CREATED:20260423T083949Z
LAST-MODIFIED:20260423T083949Z
UID:75652-1777302000-1777305600@passive-components.eu
SUMMARY:Commercial Space Screening Approach for Agile\, High-Reliability Payloads
DESCRIPTION:Commercial Space Screening Approach for Agile\, High-Reliability Payloads\nApril 27th at 15:00 CET \n\nAs the Space market evolves and accelerates\, mission designers need space-capable electronics that balance performance\, reliability\, and affordability\, without sacrificing speed to deployment.In this webinar\, we’ll explore ADI’s approach to supporting New Space programs through our purpose-built screening flows: Commercial Space Low (CSL) and Commercial Space High (CSH). Attendees will learn how these complementary screening paths deliver meaningful size\, weight\, and cost reductions compared to traditional space-grade solutions\, while maintaining confidence in reliability and capability. We’ll discuss how form\, fit\, and function compatibility across CSL\, CSH\, and standard commercial products enables flexible design choices tailored to diverse mission profiles and timelines. \nAttendees will also get the chance to preview ADI’s ongoing product development efforts aimed at advancing next-generation radio and radar payload capabilities for space applications. \n\n\n\n\nAgenda\n\n\n\n\n\nSection 1: Analog Devices (ADI) Company Overview\nSection 2: Space Capabilities & Product Development Strategy Overview\nSection 3: ADI Commercial Space Qualification Process & Flows\nSection 4: Summary of Recent Releases and Near-Term Developments
URL:https://passive-components.eu/event/commercial-space-screening-approach-for-agile-high-reliability-payloads/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260429T100000
DTEND;TZID=America/Chicago:20260429T110000
DTSTAMP:20260426T122219
CREATED:20260415T141334Z
LAST-MODIFIED:20260415T141334Z
UID:75544-1777456800-1777460400@passive-components.eu
SUMMARY:SEPIC Design Done Right
DESCRIPTION:SEPIC Design Done Right\nDigiKey\, Analog Devices and YAGEO webinar \nWednesday\, April 29\, 2026\, 10:00 AM CDT (1 hour) \nAs power architectures become more flexible and input voltages less predictable\, designers face growing pressure to deliver converters that can operate reliably across wide operating ranges without adding unnecessary complexity. SEPIC converters are often the topology of choice in these scenarios\, enabling non-inverting operation whether the input voltage sits above\, below\, or crosses the output\, but achieving a robust design requires far more than selecting the right topology. \nAs we delve into the intricate world of SEPIC converter design\, this event will focus on: \n\nUnderstanding electrical stress\, ripple current\, EMI\, and thermal performance: Discover how these critical factors intersect and impact your design choices.\nInductor coupling strategies and coupling capacitor behavior: Learn how these elements significantly influence efficiency\, noise\, and long-term reliability\, often becoming the limiting factors in production designs.\nPractical design constraints and component limitations: Gain insights into how real-world conditions shape SEPIC implementations and how to navigate these challenges effectively.\nAdvanced design tools: Explore the power of LTpowerCAD\, LTSPICE\, and the YSIM Capacitance Tool\, which can elevate the precision and reliability of your designs.\n\nNote: If you can’t attend the live webinar\, be sure to still register as we’ll send you the recording afterward! \nSpeakers: \nPiyu Dhaker\, Staff Applications Engineer\, Analog Devices\, Inc. \n\n\nPiyu Dhaker is a Staff Applications Engineer at Analog Devices\, specializing in power products. She holds a Master’s degree in Electrical Engineering from San Jose State University and has been with ADI since 2007. Her career spans a broad spectrum\, from developing test solutions for power management devices to providing application support to key automotive customers. In her current role\, she focuses on supporting broad-market power management applications. \nSimon Ruening\, Global Technical Marketing Manager\, Yageo Group \n\n\nSimon is a highly accomplished professional with a background in engineering and business. Currently serving as Technical Marketing Manager for YAGEO Group\, he combines technical expertise with strong problem-solving skills to provide valuable support to clients and drive successful implementations. With a BSEE from UTD and an MBA from UNT\, Simon has excelled in various roles\, including seven years as a design engineer. \nAlexander Nebel\, Technical Marketing Manager – EMEA\, Yageo Group \n\n\nAlexander is the Technical Marketing Manager in EMEA at YAGEO Group since the beginning of 2024. He worked as Field Application Engineer for more 15 years at different passive component manufacturers. Alexander started at KEMET Electronics in 2017 as Field Application Engineer and after the acquisition by YAGEO\, was responsible for all products of the YAGEO Group.
URL:https://passive-components.eu/event/sepic-design-done-right/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260430T100000
DTEND;TZID=America/Chicago:20260430T110000
DTSTAMP:20260426T122219
CREATED:20260423T074315Z
LAST-MODIFIED:20260423T074315Z
UID:75645-1777543200-1777546800@passive-components.eu
SUMMARY:Programming Embedded Systems
DESCRIPTION:DigiKey and Microchip to Host Educational Webinar on Programming Embedded Systems\nFree webinar to introduce two ways of programming hardware \nThursday\, April 30\, 2026 at 10:00 CDT \noin us as we introduce embedded system design across software and hardware abstraction levels\, with a focus on when high-level code is sufficient and when dedicated hardware logic is required. You will gain practical insight into how modern embedded systems combine software control\, digital logic\, and hands-on hardware skills. \nParticipants will see demos using CircuitPython on a Microchip development board for rapid prototyping and hardware interaction\, along with a CLB / MiniFPGA kit. The CLB portion emphasizes combinational and sequential logic\, highlights scenarios where hardware logic is needed for timing and determinism\, and includes introductory soldering practice to connect logic design with real hardware. \nWhat you’ll gain from attending: \n\nUnderstanding software vs. hardware logic: Gain a clear perspective on when to utilize CircuitPython for rapid prototyping and when to turn to Verilog for hardware logic design.\nHands-on experience: Witness demos using a Microchip development board\, giving you practical insight into hardware interaction and rapid prototyping techniques.\nIntroductory soldering practice: Enhance your skills as we guide you through connecting logic design with real hardware\, providing an engaging way to understand embedded systems better.\nDigital design exposure: Dive into digital design with Verilog using CLBs (MiniFPGA)\, preparing you for real-world applications in coursework or projects.\nInnovative learning directions: Explore the exciting new directions Microchip is taking in enhancing student learning outcomes\, ensuring you stay ahead in your field.\n\nSpeakers: \nRoss Satchell\, Senior Engineer\, Microchip \n\n\nRoss is a Senior Engineer in Microchip’s Academic Program. He started out as a Maker developing coffee related Arduino projects including a PID temperature controller for espresso machines\, which led him to pursue a bachelor’s in computer engineering and a master’s in data analytics at ASU. He started at Microchip in 2019 and worked as a Technical Marketing Engineer developing engaging demos for trade shows and leading capstone teams for 5 years before moving to the Academic Program. He now develops academic focused development kits\, CircuitPython student workshops\, and works closely with professors to develop educational content. \nHani Ahmad Assi\, Senior Technical Staff Engineer\, Microchip \n\n\nHani is a Senior Technical Staff Engineer at Microchip Technology. He earned his PhD in Electrical Engineering from Arizona State University and brings over 15 years of industry experience and 8 years in academia\, with expertise in transistor-level mixed-signal circuit design. While at Microchip\, he coauthored a practical embedded computing book and is currently developing a SoC FPGA book based on the PolarFire SoC FPGA. He also serves on academic advisory boards for multiple universities and community colleges\, contributing to curriculum development\, new program creation\, technical content\, guest lectures\, workshops\, and capstone project mentoring.
URL:https://passive-components.eu/event/programming-embedded-systems/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260505T160000
DTEND;TZID=Europe/Prague:20260505T170000
DTSTAMP:20260426T122219
CREATED:20260309T081529Z
LAST-MODIFIED:20260309T081529Z
UID:75035-1777996800-1778000400@passive-components.eu
SUMMARY:Understanding and Selecting Capacitors - Fundamentals\, Technologies and Latest Trends
DESCRIPTION:Understanding and Selecting Capacitors – Fundamentals\, Technologies and Latest Trends\nWürth Elektronik eiSos Webinar\nTuesday\, May 5th 2026 @ 4:00PM CEST\n\n\nCapacitors are among the key components in electronic circuits. Different technologies – ranging from ceramic and electrolytic capacitors to film capacitors and supercapacitors – offer specific characteristics and application areas. In this webinar\, we first provide a concise overview of the relevant capacitor technologies\, highlighting their typical strengths and limitations. \n\nA special focus will be placed on recent developments in aluminum hybrid polymer capacitors as well as DC-link film capacitors. \n\nWhat should be considered when selecting the right technology? What limitations apply to each capacitor type? Which technological trends and innovations are shaping the evolution of these components? And which new product developments open up additional optimization potential in hardware design? \n\nIn addition to the technological classification\, we will present current solutions from Würth Elektronik and provide practical guidance for their implementation in modern applications.\n\n\n\nSpeaker\nLukas Hölscher\nField Product Engineer
URL:https://passive-components.eu/event/understanding-and-selecting-capacitors-fundamentals-technologies-and-latest-trends/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260512T160000
DTEND;TZID=Europe/Prague:20260512T170000
DTSTAMP:20260426T122219
CREATED:20260415T141625Z
LAST-MODIFIED:20260415T141625Z
UID:75547-1778601600-1778605200@passive-components.eu
SUMMARY:Accelerating Power Supply Design with Wurth Elektronik and STMicroelectronics
DESCRIPTION:Accelerating Power Supply Design with Wurth Elektronik and STMicroelectronics\nWebinar by Würth Elektronik eiSos\nTuesday\, May 12th 2026 @ 4:00PM CEST\n\n\nThis webinar will demonstrate how leveraging tools from STMicroelectronics and Wurth Elektronik can help improve power supply design time and costs.\n\nDiscover the available tools and resources for product selection and simulation from STMicroelectronics and Wurth Elektronik.\nLearn how eDesignSuite and REDEXPERT can shorten development and debugging time in power supply designs.\nApply these results in a real-life industrial power supply example.
URL:https://passive-components.eu/event/accelerating-power-supply-design-with-wurth-elektronik-and-stmicroelectronics/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260519T160000
DTEND;TZID=Europe/Prague:20260519T170000
DTSTAMP:20260426T122219
CREATED:20260126T081152Z
LAST-MODIFIED:20260126T081152Z
UID:74444-1779206400-1779210000@passive-components.eu
SUMMARY:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization
DESCRIPTION:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization\, Webinar by Würth Elektronik\nTuesday\, May 19th 2026 @ 4:00PM CEST\n\n\nCurious about Qi2 wireless power design? Join this webinar to dive into practical development insights and EMC strategies for your next project.\n\nWhat you’ll learn:\n\n·         How to build a Qi2 wireless power transmitter from the ground up – from FET selection to control architecture.\n·         Key features of the WE Qi2 MPP Tx Coil and how to integrate it effectively.\n·         PCB layout tips to boost performance and minimize losses.\n·         How to measure and reduce conducted emissions with smart filter design.\n·         Interactive Q&A session to get your questions answered live.
URL:https://passive-components.eu/event/designing-qi2-wireless-power-systems-practical-development-and-emc-optimization-3/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260602T160000
DTEND;TZID=Europe/Prague:20260602T170000
DTSTAMP:20260426T122219
CREATED:20260415T141843Z
LAST-MODIFIED:20260415T141843Z
UID:75549-1780416000-1780419600@passive-components.eu
SUMMARY:Calculation\, Simulation and Measurement of 800V EMC Filters
DESCRIPTION:Calculation\, Simulation and Measurement of 800V EMC Filters\nWebinar by Würth Elektronik eiSos\nTuesday\, June 2nd 2026 @ 4:00PM CEST\n\n\nThis webinar highlights the growing relevance of 800‑volt systems in power electronics and the resulting requirements for advanced filter solutions. \n\nThe proliferation of 800V power networks and systems is advancing due to ever‑increasing demands on performance and efficiency. In this webinar\, the fundamentals for the calculation\, simulation and measurement of the EMC filters required for these systems will be examined in detail.\n\n\nSpeaker:\n\nAndreas Nadler\, Field Application Engineer
URL:https://passive-components.eu/event/calculation-simulation-and-measurement-of-800v-emc-filters/
LOCATION:virtual
END:VEVENT
END:VCALENDAR