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DTSTART;TZID=Europe/Prague:20250827T170000
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SUMMARY:Capacitor Assemblies for High-Power Circuit Designs
DESCRIPTION:Capacitor Assemblies for High-Power Circuit Designs\nDate: August 27\, 2025\nTime: 11 AM EDT (8 AM PDT / 5:00 PM CEST)\n\n\n\nAttendees will learn how Knowles’ RF capacitor assemblies deliver superior performance in high-frequency and high-power circuit designs through optimal low-loss\, high-Q ceramic materials and innovative assembly configurations. Real-world examples and case studies will show how engineers can address common design challenges\, and surviving harsh environments\, by leveraging Knowles’ expertise and vertically-integrated solutions \n\nThis webinar will showcase how Knowles’ RF capacitor assemblies redefine what’s possible in RF and high-power electronics by combining advanced ceramic dielectrics\, precision stacking technology\, and vertical integration within manufacturing. Attendees will explore design strategies for improving circuit efficiency\, EMI suppression\, and energy density using Knowles’ broad portfolio\, including High Q RF Capacitor assemblies. The session will break down technical specifications\, selection criteria\, and real-world application examples. Participants will also discover how Knowles’ ability to customize mechanical and electrical attributes can solve specific engineering problems—delivering greater reliability and regulatory peace of mind. By joining\, attendees can hear directly from application experts and come away with practical tools and insights to enhance performance\, accelerate product development\, and differentiate in competitive markets. \n\n\nKey Takeaways\n\nUnderstand the critical performance parameters that make RF capacitor assemblies a preferred choice for demanding applications in aerospace\, industrial\, and medtech sectors.\nGain insight into customizable solutions—such as tailored stack sizes\, voltage ratings\, and mechanical formats—enabling optimized designs for board space constraints and harsh operating conditions.\nLearn how collaborating with Knowles’ application engineers leads to accelerated prototyping\, reduced risk of field failure\, and streamlined paths to regulatory compliance and high-reliability deployments.\n\n\n\nSpeaker\nMatt Ellis\, Senior Director of Product Line Management\, HIREL\, Knowles
URL:https://passive-components.eu/event/capacitor-assemblies-for-high-power-circuit-designs/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20250820T160000
DTEND;TZID=Europe/Prague:20250820T163000
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SUMMARY:Pulse transformer design for RLC loads
DESCRIPTION:Pulse transformer design for RLC loads\n\nWed 20. 8.\n\n\n16:00 – 16:30 CET\n\noin this session on a pulse driving applications. An RLC load can be anything really\, like a gate driving scheme\, a Butterworth-Van Dyke transducer model\, maybe parasitic inductances that form an RLC network and so on. Transformer power losses modeling is key to the ‘R’ element of these circuits. \nSpeaker: Sotiris Zorbas\, Power Electronics Design Engineer expert at Frenetic
URL:https://passive-components.eu/event/pulse-transformer-design-for-rlc-loads/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20250730T190000
DTEND;TZID=Europe/Prague:20250730T193000
DTSTAMP:20260429T204110
CREATED:20250728T120901Z
LAST-MODIFIED:20250728T120901Z
UID:72175-1753902000-1753903800@passive-components.eu
SUMMARY:Dimension constrains in 500W PSFB Transformer Design
DESCRIPTION:Dimension constrains in 500W PSFB Transformer Design\n\nWed\, Jul 30\n\n\n7:00 PM – 7:30 PM GMT+2\n\nDiscover the mechanical\, magnetic\, and electrical limitations engineers face when miniaturizing a high-efficiency converter.\n\nSpeaker: Dr. Chema Molina – CEO @ Frenetic
URL:https://passive-components.eu/event/dimension-constrains-in-500w-psfb-transformer-design/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20250729T160000
DTEND;TZID=Europe/Prague:20250729T170000
DTSTAMP:20260429T204110
CREATED:20250701T112223Z
LAST-MODIFIED:20250701T112223Z
UID:71945-1753804800-1753808400@passive-components.eu
SUMMARY:Impact of Elevated Voltage and Temperature on Molded Power Inductors in DC/DC converters
DESCRIPTION:Impact of Elevated Voltage and Temperature on Molded Power Inductors in DC/DC converters\nWebinar by Würth Elektronik\nTuesday\, July 29th 2025 @ 4:00PM CEST\n\n\nFor DC/DC converter applications molded inductors enable smaller footprints and lower profile due to the properties of the magnetic material. This allow the inductors to be used in more harsh environments. The higher electrical and thermal stresses over time can lead to an increase in magnetic core loss due to the degradation of the insulation between magnetic particles. \n\nWürth Elektronik defines this degradation as a percolation phenomenon. But what exactly is percolation and what are its repercussions? And more importantly\, how does it affect the long-term performance of a DC/DC converter?
URL:https://passive-components.eu/event/impact-of-elevated-voltage-and-temperature-on-molded-power-inductors-in-dc-dc-converters/
LOCATION:virtual
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