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SUMMARY:Design and Test of Non-Hermetic Microelectronics
DESCRIPTION:Design and Test of Non-Hermetic Microelectronics\nInstructors: Thomas Green and Robert Lowry \nDescription: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals\, ceramics\, and glasses) require a different approach from a design\, production\, testing\, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law of diffusion and the interaction of moisture and other gases with the plastic package\, with or without a cavity\, is of primary importance. \nThis course begins with a brief overview of hermetic packaging and associated testing methods that have been developed over the years\, some of which are applicable to cavity style non-hermetic enclosures. Then the focus is primarily on the materials used to build non-hermetic packages and the variety of testing methods available to evaluate the non-hermetic package. A review of the techniques and methods to evaluate a “non-hermetic” approach is discussed with a special emphasis on cleaning of the device prior to encapsulation and alternate test methods to evaluate reliability. \nThe course is intended for process engineers\, designers\, quality engineers\, and managers responsible for design\, test and production of cavity and non-cavity style non-hermetic packages intended for use in high reliability military and Class 3 medical implants. \n\nTopics include: \n\nWhat is “hermeticity” and how to test for it (brief overview)\nHow it is different from “non-hermetic” packaging and test\nNon-hermetic Materials and Processes\n\nFick’s law fo diffusion\nThin films and coatings e.g. ALD and Parylene-C\nPEEK\, LCP\, Kapton\, Silicones thick coatings and potting compounds\n\n\nImportance of Surface Cleanliness\n\nHow to evaluate surface cleanliness\n\n\nCoating material evaluation and effectiveness\n\nAdhesion\, pinholes\, cracks\n\n\nNon- Hermetic Packaging and Testing\n\nWVTR\,  IPC-CC-830\nMoisture uptake (absorption) by materials TGA/TML\, WVR\n\n\nTest methods applicable to non-hermetics\n\nA Critical Review of Waterproof Testing Standards IP 67/68\nTM 5011 and NASA outgassing Specs\nRGA for non-hermetic cavities\nMoisture sensors\n\n\nQualification test methods and standards\n\nMil grade Non-hermetic qual standards…e.g. Class Y\nJEDEC STANDARDS…EIA STANDARDS SSB-1
URL:https://passive-components.eu/event/design-and-test-of-non-hermetic-microelectronics/
LOCATION:virtual
CATEGORIES:TJGreen
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DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251024
DTSTAMP:20250902T074110Z
CREATED:20250902T074110Z
LAST-MODIFIED:20250902T074110Z
UID:72480-1760918400-1761263999@passive-components.eu
SUMMARY:Digital WE Days 2025 - Virtual Conference
DESCRIPTION:Digital WE Days 2025 – Virtual Conference\nOctober 20 – 23\, 2025\nWhat are the Digital WE Days? \nIt’s a digital event with a comprehensive conference programme with practice-oriented presentations for you to enjoy. All presentations are live and totally free. \nClick here for the FAQs.
URL:https://passive-components.eu/event/digital-we-days-2025-virtual-conference/
LOCATION:virtual
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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251015T200000
DTEND;TZID=Europe/Prague:20251015T203000
DTSTAMP:20251014T070248Z
CREATED:20251014T070248Z
LAST-MODIFIED:20251014T070248Z
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SUMMARY:Planar Design & Simulation
DESCRIPTION:Planar Design & Simulation – New tool reveal\nIn this Frenetic session leaded by our CEO Chema Molina and Jonas Müehlethaler\, CTO at Frenetic\, we will unveil our new Planar Design and Simulation tool\, showing how you can design\, specify\, and simulate planar magnetics directly in just minutes. \n\nWed\, Oct 15\n\n\n8:00 PM – 8:30 PM CET
URL:https://passive-components.eu/event/planar-design-simulation/
LOCATION:virtual
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DTSTART;TZID=Europe/Prague:20251014T160000
DTEND;TZID=Europe/Prague:20251014T170000
DTSTAMP:20250923T083357Z
CREATED:20250923T083357Z
LAST-MODIFIED:20250923T083357Z
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SUMMARY:Smart Sensors\, Smarter AI: Building Reliable Edge Systems
DESCRIPTION:Smart Sensors\, Smarter AI: Building Reliable Edge Systems\, Würth Elektronik Webinar\nTuesday\, October 14th 2025 @ 4:00PM CEST \nAs the demand for Edge AI deployments continues to grow\, ensuring the reliability and performance of these systems is more crucial than ever. In this webinar\, we’ll explore the intersection of Edge AI processing and electromagnetic compatibility (EMC) / electromagnetic interference (EMI) testing. We’ll delve into the world of 10BASE-T1L with PoDL transmission\, sensor board design\, and practical EMC/EMI challenges faced during laboratory testing. Learn how to overcome these obstacles and deploy robust\, high-performing Edge AI systems that drive real-world results. \nSpeakers \nThomas Mauer\nSystem Engineer\nThomas Mauer is a System Engineer with Texas Instruments in Germany.\n\nOctavian Stroe\nProduct Definition Engineer\nAs a Product Definition Engineer at Würth Elektronik\, Octavian is a multidisciplinary engineer with deep expertise in sound engineering\, audio electronics\, and mechanical design. He holds a degree in Sound Engineering with a specialization in audio electronics from the University of Huddersfield and a master’s degree with a focus on optical compression.
URL:https://passive-components.eu/event/smart-sensors-smarter-ai-building-reliable-edge-systems/
LOCATION:virtual
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