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DTSTART;TZID=America/New_York:20250930T120000
DTEND;TZID=America/New_York:20251002T140000
DTSTAMP:20260409T204314
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UID:58730-1759233600-1759413600@passive-components.eu
SUMMARY:MIL-Std-883 TM 2010
DESCRIPTION:MIL-STD-883 TM 2010\nInstructor: Thomas Green \nDescription: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual inspection is a flow down requirement from Mil-Prf-38535. The primary focus of this session will be on the “low mag” visual requirements for component attach and wire bond\, which differ from the TM 2017 hybrid visual inspection criteria. TM 2010 also contains additional die attach and wire bond requirements not addressed in TM 2017. We will also briefly review the high mag inspection requirements for ICs and MMICs with a special emphasis on Class S products. \nTopics include: \n\nMil-Prf-38535 Integrated Circuit (Microcircuits) General Spec flow down\nrequirements for visual inspection\nLow Mag Criteria (30-60X)\nDie Attach(eutectic and non-eutectic criteria)\nWirebond General (gold ball\, wedge\, and tailless)\nRebonding of monolithic devices.\nFlip chip solder bump die (para 3.2.1.6)\nForeign material (para. 3.2.5)\nForeign Material Die Coated devices (para 3.2.5.1)\nHigh Mag Criteria (special emphasis on Class S)\nPara 3.1.1-3.4 High Mag IC and MMIC Inspection\nPara. 3.1.6. Film resistors\nPara 3.1.7 Laser trimmed thin film resistors\nFlip Chip Defects Scribe and Edge Cracks\nClass Review with Q&A
URL:https://passive-components.eu/event/mil-std-883-tm-2010/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251008T110000
DTEND;TZID=Europe/Prague:20251008T120000
DTSTAMP:20260409T204314
CREATED:20250923T083020Z
LAST-MODIFIED:20250923T083020Z
UID:72650-1759921200-1759924800@passive-components.eu
SUMMARY:PCB Online Shop – simply “Made in Germany” by Würth Elektronik
DESCRIPTION:PCB Online Shop – simply “Made in Germany” by Würth Elektronik\n  \n  \nWed\, Oct 8\, 2025 11:00 AM – 12:00 PM CEST \nDo you know this situation? It’s late at night; the PCB layout is finally finished – but the project is already behind schedule. The trade fair with the product launch is coming up\, and prototypes are needed as quickly as possible. Now every hour counts: order easily\, have it manufactured securely\, get it delivered fast. This is exactly where the WEdirekt Online Shop from Würth Elektronik comes in. In our webinar\, we’ll show you live how to order prototypes and small series without detours – from data upload to the express option. \nLook forward to our webinar with: \n\nInsights into the ordering proces – demonstrated live\nTips on how prototypes can seamlessly transition into series production\nAnswers to your questions: our German service team is there for you\nA first glimpse of how API integration will make ordering even easier in the future\nPlus: discover new possibilities we are currently preparing and how you as a developer\, university\, or company can benefit from them\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students. \n  \n 
URL:https://passive-components.eu/event/pcb-online-shop-simply-made-in-germany-by-wurth-elektronik/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251014T160000
DTEND;TZID=Europe/Prague:20251014T170000
DTSTAMP:20260409T204314
CREATED:20250923T083357Z
LAST-MODIFIED:20250923T083357Z
UID:72652-1760457600-1760461200@passive-components.eu
SUMMARY:Smart Sensors\, Smarter AI: Building Reliable Edge Systems
DESCRIPTION:Smart Sensors\, Smarter AI: Building Reliable Edge Systems\, Würth Elektronik Webinar\nTuesday\, October 14th 2025 @ 4:00PM CEST \nAs the demand for Edge AI deployments continues to grow\, ensuring the reliability and performance of these systems is more crucial than ever. In this webinar\, we’ll explore the intersection of Edge AI processing and electromagnetic compatibility (EMC) / electromagnetic interference (EMI) testing. We’ll delve into the world of 10BASE-T1L with PoDL transmission\, sensor board design\, and practical EMC/EMI challenges faced during laboratory testing. Learn how to overcome these obstacles and deploy robust\, high-performing Edge AI systems that drive real-world results. \nSpeakers \nThomas Mauer\nSystem Engineer\nThomas Mauer is a System Engineer with Texas Instruments in Germany.\n\nOctavian Stroe\nProduct Definition Engineer\nAs a Product Definition Engineer at Würth Elektronik\, Octavian is a multidisciplinary engineer with deep expertise in sound engineering\, audio electronics\, and mechanical design. He holds a degree in Sound Engineering with a specialization in audio electronics from the University of Huddersfield and a master’s degree with a focus on optical compression.
URL:https://passive-components.eu/event/smart-sensors-smarter-ai-building-reliable-edge-systems/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251015T200000
DTEND;TZID=Europe/Prague:20251015T203000
DTSTAMP:20260409T204314
CREATED:20251014T070248Z
LAST-MODIFIED:20251014T070248Z
UID:73062-1760558400-1760560200@passive-components.eu
SUMMARY:Planar Design & Simulation
DESCRIPTION:Planar Design & Simulation – New tool reveal\nIn this Frenetic session leaded by our CEO Chema Molina and Jonas Müehlethaler\, CTO at Frenetic\, we will unveil our new Planar Design and Simulation tool\, showing how you can design\, specify\, and simulate planar magnetics directly in just minutes. \n\nWed\, Oct 15\n\n\n8:00 PM – 8:30 PM CET
URL:https://passive-components.eu/event/planar-design-simulation/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251024
DTSTAMP:20260409T204314
CREATED:20250902T074110Z
LAST-MODIFIED:20250902T074110Z
UID:72480-1760918400-1761263999@passive-components.eu
SUMMARY:Digital WE Days 2025 - Virtual Conference
DESCRIPTION:Digital WE Days 2025 – Virtual Conference\nOctober 20 – 23\, 2025\nWhat are the Digital WE Days? \nIt’s a digital event with a comprehensive conference programme with practice-oriented presentations for you to enjoy. All presentations are live and totally free. \nClick here for the FAQs.
URL:https://passive-components.eu/event/digital-we-days-2025-virtual-conference/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251021T120000
DTEND;TZID=America/New_York:20251023T141500
DTSTAMP:20260409T204314
CREATED:20240803T070206Z
LAST-MODIFIED:20251113T080424Z
UID:67288-1761048000-1761228900@passive-components.eu
SUMMARY:Design and Test of Non-Hermetic Microelectronics
DESCRIPTION:Design and Test of Non-Hermetic Microelectronics\nInstructors: Thomas Green and Robert Lowry \nDescription: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals\, ceramics\, and glasses) require a different approach from a design\, production\, testing\, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law of diffusion and the interaction of moisture and other gases with the plastic package\, with or without a cavity\, is of primary importance. \nThis course begins with a brief overview of hermetic packaging and associated testing methods that have been developed over the years\, some of which are applicable to cavity style non-hermetic enclosures. Then the focus is primarily on the materials used to build non-hermetic packages and the variety of testing methods available to evaluate the non-hermetic package. A review of the techniques and methods to evaluate a “non-hermetic” approach is discussed with a special emphasis on cleaning of the device prior to encapsulation and alternate test methods to evaluate reliability. \nThe course is intended for process engineers\, designers\, quality engineers\, and managers responsible for design\, test and production of cavity and non-cavity style non-hermetic packages intended for use in high reliability military and Class 3 medical implants. \n\nTopics include: \n\nWhat is “hermeticity” and how to test for it (brief overview)\nHow it is different from “non-hermetic” packaging and test\nNon-hermetic Materials and Processes\n\nFick’s law fo diffusion\nThin films and coatings e.g. ALD and Parylene-C\nPEEK\, LCP\, Kapton\, Silicones thick coatings and potting compounds\n\n\nImportance of Surface Cleanliness\n\nHow to evaluate surface cleanliness\n\n\nCoating material evaluation and effectiveness\n\nAdhesion\, pinholes\, cracks\n\n\nNon- Hermetic Packaging and Testing\n\nWVTR\,  IPC-CC-830\nMoisture uptake (absorption) by materials TGA/TML\, WVR\n\n\nTest methods applicable to non-hermetics\n\nA Critical Review of Waterproof Testing Standards IP 67/68\nTM 5011 and NASA outgassing Specs\nRGA for non-hermetic cavities\nMoisture sensors\n\n\nQualification test methods and standards\n\nMil grade Non-hermetic qual standards…e.g. Class Y\nJEDEC STANDARDS…EIA STANDARDS SSB-1
URL:https://passive-components.eu/event/design-and-test-of-non-hermetic-microelectronics/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251028T080000
DTEND;TZID=Europe/Prague:20251028T150000
DTSTAMP:20260409T204314
CREATED:20250818T105942Z
LAST-MODIFIED:20250818T105942Z
UID:72394-1761638400-1761663600@passive-components.eu
SUMMARY:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit
DESCRIPTION:Power Up Your Design: SN6507 and the Ready-to-Use Development Kit\nWebinar Presented by Würth Elektronik & Texas Instruments\nTuesday\, October 28th 2025 @ 3:00PM CET\n\nIn this webinar\, we explore the market trends driving the need for compact\, efficient isolated power solutions and how the SN6507 helps address them. We’ll discuss real-world applications\, walk through the benefits of the SN6507\, and introduce a co-developed development kit built to accelerate your design process. \nYou’ll also learn how Würth Elektronik engineered a full line of transformers optimized for this solution (WE-PPTI) and how to select the right one for your needs. Join us for the live presentation to gain practical insights\, ask your questions\, and see how this collaboration helps you design faster and smarter.
URL:https://passive-components.eu/event/power-up-your-design-sn6507-and-the-ready-to-use-development-kit/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251030T110000
DTEND;TZID=Europe/Prague:20251030T120000
DTSTAMP:20260409T204314
CREATED:20251016T065521Z
LAST-MODIFIED:20251016T065521Z
UID:73206-1761822000-1761825600@passive-components.eu
SUMMARY:Space Ceramic Capacitors with Flexible Testing
DESCRIPTION:Space Ceramic Capacitors with Flexible Testing\nThursday\, 30. 10. 2025\, 11:00 – 12:00 CET \nSRT-Microcéramique ceramic capacitor manufacturer benefits from extensive experience in the high-reliability sector\, supplying components to leading customers in the Defense\, Medical\, and Industrial markets\, thanks to our fully integrated PME manufacturing process and in-house testing capabilities. \nThis webinar will present the technical aspects of choosing ceramic capacitors for space applications\, highlight SRT-Microcéramique’s offering and approach\, and explain how it compares and differs from current market proposals. We will also cover how to best procure and order selected components through the ALTER DoEEt listing\, as well as how to contact the SRT engineering team for special designs
URL:https://passive-components.eu/event/space-ceramic-capacitors-with-flexible-testing/
LOCATION:virtual
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