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DTSTAMP:20260520T022322
CREATED:20251023T133559Z
LAST-MODIFIED:20251023T133559Z
UID:73435-1762250400-1762254000@passive-components.eu
SUMMARY:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
DESCRIPTION:Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools\nNovember 4\, 2025 | 10:00 AM PST\n\n\n\n\nThis webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced stability analysis using the WS-probe in Keysight Technologies’ Advanced Design System software. \nDesigning stable circuits is becoming harder as communication systems evolve. Instability derives from a combination of gain and feedback. Higher-frequency systems demand faster devices (more gain)\, while advanced functionality calls for tighter integration (more feedback). In this evolving landscape\, traditional techniques are no longer sufficient. But the sheer number of alternative approaches and their perceived complexity leave them unused by many designers. This talk aims to demystify instability so you can design circuits that are actually amplifiers (not oscillators) from the start. We’ll walk through the root causes of instability and the shortcomings of popular RF and Microwave stability analysis techniques. Then\, we’ll revisit prior fundamental work to provide\, through examples\, a simple\, reliable process for rigorous stability analysis—enabled by the new WS-Probe simulation tool. \nWho should attend this webinar? This Electronic Design Automation (EDA) webinar is ideal for RF and microwave engineers or anyone looking to gain a deeper understanding of amplifier stability and high-frequency circuit design.
URL:https://passive-components.eu/event/design-and-stability-analysis-of-gan-power-amplifiers-using-advanced-simulation-tools/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251104T120000
DTEND;TZID=America/New_York:20251106T141500
DTSTAMP:20260520T022322
CREATED:20240812T074032Z
LAST-MODIFIED:20250728T071207Z
UID:67085-1762257600-1762438500@passive-components.eu
SUMMARY:Wirebond Materials\, Processes\, Reliability and Testing
DESCRIPTION:Wirebond Materials\, Processes\, Reliability and Testing\nInstructor: Lee Levine \nDescription: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past\, gold wire was the dominant material in use\, but in 2015 copper and palladium coated copper wire captured more than 51% of the total market. Copper provides benefits in cost\, improved conductivity\, stiffness and reliability. However\, it is significantly harder than gold and achieving a robust\, reliable process is more challenging.\nWith the high productivity and growth rate of wire bonding\, it is one of the most reliable manufacturing processes. Achieving high yields requires rigorous attention to details and excellent statistical process control. Wire bonding high-volume lead-frames often generates defect rates below 10ppm\, this presents a significant barrier to entry for any process competitor\, but copper is meeting the challenge in high-volume manufacturing. \nThis course is intended for wire bond process engineers\, technicians\, quality control engineers and managers. \n\nThe course will cover: \nIntroduction \n\nA snapshot of some microelectronic packages\nSize of the market\nCost of a wire bond\n\nUltrasonic Welding \n\nHow ultrasonics effects a materials deformation\nThe principal ultrasonic welding parameters\nDiffusion\n\nIntermetallics and Intermetallic Failures- Gold and Copper \n\nFormation of intermetallic alloys\nDiffusion transformations during the life and death of a bond\n\nCopper wire bonding \n\nEffects of bonding parameters\nGetting started with copper ball bonding\n\nWire\nWedge bond vs ball bond parameters and comparison\nBall Bumping
URL:https://passive-components.eu/event/wirebond-materials-processes-reliability-and-testing-2/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251106T143000
DTEND;TZID=Europe/Prague:20251106T160000
DTSTAMP:20260520T022322
CREATED:20250925T111037Z
LAST-MODIFIED:20250925T111037Z
UID:72716-1762439400-1762444800@passive-components.eu
SUMMARY:Self-healing polymer materials for the next generation of high-temperature power capacitors
DESCRIPTION:Self-healing polymer materials for the next generation of high-temperature power capacitors\nThursday\, 6 November 2025\, 14:30-16:00 (CET)\, M304-M307\, Alsion\, SDU Sønderborg with online join option for registered attendees. \nAbout the event\n\nPolymer-based power capacitors have long struggled with combining high temperatures with good breakdown strength and reliability. With the increasing adoption of wide-band-gap semiconductors in convertors for e-mobility\, HVDC\, etc\, there is a need for high voltage capacitors that can withstand ever higher temperatures\, without compromising on reliability or breakdown voltage. We present a new class of polymer dielectric material\, developed in collaboration between the DTU Department of Chemical and Biochemical Engineering and the SDU Centre for Industrial Electronics based on self-healing cross-linked polymer networks. These materials can self-heal at temperatures well beyond BOPP\, exhibiting increased breakdown voltages at elevated temperatures and the ability to heal post-breakdown. If implemented in converters\, these materials would result in substantial gains in energy efficiency and device lifetime. \n\n\nTo learn more\, please join us at SDU Sønderborg or online on 6 November! \n\n\n\nEvent programme\n\n\n\n14:30 Welcome to SDU (Thomas Ebel\, SDU) \n14:35 Introducing the X-linkCap project (Anders Egede Daugaard\, DTU and William Greenbank\, SDU) \n14:50 Chemistry and properties of the cross-linked polymer systems (Neha Manojkumar Mulchandani\, DTU) \n15:10 Fabrication and testing of high temperature\, self-healing capacitors (Bartosz Gackowski\, SDU) \n15:30 Summary of project and future perspectives (Anders Egede Daugaard\, DTU\, Thomas Ebel\, SDU and William Greenbank\, SDU) \n15:40 Q&A with in-person and online audience \n16:00 Refreshments for in-person attendees \n\n\n\nRegistration\n\nJoin us for the Self-Healing Polymers for Next-Gen Power Capacitors event on 6 November 2025. Participation is free\, but registration is required. \nThe Zoom link for online participants will be shared prior to the meeting. \nRegister by 30 October 2025 to secure your spot!
URL:https://passive-components.eu/event/self-healing-polymer-materials-for-the-next-generation-of-high-temperature-power-capacitors/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251111T170000
DTEND;TZID=Europe/Prague:20251111T180000
DTSTAMP:20260520T022322
CREATED:20251029T173129Z
LAST-MODIFIED:20251029T173129Z
UID:73460-1762880400-1762884000@passive-components.eu
SUMMARY:Industrial Applications Demand More from Interconnects in Next-Gen Designs
DESCRIPTION:Industrial Applications Demand More from Interconnects in Next-Gen Designs\nby Samtec \nTuesday\, November 11\, 2025 · 5:00 p.m. CET \nNeed to specify interconnects for industrial applications like automation\, robotics\, embedded vision\, IoT\, lighting\, smart cities\, grids\, or factories? Join us for a presentation offering practical recommendations and guidelines to EOEM engineers and designers on selecting the most suitable rugged interconnects for your industrial products. \nTopics covered include: \n\nMechanical considerations: shock and vibration\, plating\, mechanical strength of the connector on the PCB\, secure coupling\nElectrical considerations: current carrying capacity\, designs for high-speed applications\nEnvironmental considerations: performance in harsh conditions\, design flexibility\, protection against dust and moisture\n\nSpeaker: \n\n\n\nJan Hrouda \n\nIndustry Manager for Industrial Applications\n\n\n\n\nJan Hrouda\, a native of Germany\, completed his B.S. in International Business at Aquinas College in Grand Rapids\, Michigan. After joining Samtec in 1996\, he served in various roles\, including Customer Service\, Application-Specific Engineering
URL:https://passive-components.eu/event/industrial-applications-demand-more-from-interconnects-in-next-gen-designs/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251112T110000
DTEND;TZID=Europe/Prague:20251112T120000
DTSTAMP:20260520T022322
CREATED:20251020T071645Z
LAST-MODIFIED:20251029T173433Z
UID:73279-1762945200-1762948800@passive-components.eu
SUMMARY:PCB Design: Impedance is for everyone!
DESCRIPTION:Würth Elektronik Webinar: Impedance is for everyone!\n\n\n\n\n\n\n\n\n\nWed\, Nov 12\, 2025 11:00 AM – 12:00 PM CET\n\n\n\n\n\n\n\n\nAs data rates increase\, so do the demands on PCB design. To ensure that signals are transmitted on the PCB without distortion\, the impedance requirements of the assembly or application must be properly considered in the PCB design. In this webinar\, we will show how an impedance-defined stackup is created based on simulation results and electrical boundary conditions – a stackup precisely matched to the required impedance. The key lies in careful design and manufacturing\, including verification through electrical measurements on test coupons when needed. Building on this foundation\, we will demonstrate how Design for Manufacturing (DfM) and tolerance management can improve production.\n\nJoin our webinar on November 12\, 2025\, at 11:00 a.m.\, and learn about:\n\nThe fundamentals of impedance and signal integrity\nHow to create an impedance-defined stackup for the technologies • BASIC • MICROVIA.hdi and • STARR.flex\nDesign for Manufacturing and tolerance considerations\nPractical tips and tricks from the field\nWhen to switch to high-speed base materials\nA look at special applications\, such as impedance in antenna structures Gain a comprehensive understanding of different PCB technologies and their specific requirements\nall from a holistic perspective: Impedance is for everyone!\n\n\nRegister now and experience how simple\, fast\, and secure the path from idea to PCB can be. This webinar is especially relevant for professionals in purchasing\, project management\, PCB design\, electronics development\, as well as for students.
URL:https://passive-components.eu/event/pcb-design-impedance-is-for-everyone/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251112T120000
DTEND;TZID=America/New_York:20251113T141500
DTSTAMP:20260520T022322
CREATED:20220909T110643Z
LAST-MODIFIED:20250728T071303Z
UID:58718-1762948800-1763043300@passive-components.eu
SUMMARY:Microelectronic Packaging Failure Modes and Analysis
DESCRIPTION:VIRTUAL: Microelectronic Packaging Failure Modes and Analysis\nInstructors: Thomas Green and Robert Lowry \nDescription: \nThe design and packaging of microelectronic devices such as hybrids\, RF microwave modules\, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing\, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs. \nThe instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid\, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and\, resist the temptation to rush to judgment\, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution. \nThe course is intended for FA engineers\, component engineers\, reliability engineers\, design\, quality and process engineers involved in microelectronic packaging. \nTopics include: \n\nIntroduction to Microelectronic Packaging\nTerminology and Product Definitions\nTypical Package Related Defects and Failures\nFailure Analysis (FA) Process Flow\nSpecific Examples of Package Related Failures and FA Investigation\nFailure Analysis Tools and Techniques
URL:https://passive-components.eu/event/microelectronic-packaging-failure-modes-and-analysis/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251113T110000
DTEND;TZID=Europe/Prague:20251113T113000
DTSTAMP:20260520T022322
CREATED:20251110T082631Z
LAST-MODIFIED:20251110T082631Z
UID:73619-1763031600-1763033400@passive-components.eu
SUMMARY:DC/DC Converters in Automotive Applications
DESCRIPTION:Würth Elektronik Webinar: Bridging the Voltage Gap: DC/DC Converters in Automotive Applications\n\n\n\n\n\n\n\n\n\nThu\, Nov 13\, 2025 11:00 AM – 11:30 AM CET\n\n\n\n\n\n\n\n\nJoin us for an insightful webinar on the silent performers behind modern electrical systems: DC/DC Converters.\n\nIn this webinar\, our experts Daniel Wilder (Product Manager Function-Specific Modules) and Arnaud Wendling (Head of Application Engineering and Product Manager Electronics) explain why these components are essential for reliable power distribution in mobile machines and commercial vehicles.\nYou will learn about the basic principles of common converter types\, their functionality and features\, practical examples from commercial vehicle engineering\, and typical challenges in integration and operation. This webinar offers valuable knowledge and insights from practical experiences.\n\nAgenda:\n1. Introduction\n2. Fundamentals of vehicle electrical systems\n3. DC/DC Converters: types\, features and quality parameters\n4. Application examples & solutions\n5. Live Q&A
URL:https://passive-components.eu/event/dc-dc-converters-in-automotive-applications/
LOCATION:virtual
END:VEVENT
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