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BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251202T120000
DTEND;TZID=Europe/Prague:20251204T141500
DTSTAMP:20260409T174125
CREATED:20251113T081426Z
LAST-MODIFIED:20251113T081426Z
UID:73663-1764676800-1764857700@passive-components.eu
SUMMARY:Microwave Packaging Technology
DESCRIPTION:Microwave Packaging Technology\nInstructor: Thomas Green \nDescription: Microwave Hybrids\, MICs\, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments\, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues\, material tradeoffs\, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military\, space and other hi reliability commercial and medical device applications. \nThe course is intended as an introductory to intermediate level course for process engineers\, designers\, quality engineers\, and managers responsible for design and manufacture of microwave hybrids. \n\nTopics include: \nSession 1 \n\nIntroduction to Microwave Technology\nMilitary Requirements Flow Down and Design Guidelines\nManufacturing Assembly Process Overview\nWafer Fabrication Processes\nSubstrate Technology\nThin Film Processes on Ceramic\nMaterial and Process Fundamentals for Component Attach\nEutectic Soldering Processes\n\nSession 2 \n\nDie\, substrate and package compatibility\nThermal Impedance and Importance of Minimizing Junction Temperature\nPackaging Design Considerations\nReview of Defects from the Component Attach Process\nOverview of Common Cleaning Processes and Potential Problems\nWirebonding and Interconnect Process Overview\nGap Welding\nFactors that affect yield and reliability\n\nSession 3 \n\nHermetic Packaging Process Overview\nHermeticity Testing\nNear Hermetic Packaging Options\nDesign for Manufacturability (DFM)
URL:https://passive-components.eu/event/microwave-packaging-technology/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251203T170000
DTEND;TZID=Europe/Prague:20251203T180000
DTSTAMP:20260409T174125
CREATED:20251128T081133Z
LAST-MODIFIED:20251128T081133Z
UID:73807-1764781200-1764784800@passive-components.eu
SUMMARY:The Hidden Secret of the Magnetic Transformer and example of its use
DESCRIPTION:The Hidden Secret of the Magnetic Transformer and example of its use\nFrenetic is hosting a special educational session with Prof. Sam Ben-Yaakov\, one of the most respected voices in magnetics and power electronics. \n\nWed\, Dec 03\n\n\n5:00 PM – 6:00 PM CET\n\n\n\n\n\n\nIn this webinar\, Prof. Ben-Yaakov will explain a fundamental — and often overlooked — property of magnetic transformers. \nYou’ll learn how this principle led to the development of a new magnetic reluctance model and even the invention of a new type of controlled inductor. \nWhat to expect: \n\nA clear explanation of this “hidden” magnetic property\nHow it connects to real transformer behavior\nHow it enables new magnetic modeling approaches\nA practical example of its use\n45–60 minutes of deep insight + Q&A\n\nIf you’re curious about what this hidden property is — and how it may change the way you think about magnetics — you don’t want to miss this session.
URL:https://passive-components.eu/event/the-hidden-secret-of-the-magnetic-transformer-and-example-of-its-use/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251209T120000
DTEND;TZID=America/New_York:20251211T141500
DTSTAMP:20260409T174125
CREATED:20220909T110834Z
LAST-MODIFIED:20251113T080614Z
UID:58720-1765281600-1765462500@passive-components.eu
SUMMARY:Space and Military Standards for Hybrids and RF Microwave Modules
DESCRIPTION:Space and Military Standards for Hybrids and RF Microwave Modules\nInstructor: Thomas Green \nDescription: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class K hybrids for military and space applications. \nThe governing document is MIL-PRF-38534 Hybrid Performance Specification\, which in turn further calls out specific test methods in MIL-STD-883L Test Methods and Procedures for Microelectronic Devices. Mil 883 is a collection of destruct and non-destruct test methods used as screening and qualification tests to verify microelectronic performance requirements and to assess the reliability of finished modules. \nThe course is intended for anyone interested in gaining better insight and understanding of the quality and process control requirements for hi reliability space and military products\, specifically component and quality engineers working in this industry. \nTopics include: \nTopic 1: Overview of MIL-PRF-38534 Hybrid Performance Specification \nTopic 2: MIL-PRF-38534 General Hybrid Specification \nTopic 3: Overview of MIL-STD-883 test methods and procedures required for Space qualified Hybrids and RF MMIC Modules \nTopic 4: Group B\, C and D Periodic Inspection Test Methods Failure Analysis Tools and Techniques
URL:https://passive-components.eu/event/space-and-military-standards-for-hybrids-and-rf-microwave-modules/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251210T160000
DTEND;TZID=Europe/Prague:20251210T170000
DTSTAMP:20260409T174125
CREATED:20250915T083108Z
LAST-MODIFIED:20250915T083108Z
UID:72563-1765382400-1765386000@passive-components.eu
SUMMARY:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization
DESCRIPTION:Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization\nWebinar by Würth Elektronik\nWednesday\, December 10th 2025 @ 4:00PM CET\n\n\nCurious about Qi2 wireless power design? Join this webinar to dive into practical development insights and EMC strategies for your next project.\n\nWhat you’ll learn:\n\n·         How to build a Qi2 wireless power transmitter from the ground up – from FET selection to control architecture.\n·         Key features of the WE Qi2 MPP Tx Coil and how to integrate it effectively.\n·         PCB layout tips to boost performance and minimize losses.\n·         How to measure and reduce conducted emissions with smart filter design.\n·         Interactive Q&A session to get your questions answered live.
URL:https://passive-components.eu/event/designing-qi2-wireless-power-systems-practical-development-and-emc-optimization/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251215T130000
DTEND;TZID=America/New_York:20251218T151500
DTSTAMP:20260409T174125
CREATED:20220909T111655Z
LAST-MODIFIED:20251113T080820Z
UID:58728-1765803600-1766070900@passive-components.eu
SUMMARY:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
DESCRIPTION:Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)\nInstructor: Thomas Green \nDescription: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices. Over 250 color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of Pre Cap visual inspection and how to interpret and apply the very latest MIL-STD-883 criteria. \nThe course is intended for quality assurance personnel\, inspectors\, QEs and Process engineers\, component engineers and lead operators and others responsible for inspection of the hardware prior to the final package sealing process. \nThe following is an approximation of what will be covered in each online or “virtual” training session.  \nSession 1: Introduction and Overview \n\nMil Spec Visual Inspection Requirements Flowdown\nComponent ID\nForeign Material or F.O.D. inspection and source requirements\n\nSession 2: Component Attach \n\nTM 2017 Low mag IC/MMIC die and substrate attach inspection criteria and non-planar capacitor/resistor criteria\nSolder Criteria\n\nSession 3: Wire and Ribbon Bonding \n\nTM 2017 Low mag wire and ribbon bond inspection criteria\n\nSession 4: High Mag IC Die and MMIC Inspection and Passives \n\nTM 2010 IC High Mag Inspection criteria\nMIL-STD-750 Die level Inspection Criteria TM 2017 Table 1\nTM 2032 Passive Component inspection criteria for substrates\, capacitors\, inductors and resistors
URL:https://passive-components.eu/event/pre-cap-visual-inspection-per-mil-std-883-tm-2017/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251216T170000
DTEND;TZID=Europe/Prague:20251216T180000
DTSTAMP:20260409T174125
CREATED:20251208T084049Z
LAST-MODIFIED:20251208T084049Z
UID:73893-1765904400-1765908000@passive-components.eu
SUMMARY:Coaxial Connectors and How to Connect with the PCB
DESCRIPTION:Coaxial Connectors and How to Connect with the PCB\nWebinar by Würth Elektronik\nTuesday\, December 16th 2025 @ 5:00PM CET\n\n\nThis free one-hour webinar presents practical guidance for achieving low-loss connections between coaxial connectors and printed circuit boards. The session covers the most relevant parameters affecting impedance and demonstrates how these factors can influence overall performance. Methods for identifying interference points are discussed\, along with criteria for determining acceptable levels of loss in real-world applications. \n\nAttention is given to the connector characteristics that are most important for maintaining quality\, especially at high frequencies. Live simulations using CST illustrate how adjustments to the PCB layout can impact connection behavior. The presentation also outlines the design process for RF connectors\, providing a clear view of industry best practices.
URL:https://passive-components.eu/event/coaxial-connectors-and-how-to-connect-with-the-pcb/
LOCATION:virtual
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20251219T120000
DTEND;TZID=America/New_York:20251219T140000
DTSTAMP:20260409T174125
CREATED:20250210T124135Z
LAST-MODIFIED:20251113T080720Z
UID:70084-1766145600-1766152800@passive-components.eu
SUMMARY:External Visual Inspection per MIL-STD-883 TM 2009
DESCRIPTION:External Visual Inspection per MIL-STD-883 TM 2009\nInstructor: Thomas Green \nDescription: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and the instructor explains why the defects are critical to the reliability of the end product. \nTopics include: \n\nWeld and Seal defects\nGlass and ceramic feedthrough defects e.g. meniscus cracking Package marking and pin/lead defects\nInspection Criteria for Microelectronic Packages and Covers Foreign Material Identification and Contamination Control\nReview applicable criteria in JESD 9C\nPlastic Package Defects\n\n 
URL:https://passive-components.eu/event/external-visual-inspection-per-mil-std-883-tm-2009/
LOCATION:virtual
CATEGORIES:TJGreen
END:VEVENT
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