Lanškroun, November 30 2015
Czech and Slovak IMAPS chapter and European Passive Components Institute established partnership and co-operation to support Czech & Slovak electronic industry.
IMAPS Czech and Slovak chapter is a part of IMAPS (The International Microelectronics And Packaging Society), the largest community for microelectronics & packaging professionals with mission to share information (symposiums, conferences, workshops etc.) and promotion of members’ technology portfolio. IMAPS has been established in 1967 and there are currently 19 international and 24 USA chapters with more than 11 000 members over the World (7000 USA, 4000 overseas). IMAPS Cz & Sk chapter has been established and joined IMAPS Europe in 1991.
“We have many common targets with IMAPS, EPCI is just focused to passive components and sensors field only, while IMAPS covers a significantly wider range of electronic & packaging applications. Partnership with IMAPS Cz & Sk chapter is an important step benefitial for the local electronic companies, we hope.” said Tomas Zednicek, president of European Passive Components Institute
IMAPS Cz & Sk chapter website