source: Taiyo Yuden news
Taiyo Yuden has announced the commercialization of the JMK063 BJ104ML, 0.1μF 6.3V X5R MLCC, the world’s thinnest 0603-size low-profile multilayer ceramic capacitor, achieving a thickness of 0.11mm (0.6mm x 0.3mm x 0.11mm, with the maximum height value).
The multilayer ceramic capacitor can be used for devices that are required to be small and thin, such as smartphones and wearable devices, for the purpose of decoupling IC power supply lines inside the devices. The capacitor product achieves a thickness that is roughly 27% thinner as compared to our conventional product, the JMK063 BJ104MH, 0.1μF 6.3V X5R (0.6mm x 0.3mm x 0.15mm, with the maximum height value), and will contribute to the development of smaller and thinner digital devices.
Technology Background – Multilayer ceramic capacitors are placed near an IC device mounted in a smartphone or a wearable device for the purpose of decoupling. In accordance with a reduction in thickness of devices, improvement in functionality, and increase in the battery size, the mounting area available to parts is decreasing. In addition to further reducing the size of electronic parts, there is a need to implement higher-density mounting, which includes mounting low-profile parts inside or at the back of the IC package, rather than the conventional methods of mounting parts on the substrate. To address this market need, TAIYO YUDEN has commercialized the world’s thinnest 0603-size multilayer ceramic capacitor, the 0.1μF 6.3V X5R JMK063 BJ104ML, having a thickness of 0.11 mm, and has thereby expanded its lineup of low-profile multilayer ceramic capacitors.
The capacitor is roughly 27% thinner than our conventional 0603-size capacitor, the JMK063 BJ104MH, with a height of 0.15mm, and it reduces the mounting area to approximately 64% of that of our conventional 1005-size capacitor, the JMK105VBJ104ML, with the same height of 0.11mm (1mm x 0.5mm x 0.11mm, with the maximum height value). Company will continue to actively promote the product development of low-profile multilayer ceramic capacitors to realize a smaller size, thinner profile, and higher capacitance.
Application – for decoupling of IC power supply lines in devices that are required to be small and thin, such as smartphones and wearable devices.
