Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Exxelia Publishes Micropen White Papers for Printed Electronics

26.1.2026
Reading Time: 8 mins read
A A

Exxelia has released a set of new Micropen white papers with practical insights for printed electronics in medical and sensor designs that go into real design details for printed electronics on medical devices, radiopaque markers, analytical instrumentation and integrated sensors.

For engineers and technical purchasers working with high‑reliability passive and sensing functions, these Exxelia documents can help clarify when Micropen direct‑write technology is a viable alternative to conventional wired components and assemblies.

RelatedPosts

Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

HEICO’s Exxelia Expands High-Voltage Ceramic Capacitor Portfolio with CalRamic Acquisition

Exxelia Extends Temperature Range of its PP Film Capacitors to 140C

What Micropen technology offers to hardware designers

Micropen is a direct‑write printed electronics process that deposits functional materials (for example resistive, conductive or sensing inks) directly onto a substrate instead of using separate chips, wires or assemblies according to the manufacturer’s documentation. This enables resistors, heaters, sensors and interconnects to be formed as patterns on complex 2D or 3D geometries, including medical device surfaces and structures in analytical instruments.

For designers used to conventional thick‑film or SMD passives, the key value is the ability to “turn the substrate into the component” by integrating these functions in place, rather than routing to remote discrete parts. This can reduce interconnect count, shorten signal paths and simplify mechanical packaging in tight or dynamic spaces such as catheters, probes or compact analyzers.

Key themes of the new Micropen white papers

The new white papers from Exxelia Micropen focus on several application domains around printed electronics and sensor integration:

  • Printed electronics on medical devices, including ways to embed sensing or heating functionality directly onto device surfaces according to manufacturer documentation. Exxelia Micropen – Printed Electronics on Medical Devices white paper
  • Direct‑written radiopaque markers for medical devices, positioned as an alternative to traditional marker bands and coils. Exxelia Micropen – Radiopaque (RO) marker white paper
  • Micropen‑fabricated drift tubes for mass spectrometry and ion mobility spectrometry in analytical instruments. Exxelia Micropen – Drift tubes for mass spectrometry and ion mobility spectrometry white paper
  • A journal‑style biomedical technology and research article related to technological integration in clinical environments. Journal of Biomedical Technology and Research
  • Design concepts for replacing wired sensors, resistors, heaters and antennas with direct‑printed structures. Revolutionizing Design and Sensors; Design Idea – Replace Wired Sensors and Resistors

Together, they form a technical overview of how direct‑write printing can replace, complement or extend classical passive components and interconnects in demanding applications.

Typical applications highlighted in the Micropen material

The specific white papers linked from the Micropen technical center cover scenarios where passive or sensor functionality is directly printed onto or into a mechanical structure. Typical use cases include:

  • Medical devices
    • Printed sensors and heaters on catheters, probes or surgical instruments for temperature monitoring, ablation control or therapy delivery.
    • Conductive patterns and resistors printed on implantable or temporary devices where space and biocompatibility are critical (exact examples and limits are detailed in the white papers and datasheets).
    • Radiopaque markers printed as patterns on device surfaces, offering an alternative to metal bands or coils for X‑ray visualization while minimizing added profile and avoiding sharp transitions.
  • Analytical instrumentation
    • Drift tubes for mass spectrometry and ion mobility spectrometry with printed resistive or electrode structures along the tube wall, enabling controlled electric fields and compact assembly.
    • Integration of printed heater or sensor elements onto structural parts, reducing the need for separate heater cartridges or bolted‑on sensors.
  • General sensor and passive integration
    • Replacement of wired sensors and discrete resistors used for temperature, position, or pressure monitoring by printed resistor and sensor patterns.
    • Printed antennas or RF structures integrated on dielectric supports or housings, depending on material compatibility and frequency requirements as detailed in the relevant design documentation.

In many of these cases, Micropen functionality plays a similar role to traditional thick‑film resistors, heaters or sensor elements, but applied directly to the final substrate instead of an intermediate ceramic or PCB.

Design‑in notes for engineers

When evaluating Micropen‑based solutions as part of a passive or sensor design strategy, consider the following practical points:

  • Treat the printed function like a custom passive
    • Rather than selecting a catalog SMD resistor or thermistor, you are effectively specifying a custom printed element whose geometry, resistance, layout and location can be tuned for your application.
    • Early engagement with Exxelia’s technical team and the relevant Micropen white papers is recommended to define electrical ratings, environmental limits and mechanical constraints according to manufacturer datasheets.
  • Understand thermal paths and power density
    • For printed heaters or power resistors on thin‑wall catheters, probes or drift tubes, the thermal path into the surrounding medium (fluid, tissue, gas) is critical.
    • Use the white papers as a starting point, then perform your own simulation or testing to validate power density, temperature gradients and maximum allowable operating temperatures according to your safety case.
  • Define insulation and creepage/clearance
    • Where printed conductors or resistors are used at elevated voltages, creepage and clearance distances along the substrate surface must be designed according to IEC and UL requirements for your equipment class.
    • Surface finish, coatings, humidity exposure and pollution degree all influence how close printed features can be without risking tracking or breakdown.
  • Specify measurement and test requirements
    • For sensor applications (temperature, pressure, position, flow), define calibration strategy, drift limits and test conditions in your component or subassembly specification.
    • Micropen’s ability to produce consistent geometries should help with repeatability, but your test plan needs to confirm performance over the full lifetime and environmental range.
  • Consider supply chain and lifecycle
    • Since Micropen is a process‑driven technology, the “component” is a combination of substrate, ink and printing process carried out by Exxelia.
    • Purchasing and engineering teams should align on long‑term availability, change control, and second‑source strategies (if any) as they would with other custom or application‑specific passive components.

Availability and how to access the white papers

The new Micropen white papers are available through the Exxelia Technical Center under the Micropen‑related guides and technical documents section. From the overview page, engineers can navigate directly to individual titles such as printed electronics on medical devices, radiopaque markers, drift tubes for mass spectrometry and the design idea paper on replacing wired components with direct‑printed structures.

Source

This article is based on information published by Exxelia in its Micropen guides and technical center materials, with interpretation and context added for design and purchasing engineers. For detailed ratings, performance data and application limitations, always refer to the original white papers and associated datasheets from the manufacturer.

References

  1. New White Papers Available: Explore the Full Potential of Micropen Technology – Exxelia
  2. Exxelia Micropen – Technology overview
  3. Exxelia Technical Center – Micropen documents
  4. Exxelia Micropen – Printed Electronics on Medical Devices white paper
  5. Exxelia Micropen – Radiopaque (RO) marker white paper
  6. Exxelia Micropen – Drift tubes for mass spectrometry and ion mobility spectrometry white paper

Related

Recent Posts

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
24

SCHURTER THT DIP Switches Support Hardware-Level Configuration

9.9.2026
3
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
15

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
24

Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

24.8.2026
32

Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

20.8.2026
141

Single Pair Ethernet for Humanoid Robot In-Robot Networks

17.8.2026
208

YAGEO Releases SMD 0402 Pt Temperature Sensors for Space‑Constrained Designs

3.8.2026
108

Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs

29.7.2026
121

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved