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Passive Components News
High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors
Researchers from Northeastern University, Shenyang and the State Key Laboratory of Digital Steel and Hengdian...
European Components Distribution Shows Strong Q1 2026 Growth Amid Geopolitical Uncertainty
European electronic components distribution grew 16.9 percent to €4.63 billion in the first quarter of...
Stackpole Expanded its AlN Thick Film Chip Resistors
Stackpole Electronics has expanded its RMAN series of thick film chip resistors, which use aluminum...
KYOCERA 10 µF 0201 MLCC Brings High‑Capacitance into Mobile Designs
Kyocera has developed what it describes as the world’s first 10 µF multilayer ceramic chip capacitor...
Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive
Würth Elektronik has introduced the WE-SFIA series of SMT flat-wire inductors in compact 2010, 2013,...
KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection
KYOCERA AVX has extended its TransGuard VT Series of multilayer varistors (MLVs) with new versions...
Energy Localization in Tantalum Anode Formation: A Structural Perspective
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, provides deep inside explanation...
Wk 18 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-1-26. DATAPOINT OF THE WEEK: S&P reported US mfg PMI surged...
DigiKey Adds 31k New In‑Stock Parts in Q1 2026
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new...
Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the...
Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs)...
Wk 17 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 4-24-26. DATAPOINTS OF THE WEEK: March new car registrations in Europe totaled...
Exxelia Introduces SMD High‑Voltage Mica Capacitors
Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers...
Modelithics Releases COMPLETE v26.1 for Keysight ADS
Modelithics has released version 26.1 of its Modelithics COMPLETE Library for Keysight Advanced Design System...
April 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s IP&E report suggests that the momentum for recovery is continuing to build and...
SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem
This article walks through the current state of Vishay's non-linear resistor (NLR) simulation toolkit and...
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Inter-connect, Electro-mechanical and Sensors
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder Extends NCC Circular Connectors for Harsh Environments
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard
The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...
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Planar vs Conventional Transformer: When it Make Sense
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