High Density Interconnect Support PCB Miniaturization

This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect (HDI) solutions.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the “via in pad” design play a decisive role in unbundling increasingly dense BGA components.

In this webinar we will show you:

• Miniaturization options for rigid PCBs
• Different via designs
• Design rules for High Density Interconnect
• Layer structures & cost development
• Signal integrity with HDI
• Reliability aspects and heat dissipation with HDI