Modelithics Partners with ANSYS to Accelerate Creation of Complex Wireless Communication Systems for 5G and the IIoT/Industry 4.0

Source: Modelithics news

PITTSBURGH, December 18, 2018 –Modelithics and ANSYS will develop the industry’s first 3D electromagnetic simulation component model library that will enable customers to accelerate the design of wireless communication systems for 5G, smart devices and the industrial internet of things (IIoT/Industry 4.0). The partnership creates a new industry paradigm for sharing intellectual property (IP) and increases the accuracy of the radio frequency (RF) and microwave design process for networking equipment and mobile devices.

Components such as inductors, capacitors, connectors and packaged filters used in wireless communication devices are packed tightly together in compressed packages to achieve increased functionality and product miniaturization. The resulting component-to-component electromagnetic (EM) field interactions and coupling, which are typically ignored in a system-level modeling approach, can significantly influence circuit performance, especially at higher 5G and millimeter wave frequencies. The ability to predict these effects during simulation is critical to meeting development timelines within budget.

Modelithics and ANSYS will create a library of models that are defined by their physical geometry and material properties and can properly simulate interactions between components and their surrounding environment. These simulation-ready 3D components can simply be added to larger system designs in ANSYS® HFSSTM without the need to apply excitations, boundary conditions or material properties.

“Through the partnership, developers of discrete components can create simulation-ready 3D components in ANSYS HFSS and provide them to end users who can reference them in larger system simulation,” said Larry Dunleavey, president, Modelithics. “The ability to collaborate through 3D

components enables vendors to provide their customers with HFSS simulation-ready models, giving them a valuable edge in enabling first-pass design success.”

“The sharing of 3D simulation-ready components is a new paradigm in electronics design and is made possible through the use of high-level, standard encryption algorithms and ANSYS’ patented feature to hide model details in HFSS — keeping a vendor’s IP safe,” said Mark Ravenstahl, technical director, strategic partnerships and business development at ANSYS.

“As the leader in providing RF and microwave models, Modelithics is the right partner to deliver these models. Multiple component vendors have already committed to participating in the initiative to prioritize 3D model development of their parts.”

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