Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Demonstrated Novel BTO Based Capacitor Heterostructures with 19x Higher Energy Density

23.4.2024
Reading Time: 4 mins read
A A
Artificial heterostructures made of freestanding 2D and 3D membranes developed by Sang-Hoon Bae’s lab have an energy density up to 19 times higher than commercially available capacitors. (Credit: Bae Lab)

Artificial heterostructures made of freestanding 2D and 3D membranes developed by Sang-Hoon Bae’s lab have an energy density up to 19 times higher than commercially available capacitors. (Credit: Bae Lab)

Sang-Hoon Bae, researcher at McKelvey School of Engineering at Washington University in St. Louis, USA developed BaTiO3(BTO) based heterostructures with material properties optimal for high-density energy storage capacitors with durable ultrafast charging.

Electrostatic capacitors play a crucial role in modern electronics. They enable ultrafast charging and discharging, providing energy storage and power for devices ranging from smartphones, laptops and routers to medical devices, automotive electronics and industrial equipment. However, the ferroelectric dielectric materials used in ceramic capacitors have significant energy loss due to their material properties, making it difficult to provide high energy storage capability. 

RelatedPosts

Samsung Low-Profile and Embedded MLCCs for Compact Devices

Wk 36 Electronics Supply Chain Digest

Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

Sang-Hoon Bae, assistant professor of mechanical engineering & materials science in the McKelvey School of Engineering at Washington University in St. Louis, has addressed this long-standing challenge in deploying ferroelectric materials for energy storage applications.

In a study published April 18 in Science, Bae and his collaborators, introduce an approach to control the relaxation time using two-dimensional (2D) materials while minimizing energy loss by using 2D/3D/2D (Au/MoS2/BaTiO3/MoS2/Au) heterostructures and preserving the crystallinity of ferroelectric 3D materials. Using this approach, we were able to achieve an energy density of 191.7 joules per cubic centimeter with an efficiency greater than 90%. This precise control over relaxation time holds promise for a wide array of applications and has the potential to accelerate the development of highly efficient energy storage systems.

Working with Bae, doctoral student Justin S. Kim and postdoctoral researcher Sangmoon Han developed novel 2D/3D/2D heterostructures that can minimize energy loss while preserving the advantageous material properties of ferroelectric 3D materials. Their approach cleverly sandwiches 2D and 3D materials in atomically thin layers with carefully engineered chemical and nonchemical bonds between each layer. A very thin 3D core is inserted between two outer 2D layers to create a stack only about 30 nanometers thick. That’s about one-tenth the size of an average virus particle. 

“We created a new structure based on the innovations we’ve already made in my lab involving 2D materials,” Bae said. “Initially, we weren’t focused on energy storage, but during our exploration of material properties, we found a new physical phenomenon that we realized could be applied to energy storage, and that was both very interesting and potentially much more useful.”

The 2D/3D/2D heterostructures are finely crafted to sit in the sweet spot between conductivity and nonconductivity where semiconducting materials have optimal electric properties for energy storage. With this design, Bae and his collaborators reported an energy density up to 19 times higher than commercially available ferroelectric capacitors, and they achieved an efficiency over 90%, which is also unprecedented.

“We found that dielectric relaxation time can be modulated or induced by a very small gap in the material structure,” Bae explained. “That new physical phenomenon is something we hadn’t seen before. It enables us to manipulate dielectric material in such a way that it doesn’t polarize and lose charge capability.”

As the world grapples with the imperative of transitioning toward next-generation electronics components, Bae’s novel heterostructure material paves the way for high-performance electronic devices, encompassing high-power electronics, high-frequency wireless communication systems, and integrated circuit chips. These advancements are particularly crucial in sectors requiring robust power management solutions, such as electric vehicles and infrastructure development.

“Fundamentally, this structure we’ve developed is a novel electronic material,” Bae said. “We’re not yet 100% optimal, but already we’re outperforming what other labs are doing. Our next steps will be to make this material structure even better, so we can meet the need for ultrafast charging and discharging and very high energy densities in capacitors. We must be able to do that without losing storage capacity over repeated charges to see this material used broadly in large electronics, like electric vehicles, and other developing green technologies.”


Han S, Kim JS, Park E, Meng Y, Xu Z, Foucher AC, Jung GY, Roh I, Lee S, Kim SO, Moon JY, Kim SI, Bae S, Zhang X, Park BI, Seo S, Li Y, Shin H, Reidy K, Hoang AT, Sundaram S, Vuong P, Kim C, Zhao J, Hwang J, Wang C, Choi H, Kim DH, Kwon J, Park JH, Ougazzaden A, Lee JH, Ahn JH, Kim J, Mishra R, Kim HS, Ross FM, and Bae SH. High energy density in artificial heterostructures through relaxation time modulation. Science, April 18, 2024. DOI: https://www.science.org/doi/10.1126/science.adl2835 

Related

Source: Washington University in St.Louis

Recent Posts

Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

Samsung Low-Profile and Embedded MLCCs for Compact Devices

21.9.2026
2
Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

Samsung MLCC Options for 1 MW AI Rack Power

18.9.2026
19
Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

Exxelia Passive Components Support BepiColombo Mission

16.9.2026
23
TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

16.9.2026
34

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
78

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
61

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
33

Emerging Capacitor Markets in Fusion Energy

10.9.2026
59
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
133

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Ohm’s Law Answers Your Questions

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved