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    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

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Wk 08 Electronics Supply Chain Digest

26.2.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 2-23-24

DATAPOINT OF THE WEEK: S&P reported February US Flash mfg PMI of 51.5 vs 50.7 in January, reflecting the sharpest upturn since Sep 2022 with renewed growth in output and orders.

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Wk 35 Electronics Supply Chain Digest

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Despite stronger demand conditions, S&P notes Industrial companies continued to reduce their input buying, albeit at a slower pace. S&P also reported Eurozone flash mfg PMI of 46.1 vs 46.6 in January, reflecting an accelerating decline in output after the moderation seen in January and a sharper decline in new orders.

Output and new orders fell the most in Germany, where Feb flash PMI dropped to 42.3 from 45.5 in January.

Headlines:

Auto

  • Audi union in Mexico agrees to salary hike, ending strike
  • Price war in China’s passenger car market to remain fierce in 2024, says CPCA secretary-general
  • Feb retail auto sales in China expected to decline seasonally by more than 40% M/M
  • Signs of first casualties in China EV with HiPhi suspending operations for at least 6 months
  • Global xEV sales increased 30% in 2023, projected to grow at the same rate in 2024 by TrendForce
  • US to soften tailpipe rules, slow EV transition through 2030
  • New car sales in Europe better than seasonal; BEV penetration down to a year low, ICE penetration up to 50% from 44% in Dec
  • Mercedes delays Electrification goals, sees ICE in the line-up beyond 2030
  • Rivian projects flat 2024 EV production; announces 10% workforce cut
  • New car sales in Germany weaker than seasonal in January. xEV and BEV penetration down to Jan-23 low
  • Toyota extends shutdown of two production lines after emission test irregularities

Industrial

  • MLCC ceramic capacitor shipments to decline 7% Q/Q in 1Q says TrendForce

Semiconductors

  • Fears of ASML equipment used for China military behind the Dutch government’s decision to restrict ASML sales
  • ADI sees revenue bottoming 36% lower in Apr-Q before rebounding in July
  • ADI and TSMC have entered into LTA for supply of key auto technologies from TSMC’s capacity in Japan
  • ASE has bought two back-end facilities from Infineon
  • US reportedly suspends permission for materials shipping to SMIC but states no plan to restrict sales of mature chips to China
  • China firms cutting OLED DDI prices says DigiTimes
  • GlobalFoundries to receive $1.5B subsidy from the CHIPS Act
  • Intel rumored to receive $10B of subsidy from the US CHIPS Act
  • Microsoft to use Intel’s foundry services for custom chip manufacturing
  • Intel says Arrow Lake and Lunar Lake PC CPUs to be manufactured on TSMC’s 3nm process.
  • US Department of Energy gives SK Siltron $544M loan to expand SiC wafer manufacturing in Michigan
  • Nividia continues to set record results driven by robust AI demand
  • Kioxia and Western Digital merger talks expected to resume in April

Other

  • Foldable smartphone shipments to grow 11% in 2024 to 17.7m units says TrendForce

Related

Source: Edgewater Research

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