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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

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Remcom Announces Circuit Co-Simulation In XFdtd Electromagnetic Simulation Software

14.12.2017
Reading Time: 1 min read
A A

source: Globe News Wire article

State College, PA, Dec. 13, 2017 (GLOBE NEWSWIRE) — Remcom announces circuit co-simulation and expanded signal integrity capabilities in the latest update to XFdtd® 3D Electromagnetic Simulation Software. 

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Circuit co-simulation facilitates a more realistic analysis of device performance by including imported circuit components within the electromagnetic simulation.  The schematic for a desired component may be imported into XF via a netlist file, with support for SPICE elements such as resistors, capacitors, inductors, coupled inductors, and subcircuits.  Netlist components can also be assigned as a matching circuit embedded within a feed, simplifying matching network design.

This release also introduces a nodal waveguide interface with enhanced options for computing S-parameters.  A user-defined reference impedance enables renormalized S-parameters to be computed for transmission lines that would typically display an impedance mismatch.  A nodal excitation is also available for simulations that do not require S-parameters to be collected.

featured image: Surface mounted capacitor is updated during the FDTD simulation based on its SPICE model.

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