Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samsung Electro-Mechanics Develops World’s Smallest Power Inductor

14.9.2020
Reading Time: 3 mins read
A A

Samsung Electro-Mechanics revealed that it had developed the world’s smallest 0804 size power inductor.

The power inductor that was developed is of 0804 size (width 0.8mm, length 0.4mm), which is a significant decrease in area compared to the previously most smallest product of size 1210 (width 1.2mm, length 1.0mm), with a thickness of only 0.65mm. Samsung Electro-Mechanics is planning to supply this product global mobile companies.
 
The power inductor is a core component necessary to supply stable electricity (power) coming from the battery to the semiconductor, and it is a necessity used in smart phones, wearable devices, and electric vehicles. Recently, with the gradual trend towards light weight and size reduction of IT devices and increase in the number of multifunctional and high-performance components installed in 5G telecommunications and multi-cameras, the internal storage space for components has decreased, requiring miniature products. Moreover, with an improvement in component specs, power usage has increased, resulting in the need for power inductors that can withstand high currents.
 
The performance of the power inductor is generally determined based on the magnetic substance material (an object with magnetic characteristics) and the number of coils (copper wires) that can be internally winded. That is, in order to improve the performance of the power inductor, it is necessary to improve the magnetic substance characteristics and wrap more coils within a limited space.
 
Based on its material technology and semiconductor substrate manufacturing method accumulated through MLCC< Samsung Electro-Mechanics was able to reduce the size by approx. 50% and improve electricity loss. Moreover, rather than generally processing the power inductor in individual units, Samsung Electro-Mechanics manufactured them in substrate units to improve productivity and develop a thin product.

RelatedPosts

NIC Components Extends SMD High Voltage MLCC Offering

Stackpole Offers RoHS Compliant Lead-Free Thick Film Chip Resistors

Smiths Interconnect’s SMD Power Resistors with Heat Sink Qualified to Space Flights

Samsung Electro-Mechanics developed materials that applied nano-grade, ultra-microscopic powder in-house and succeeded in realizing finely spaced coils by applying the dimming technology (manufacturing method using light to mark circuits) applied in semiconductor manufacturing.
 
Kang Heon Hur, Vice President and Head of the Central Research Institute at Samsung Electro-Mechanics, revealed, “As the performance for electronic products increase and functionalities diversify, the size of the internal components must decrease along with an improvement in performance and volume. To do this, differentiating technology is necessary. Samsung Electro-Mechanics has been enhancing its product competitiveness through conversion and integration of technologies as the only company that possesses both material technology and micro engineering technology.”   
 
Since 1996, Samsung Electro-Mechanics has been developing and manufacturing inductors, and it has been recognized for its industry-leading technology in miniaturization. Samsung Electro-Mechanics plans to expand its product line-up and market share through material development and super-differential technology, such as ultrafine engineering method.
 
With the high-performance and multifunctionality of electronic devices, activation of 5G telecommunications, and growth of the wearable device market, the demand for super-small power inductors is expected to grow at a rapid pace, and its installment within electronic devices is forecasted to grow by at least 20% per year.
 
※ Reference
Both the MLCC and power inductors are passive components that control voltage/current to allow for smooth operation of electronic devices. Because each component has its own characteristics, they must both be installed in the electronic device. Generally, the capacitator serves a role in supplying voltage and the inductor serves a role in supplying stable energy to the semiconductor by preventing sudden changes in the current. 

Related

Source: Samsung Electro-Mechanics

Recent Posts

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
30
Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

10.9.2026
27
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
120

Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

7.9.2026
25

Murata Expands Automotive Metal Power Inductor Range

7.9.2026
42

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
60

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
54

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
42

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
68

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved