Samsung Electro-Mechanics introduces its High-Capacitance 1µF, 25V MLCC ceramic capacitors in 0402 inch case size for AI Power Module applications.
Samsung Electro-Mechanics has unveiled an ultra-compact, high-capacitance multilayer ceramic capacitor (MLCC) designed specifically for AI server power applications, addressing the growing demand for miniaturization and enhanced power density in next-generation computing infrastructure.
The Challenge: Miniaturization in AI Server Power Design
AI servers require significantly more power than conventional servers due to multiple high-performance chips including memory, GPU, and CPU.
The efficiency of power modules that supply stable power directly to GPUs critically impacts overall server performance. These power modules take a 12V input and provide the low voltages required by GPUs and CPUs (0.8–1.5V) through DC/DC conversion.
High-performance semiconductors mounted on server mainboards operate at low voltages (0.8–1.5V) to improve power efficiency. During fast-paced operations, peak currents with large fluctuations occur, requiring substantial quantities of MLCCs to stabilize the power supply. As component integration increases and PCB areas shrink, the need for ultra-small, high-capacitance MLCCs that meet both requirements simultaneously continues to grow.
The Solution: Ultra-Compact, High-Performance MLCC
To support the hundreds to thousands of MLCCs required at the server VRM 12V input stage, Samsung Electro-Mechanics has released an innovative product: 0402 inch, 1µF, 25V, X7S rated MLCC. This component effectively removes power instability (noise/ripple) caused by the current load of power-consuming GPUs and CPUs, thereby improving both server performance and reliability.
Key Features and Benefits
| Feature | Benefit |
|---|---|
| 25V Rating | Effective noise suppression on the 12V power rail |
| 0402 inch Ultra-Small Form Factor | Saves over 50% mounting area compared to conventional 0603 size, enabling higher component density and greater total capacitance |
| X7S Temperature Rating (-55°C to 125°C) | Ensures power stabilization in high-temperature operating environments |
Product Specifications
| Part Number | Size (inch/mm) | Capacitance | Rated Voltage | TCC | Availability |
|---|---|---|---|---|---|
| CL05Y105KA56UW# | 0402 / 1005 | 1µF | 25Vdc | X7S | Samples Available |
Industry Impact
This product is ideally suited for AI server power-module designs and significantly improves power density. More than just a component, it represents foundational technology aimed at surpassing the limits of high-performance computing and driving the stable establishment of next-generation AI infrastructure.