Smoltek Nanotech Holding AB has published a new interview in which Philip Lessner, CTO at Yageo Group, analyzes the latest developments in ultra-thin wafer-based capacitors.
In the interview, he explains why Smoltek’s CNF-MIM capacitor technology can offer decisive advantages in the fast-growing semiconductor market.
The market for ultra-thin capacitors is expected to grow strongly in the coming years, especially for advanced electronic applications such as AI, data centers and mobile devices.
Smoltek continues to develop the company’s capacitor technology, CNF-MIM, to meet these needs and has recently conducted an interview with Philip Lessner, CTO of Yageo Group, one of the world’s largest capacitor manufacturers, where he confirms significant progress in technology development.
“Smoltek has really made two major advances in capacitor technology. One is that you switch to a stack with a much higher dielectric constant, which ultimately allows for higher capacitance capacitors. The other big advance is that you can grow better vertical carbon nanofibers. I have seen the images from the scanning electron microscope, and they are very impressive”, says Philip Lessner.
In the interview, Philip Lessner also emphasizes the technical advantage of Smoltek’s manufacturing process. Unlike market leaders such as TSMC, Murata and Samsung, which use a method where material is etched away, Smoltek builds up the structures by adding material where it is needed. This results in a more stable substrate.
“The advantage is that Smoltek has a unique capacitor technology that differs from the technology that competitors have invested in, and that has the potential to surpass the performance of the existing technology once it is fully developed”, says Philip Lessner.
The interview also covers new market segments beyond mobile phones, technical possibilities for future applications and the development plan for the commercialization of the technology.
New dielectric stack shows stable performance
When asked about Smoltek’s development over the past year, Lessner immediately points to two significant advances.
The first is the switch to a new dielectric stack that has increased the dielectric constant by more than 1.5 times. It’s worth noting that this new stack, developed in collaboration with an academic lab in Korea, is now showing what Lessner describes as “very stable performance under heat and voltage” in YAGEO’s own electrical test labs.
Improved nanofiber growth points to higher capacitance
The second breakthrough that draws Lessner’s attention is more visual. After examining scanning electron microscope photos of our latest nanofiber growth results, he specifically praises the team’s achievement in growing long, vertical carbon nanofibers that maintain their direction without tangling – a crucial advancement that he describes as “very impressive.”
This ability to grow taller, well-aligned nanofibers is key to achieving higher capacitance. According to Lessner, increasing the height from about 4 microns to 10 microns is one of the critical steps in Smoltek’s development plan. The goal is to match the industry benchmark of 1.5 microfarads per square millimeter, currently achieved by TSMC, the world’s leading manufacturer of ultra-thin capacitors.
A fundamental advantage in how we build
One of the most interesting parts of the interview comes when Lessner explains what he sees as a fundamental advantage in Smoltek’s manufacturing approach.
While our competitors like TSMC, Murata and Samsung use what he calls a “subtractive technology”—they need to etch trenches in the substrate—Smoltek does the opposite. Our “additive technology,” as Lessner explains it, builds up the structure by adding material exactly where needed. Why does this matter? Because according to Lessner, it results in a more mechanically stable substrate.
Future-proof technology
When discussing future possibilities, Lessner points to another significant advantage that sets Smoltek apart: our ability to grow carbon nanofibers on various substrates, not just silicon.
This might not seem revolutionary until you consider, as Lessner points out, that major players like Intel are actively pursuing glass interposer substrates. The fact that our technology could potentially work with materials like glass or aluminum opens up exciting possibilities for future applications.
Development timeline towards commercial product
For those following our progress toward commercialization, Lessner outlines what he expects to see ahead. Based on his discussions with our CTO, he hopes to see a first product in early 2025, achieving about one-third of the market-leading performance levels previously mentioned. By late 2025 or early 2026, he believes the technology could match these performance levels.
Growing market opportunities
While mobile phones currently drive the market for ultra-thin capacitors, Lessner sees AI data centers as the next major growth opportunity.
His explanation of the power requirements for next-generation AI processors, particularly GPUs, is eye-opening: they may need up to 1000 watts at one volt or less—meaning peak currents of 1000 amps. This is where Smoltek’s ultra-thin capacitors could shine, enabling vertical power delivery systems placed directly under the processor—significantly reducing power loss and improving efficiency.
Strong competition but unique position
Lessner acknowledges the strong competition from industry giants like TSMC, Murata and Samsung, noting that they are “fierce competitors” and “absolute giants” in the electronics industry.
However, he emphasizes what makes Smoltek different: “You have a unique technology that’s different from the technology that they’ve invested in,” he notes. Even more encouraging is his belief that our technology “has the potential to exceed the performance of the incumbent technology once it’s fully developed.”
I invite you to watch the full interview above, where Lessner shares more detailed insights about our technology and market position. His analysis provides a valuable perspective on both our current position and future potential in the ultra-thin capacitor market.
