TDK Unveils 125C Compact DC Link Film Capacitors

TDK has introduced the B3271xP series of DC link film capacitors aimed at demanding automotive and industrial power electronics operating up to 125 °C.

The series targets engineers who need high ripple current capability, compact dimensions, and long service life in thermally constrained inverter, converter, and power supply designs.

Key features and benefits

The B3271xP series is a family of polypropylene (MKP) DC link capacitors designed for use on the DC bus of power conversion systems where elevated ambient temperature and continuous ripple loading are present. Its construction and ratings are optimized for xEV traction inverters, onboard chargers, DC‑DC converters, and industrial drives that operate close to the thermal limits of surrounding semiconductors and magnetics.

Main performance features include:

From a mechanical and safety perspective:

Typical applications

The B3271xP film capacitor series is positioned as a DC link solution for both automotive and industrial power stages where high thermal robustness is essential. In automotive, the capacitors address powertrains and auxiliary power electronics that must operate reliably in compact enclosures with limited airflow.

Representative use cases include:

In many of these applications, ambient and hot‑spot temperatures near the DC link capacitor can easily exceed 100 °C during normal operation. A maximum operating temperature of 125 °C with derating starting only at 105 °C allows more predictable lifetimes and can reduce the need to over‑dimension the capacitor bank.

Technical highlights

The series consists of three main ordering code families, differentiated primarily by lead spacing, capacitance range, and current capability. This structured portfolio helps designers select a suitable mechanical footprint while maintaining consistent electrical behavior at system level.

Key data by ordering code

These values give a first indication of the achievable ripple current handling at a representative switching frequency; exact ratings and permissible operating points should be confirmed from the manufacturer datasheet for each specific part number. The combination of high RMS current, low ESR, and polypropylene dielectric enables the capacitors to maintain relatively low internal temperature rise, which directly impacts lifetime in DC link service.

The series adopts a plastic case and epoxy potting approach that provides environmental sealing and mechanical stiffness. In applications subject to shock and vibration, the optional 4‑pin versions can help distribute mechanical stress and reduce the risk of solder joint fatigue, while also lowering equivalent series inductance (ESL) for improved high‑frequency performance.

Design‑in notes for engineers

For design engineers, the key differentiator of the B3271xP series is the elevated maximum operating temperature combined with high ripple current capability. When dimensioning the DC link, it is important to evaluate not only the RMS ripple current at the fundamental switching frequency but also the harmonic spectrum and ambient temperature profile over the mission profile.

Practical design‑in considerations include:

For simulation‑driven design, TDK offers SPICE model libraries and the web‑based CLARA (Capacitor Life And Rating Application) tool. These resources allow engineers to estimate lifetime under specific electrical and thermal conditions and to validate voltage ripple and current distributions early in the design process.

Source

This article is based on an official press release and supporting information from TDK on the B3271xP series of DC link film capacitors for automotive and industrial power electronics.

References

  1. TDK presents DC link capacitors for up to +125 °C in demanding automotive and industrial applications
  2. TDK DC link film capacitors – product overview
  3. TDK SPICE model libraries for film capacitors
  4. TDK CLARA – Capacitor Life And Rating Application
Exit mobile version