Wed, Dec 6, 2023 11:00 AM – 12:00 PM CET
Dive into the fascinating world of miniaturization of printed circuit boards with partial vias. Microvias that are combined with each other in different ways. When it comes to connecting all copper layers with only the adjacent copper layer using the smallest microvias, we speak of anylayer microvias. Find out more about SLIM.flex, our anylayer microvia flex technology. Wherever small and ultra-small components are used, such as sensors in micro-packages, the ultra-thin SLIM.flex products impress thanks to the available standards and enormous robustness combined with maximum flexibility.
In our webinar on December 6, 2023 at 11:00 a.m., we will offer you insights into:
The webinar is of interest to PCB designers, developers and students who want to dive into the world of innovative PCB technologies.
© EPCI - Premium Passive Components Educational and Information Site
© EPCI - Premium Passive Components Educational and Information Site