Medical

Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging...

Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers who need both pulse handling...

Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...

Vishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very compact 1212 case size (3.0...

The new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC converters and embedded power rails...

SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...

Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6...

Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...

Würth Elektronik has introduced the WSEN-PDMS, a compact differential pressure sensor that combines high accuracy, flexible interfaces and multiple port...

Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...