Electronic components are often treated as static building blocks once sealed in bags and placed on warehouse shelves. In reality,...
Read moreDetailsStackpole Electronics has introduced the RVCU series of high‑voltage chip resistors, targeting precision voltage divider, sensing, and measurement circuits operating...
Read moreDetailsThis article based on edited report written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, explains and discuss why stress–strain curves...
Read moreDetailsThe SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
Read moreDetailsVishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging...
Read moreDetailsExxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers who need both pulse handling...
Read moreDetailsHirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Read moreDetailsVishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very compact 1212 case size (3.0...
Read moreDetailsThe new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC converters and embedded power rails...
Read moreDetailsSCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site