New Technologies

A team at the Hefei Institutes of Physical Science, Chinese Academy of Sciences, led by Zhenyang Wang, reported a monolithic,...

A University of Nebraska–Lincoln-led team has reported intrinsic antiferroelectric behavior in compressively strained, La-doped hafnia thin films, published in Science...

Alessandro Paghi, Farbod Abazar and colleagues from the University of Pisa, with contributors from Scuola Normale Superiore, CNR Nanosciences and...

The study by Ella Paasio and co-authors, involving researchers from the University of Helsinki, Technical University of Munich, University of...

Researchers Ji Zhang, and col., working in materials science and electronic ceramics research institutions in China and Australia published their...

Imec has extended its 300 mm RF silicon interposer platform with high‑density metal–insulator–metal capacitors (MIMCAPs), a scalable passive modeling framework and...

Researchers in Europe with expertise in nanofluidics, electrochemistry, clay mineralogy, and electron microscopy to design and characterize a new type...

Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published by Nature that a molecular...

Researchers from Japanese research institutes investigated how to make ferroelectric memory components much thinner without losing performance. Their work, published...

Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a new class of electrocaloric multilayer...