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TDK Revised Its Powerful Ferrite Magnetic Design Tool

Protection for the Power Supply Explained

Sumida Releases Magnetic Shielded SMD Power Inductor with Low Loss Ferrite Core

EMI Suppression Shields: Understanding the Basics

New technology for pre-replenishing lithium for lithium ion supercapacitors

Call for Papers – ESA SPCD 4th Edition Space Passive Component Days

Panasonic Releases Low Profile 6A Relay

Stackpole Thru Hole Metal Film Resistors Offer High Power in Small Size

Transforming Vehicle into an Instrument, Continental and Sennheiser Revolutionize Vehicle Audio by Speakerless Sound
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Applications and Fundamentals of SuperCapacitors

Current sharing with MagI³C Power Modules

Rated Current of An Inductor; Kemet Video Explanation

AVX FE Series Film Capacitors – Tech Specs | TTI Inc Video

Multi Color LED Driver with MagI³C Modules

AVX Webinar | Doubling Battery Life in Industrial Applications

How to convert a voltage regulator power module into a current source

USB-C Power Board Design Consideration

TDK-EPCOS presents SIMID SMT Inductors
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Applications e-Blog

MLCC capacitors for RF and microwave applications

20.12.2019

Telecommunication

Inductors

Würth Elektronik Releases Super Tiny LAN Signal Transformer

21.11.2019

Waldenburg (Germany) — Würth Elektronik, a leading European manufacturer of electronic and electromechanical components, is expanding its extensive range of...

TDK releases World’s first multilayer band-pass filter for millimeter wave bands in 5G networks

19.11.2019

TDK Corporation has expanded its lineup of high frequency multilayer products with the world’s first* multilayer band-pass filter for the...

Aerospace & Defence

Tantalum Capacitors Support Nvidia to Shrink AI ‘Supercomputer’ to Credit Card Size

9.11.2019

162

by: EPCI blog NVIDIA today introduced Jetson Xavier™ NX, the world’s smallest, most powerful AI supercomputer for robotic and embedded...

Aerospace & Defence

High CV MLCC DC BIAS and AGEING Capacitance Loss Explained (updated)

27.11.2019

Source: EPCI article by: Tomas Zednicek, EPCI update: 31st October 2019 based on 2nd PCNS Passive Components Networking Symposium 10-13th...

Automotive

Murata releases 2nd quarter FY2019 presentation

31.10.2019

Source: Murata news Murata releases its FY2019 2nd quarter consolidated results from period July 1, 2019 to September 30, 2019....

Aerospace & Defence

IEEE Identifies Long-Term Electronics Technology Requirements in its Heterogenous Integration Roadmap

13.10.2019

Source: Business Wire news 2019 Heterogeneous Integration Roadmap (HIR) released by IEEE identifies long-term technology requirements to inspire collaboration in...