Bourns has introduced the FDP2009N122157H4, a low temperature co‑fired ceramic (LTCC) diplexer targeting compact GNSS L‑band RF front ends where...
Read moreDetailsModelithics has released a new family of nonlinear simulation models for Microchip PIN and varactor diodes, targeting RF, microwave and...
Read moreDetailsModern missile airframes combine multiple RF subsystems into an extremely confined volume, forcing engineers to solve complex filtering, coexistence and...
Read moreDetailsHigh-Q RF multilayer ceramic capacitors are often compared by footprint first, but in real RF and microwave circuits the decisive...
Read moreDetailsNon‑terrestrial networks (NTN) are rapidly becoming a core connectivity option for IoT and wireless devices operating beyond the reach of...
Read moreDetailsCoilcraft introduces 016008F ferrite-core wirewound chip inductors - ultra‑miniature RF chokes in 0402 (metric 01005) format, designed for high‑frequency circuits...
Read moreDetailsStackpole Electronics has introduced the RNCQ series of high-frequency thin film chip resistors optimized for RF and microwave circuits up...
Read moreDetailsKnowles Precision Devices has expanded its ceramic core inductor portfolio to address a wider range of RF and microwave designs...
Read moreDetailsKnowles Precision Devices has expanded its ceramic core inductor portfolio to address a broader range of RF and microwave designs...
Read moreDetailsVishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging...
Read moreDetails
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site