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Passive Components News
Modelithics Releases COMPLETE v26.1 for Keysight ADS
Modelithics has released version 26.1 of its Modelithics COMPLETE Library for Keysight Advanced Design System...
April 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s IP&E report suggests that the momentum for recovery is continuing to build and...
SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem
This article walks through the current state of Vishay's non-linear resistor (NLR) simulation toolkit and...
KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors
Kyocera AVX has introduced the FFLK series traction‑grade DC-link filtering film capacitors for high‑power drives...
When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into...
Why Power Inductors Use a Ferrite Core With an Air Gap
This post is based on edited tutorial video by Sam Ben-Yaakov that provides an educational...
Wk 16 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 4-17-26 DATAPOINT OF THE WEEK: TSMC announced its 1Q26 net profit...
YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems
YAGEO Group has introduced the R41D V234 Series, a new high-current Y2/X1 metallized polypropylene film...
Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers
Planar magnetics are an attractive option for high‑density power converters thanks to their low profile,...
YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs
The new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC...
Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications
Robots and humanoid robotic systems are rapidly transforming into sophisticated electromechanical systems. These systems often...
AI-Assisted Structural Diagnostics and Physics-Based Reliability Interpretation of Tantalum Capacitor Anodes
This work by Vladimir Azbel Ph.D. Semiconductor Process Reliability Engineer Consultant, presents an AI-assisted framework...
YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes
The new SCF76X series from YAGEO Group is a family of three‑phase common mode chokes...
KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD
KYOCERA AVX has expanded its series of MIL‑PRF‑32535 base metal electrode (BME) NP0 multilayer ceramic...
ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years
Sales confidence in the electronic components industry surged in March 2026, with the latest ECIA...
Vishay Releases 2-Way Wilkinson Divider / Combiner for 15–20 GHz RF Front Ends
The Vishay Sfernice WLKN‑000 is a 2‑way Wilkinson power divider / combiner designed for 15...
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Inter-connect, Electro-mechanical and Sensors
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder Extends NCC Circular Connectors for Harsh Environments
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard
The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...
Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test
Molex has extended its Cardinal RF product family with new multi‑port high‑frequency coaxial assemblies supporting measurements up to 145 GHz....
Earthing Systems and IEC Classification Explained
Earthing (grounding) systems are a fundamental part of low‑voltage electrical installations, directly influencing fault current paths, touch voltages and the...
Smiths Interconnect invests £2m in Costa Rica electronics plant
Smiths Interconnect has announced an investment of over £2 million in its manufacturing facility in Costa Rica to support the...
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