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Passive Components News
RF Filters and Passive Components Enabling the 7 Missile RF Subsystems
Modern missile airframes combine multiple RF subsystems into an extremely confined volume, forcing engineers to...
Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
Designers selecting cores for high‑frequency power inductors often face the choice between ferrite and nanocrystalline...
YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion
Higher switching frequencies and tighter power-density targets are reshaping inductor design across server, industrial and...
Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance
Coilcraft has introduced a family of high-current wirewound ferrite beads designed specifically for power line...
From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors
In this article, we look at how tantalum anode SSC (stress–strain characteristics) diagnostics can be...
Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments
Vishay’s new 34 PHE multi-turn absolute position sensor is a ready-to-use Hall-effect module aimed at...
YAGEO Introduces Automotive MOV Surge Protection Varistor
YAGEO Group’s KH-AT Series is a family of automotive‑grade, AEC‑Q200 qualified metal oxide varistors (MOV)...
TDK Releases Compact SMD Gate Drive Transformers for xEV
The new E13 EM surface‑mount transformer series from TDK targets 500 V automotive battery systems...
Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures
This article, edited from original article by Mark Laps, MLCC specialist at YAGEO Group, reviews...
Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection
Vishay Intertechnology has introduced six new SMD polymer PTC series that target USB‑C, PoE, battery‑powered...
MLCCs in the Age of AI: Q2 2026 Market Tightness
This overview article summarizes the global MLCC market in Q2/2026, outlines the roles of major...
AI Hardware Demand for Passive Components Dossier
Passive Components Blog has published its AI Hardware Passive Components Dossier 06/26 technical and market...
June 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s latest IP&E update indicates that the broad-based recovery across the market is still...
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
Kyocera AVX presents Antenna Integrator Studio (AIS) is a browser-based tool for selecting antennas and...
Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization
Simulation tools such as REDEXPERT and eDesignSuite are increasingly central to modern power converter design...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-26-26. DATAPOINT OF THE WEEK: May new car registrations in Europe...
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Inter-connect, Electro-mechanical and Sensors
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
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Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
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