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Passive Components News
Vishay Extends Power Inductors for DC/DC with 1212 Compact Case
Vishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very...
Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers
Planar magnetics are an attractive option for high‑density power converters thanks to their low profile,...
YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs
The new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC...
Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications
Robots and humanoid robotic systems are rapidly transforming into sophisticated electromechanical systems. These systems often...
AI-Assisted Structural Diagnostics and Physics-Based Reliability Interpretation of Tantalum Capacitor Anodes
This work by Vladimir Azbel Ph.D. Semiconductor Process Reliability Engineer Consultant, presents an AI-assisted framework...
YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes
The new SCF76X series from YAGEO Group is a family of three‑phase common mode chokes...
KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD
KYOCERA AVX has expanded its series of MIL‑PRF‑32535 base metal electrode (BME) NP0 multilayer ceramic...
ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years
Sales confidence in the electronic components industry surged in March 2026, with the latest ECIA...
TDK and Nippon Chemical Launch Joint Venture for MLCC Materials
TDK Corporation and Nippon Chemical Industrial have formally established a joint venture focused on advanced...
Wk 14 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 4-3-26. DATAPOINT OF THE WEEK: S&P reported Mar Eurozone mfg PMI...
Bourns Releases Compact High Current Shielded Power Inductors
Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors...
March 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s IP&E report indicates that the recovery trend continued to strengthen through the end...
APEC 2026 Power Electronics Trends and Implications for Passive Components
The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across...
Hydra Enhances Film Capacitor Robustness by Novel Gel Filler
Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its...
Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio
Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS...
Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India
India has approved 29 new projects under the Electronics Components Manufacturing Scheme (ECMS), unlocking investments...
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Inter-connect, Electro-mechanical and Sensors
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder Extends NCC Circular Connectors for Harsh Environments
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard
The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...
Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test
Molex has extended its Cardinal RF product family with new multi‑port high‑frequency coaxial assemblies supporting measurements up to 145 GHz....
Earthing Systems and IEC Classification Explained
Earthing (grounding) systems are a fundamental part of low‑voltage electrical installations, directly influencing fault current paths, touch voltages and the...
Smiths Interconnect invests £2m in Costa Rica electronics plant
Smiths Interconnect has announced an investment of over £2 million in its manufacturing facility in Costa Rica to support the...
Würth Elektronik Introduces Lead-Free SMT Spacers
Würth Elektronik has reworked its SMT spacer portfolio to use lead‑free alloys and added new assembly options targeted at high‑volume...
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Transformer-Based Power-Line Harvester Magnetic Design
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