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Passive Components News
Mechanical SSC Testing as a Structural Diagnostic Tool for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Stackpole Introduces High‑Voltage Low VCR Chip Resistors
Stackpole Electronics has introduced the RVCU series of high‑voltage chip resistors, targeting precision voltage divider,...
GDT Gas Discharge Tubes: Surge Protection Fundamentals, Selection, and Design‑in Tips
This article summarizes how GDT (Gas Discharge Tube) work, how they differ from other surge...
YMIN Introduces Vibration Resistant Compact Low ESR Aluminum Capacitors for Home Appliances
High‑speed cordless vacuum cleaners and robot sweepers are pushing their brushless motors and motor control...
Designing a Custom Core Transformer for 10 kW LLC Data Center Power Stages
Custom ferrite cores are becoming a practical necessity in high‑power, high‑frequency data center power supplies....
Magnetics Design in High‑Frequency GaN Converters
Magnetics in High‑Frequency GaN Converters: Design Lessons for the 0.5–1 MHz Era This article summarizes...
ECIA Industry Pulse April 2026: Sentiment Cools but Stays Strong
Overall ECIA’s April 2026 Industry Pulse shows sales sentiment in the electronic components market remaining...
Industrial Passive Components Markets and Technologies 2026
This post based on article by Dennis Zogbi, Paumanok Inc. published by TTI Market Eye...
Using Stress–Strain Curves to Diagnose Tantalum Powders for Capacitors
This article based on edited report written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, explains...
Coilcraft Introduces SMT Current Sense Transformers for High‑Performance Power Electronics
Coilcraft has introduced the CSX7030 series of SMT current sense transformers, targeting compact, high‑isolation current...
Samsung Launches Ultra-Compact 008004 High Q MLCC for Next-Generation RF Applications
Samsung Electro-Mechanics has announced the release of a full lineup of 008004 inch High Q...
Nichicon Extends Rechargeable Batteries Temperature to Rival Supercapacitors
Nichicon has expanded its SLB series of small lithium titanate (LTO) rechargeable batteries with a...
Two‑capacitor paradox explained for engineers
This article based on prof. Sam Ben-Yaakov video explains so‑called two‑capacitor paradox theory and practical...
Circuit Protection Technology Annual Dossier
Passive Components Blog has released the 2026 Annual Circuit Protection Technology Dossier, a 40‑page comprehensive analysis...
ESA SPCD 26 Registration Open
ESA SPCD organizing committee is delighted to announce that the Registration for the 6th edition...
Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You
Nonlinear multilayer ceramic capacitors (MLCCs), especially class II types such as X7R and X5R, are...
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Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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Current Sense Transformer Datasheet and Design‑in Guide
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