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Passive Components News
Sumida Introduces SMD Metal Inductors for High‑Current Automotive DC/DC Converters
Sumida has introduced the WMT1513T150/DS family of AEC‑Q200 qualified SMD metal inductors aimed at high‑reliability...
Imec Presents High-density MIMCAP RF interposer for III-V chiplets
Imec has extended its 300 mm RF silicon interposer platform with high‑density metal–insulator–metal capacitors (MIMCAPs), a...
Wk 24 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-12-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
Bourns Completes Rakon Acquisition, Enters Timing Market
Bourns has completed its acquisition of Rakon and is formally entering the high-performance frequency control...
Knowles Releases 3825 X1/Y2 Safety MLCCs for High‑Voltage Applications
Knowles Precision Devices has expanded its X1/Y2 safety‑certified multilayer ceramic capacitor (MLCC) portfolio with a...
Knowles Expands High Q Ceramic Core Inductors
Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a broader range...
TAIYO YUDEN Releases 220uF 1210 Automotive MLCC
TAIYO YUDEN has released a new automotive‑grade multilayer ceramic capacitor (MLCC), type MAASA32MAD7227MP1D71, offering 220...
HEICO’s Exxelia Expands High-Voltage Ceramic Capacitor Portfolio with CalRamic Acquisition
HEICO Corporation has announced that its Exxelia subsidiary has acquired a 90% stake in CalRamic...
Wk 23 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-5-26. DATAPOINT OF THE WEEK: S&P reported May Eurozone mfg PMI...
Power Converter Dossier: Passive Components Design and Selection Guide 2026
Passive Components Blog has released the Passive Components for Power Converters Dossier, a 63‑page, application‑driven...
Evans Group Unifies Four High-Rel Capacitor Leaders
Evans Group has introduced a unified brand identity that brings together four established high-reliability capacitor...
Skeleton Releases Graphene‑Based UPS for AI Data Centers
Skeleton Technologies has introduced GrapheneUPS, a high‑density double‑conversion UPS system aimed at AI data centers...
Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement
The move toward 800 V DC power architectures is forcing EMC filter design to become...
TDK Releases DC-link Film Capacitors with Ultra-low Inductance for SiC Power Converters
TDK has introduced the B25696H series of high-frequency DC-link film capacitors, targeting next‑generation SiC‑based power...
Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive
Murata has introduced GCJ21BD72A225KE02, an automotive‑grade soft‑termination multilayer ceramic capacitor (MLCC) that delivers World First...
Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications
Murata Manufacturing has signed a memorandum of understanding (MOU) with Xona Space Systems to jointly...
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Inter-connect, Electro-mechanical and Sensors
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
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