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Passive Components News
High‑Speed Supercapacitor Balancing for AI Data Center Power Systems
The rapid adoption of artificial intelligence is reshaping the electrical profile of modern data centers....
Bourns Introduced Automotive TVS Diodes for Compact ESD Protection
Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive‑grade bidirectional TVS diode family targeting ESD and...
Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan
TT Electronics has announced that Hallogic OMH3075S Hall‑effect sensors from its Optek portfolio have been...
Bourns Releases Automotive Gate Driver Transformer for Isolated Power
Bourns has introduced the HVMA03F45A‑ST8S, a 3‑watt surface‑mount gate driver transformer designed for automotive and...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-19-26. DATAPOINT OF THE WEEK: Infineon won two more GaN patent...
Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz
Stackpole Electronics has introduced the RNCQ series of high-frequency thin film chip resistors optimized for...
Knowles Expands High‑Q Ceramic Core Inductors for RF designs
Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a wider range...
Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN
Samsung Electro‑Mechanics has introduced a dedicated silicon capacitor lineup targeting high‑performance semiconductor packages, AI servers,...
YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering
YAGEO Group’s SMP253 series is a surface‑mount Y2 safety metallized paper capacitor family rated 310...
DMASS: European Components Distribution Returns To Growth In Q1 2026
The European electronic components distribution market delivered a robust return to growth in the first...
German Component Distribution Market Rebounds in Q1 2026 According to FBDi
The German component distribution market returned to solid growth in Q1 2026, driven by strong...
Nippon Chemi-Con Announces New Capacitor series for AI, Automotive and Immersion Cooling
Nippon Chemi-Con has announced a comprehensive update of its new/under development capacitor portfolio with multiple...
Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design
Researchers Ji Zhang, and col., working in materials science and electronic ceramics research institutions in...
Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors
Murata has expanded its simulation support for engineers using Ansys tools by making downloadable component...
Sumida Introduces SMD Metal Inductors for High‑Current Automotive DC/DC Converters
Sumida has introduced the WMT1513T150/DS family of AEC‑Q200 qualified SMD metal inductors aimed at high‑reliability...
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Inter-connect, Electro-mechanical and Sensors
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
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