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Passive Components News
Littelfuse Unveils High‑Current 48V SMD Fuse for AI Data Center Protection
Littelfuse introduces NANO² SMD 708 Series - a compact, surface‑mount fuse family designed for high‑current...
Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys
Modelithics has released version 26.2 of its COMPLETE Library for Keysight RF Synthesis (Genesys), adding...
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
Isolated DC/DC converters seem straightforward on paper, yet many designs only fail when the project...
Wk 23 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-5-26. DATAPOINT OF THE WEEK: S&P reported May Eurozone mfg PMI...
Power Converter Dossier: Passive Components Design and Selection Guide 2026
Passive Components Blog has released the Passive Components for Power Converters Dossier, a 63‑page, application‑driven...
Evans Group Unifies Four High-Rel Capacitor Leaders
Evans Group has introduced a unified brand identity that brings together four established high-reliability capacitor...
Skeleton Releases Graphene‑Based UPS for AI Data Centers
Skeleton Technologies has introduced GrapheneUPS, a high‑density double‑conversion UPS system aimed at AI data centers...
Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement
The move toward 800 V DC power architectures is forcing EMC filter design to become...
Stackpole Introduces 1400A Busbar Shunt Resistors
Stackpole Electronics has introduced the HCC series of high current over 1400A busbar shunt resistors,...
Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs
Tecate Group has introduced a new series of 2.3 V supercapacitor cells rated for continuous...
Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection
Bourns has expanded its POWrFuse high‑power fuse family with three new 1000 VDC semiconductor aR...
Passive Components in 2026: From Invisible Commodity to Design Parameter
Passive components rarely make headlines, yet they quietly determine whether new designs can be built...
Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails
Bourns has introduced the MH3261‑T Series high current chip ferrite beads, a 1206 (3216 metric)...
Wk 22 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-29-26. DATAPOINT OF THE WEEK: April new car registrations in Europe...
Vishay Releases High‑Current Radial Inductors up to 209 A
Vishay has expanded its IHXL family of radial through‑hole power inductors with four new high‑current...
May 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s latest IP&E update argues that fears of a prolonged ‘hybrid for longer’ AI...
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Inter-connect, Electro-mechanical and Sensors
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
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