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Passive Components News
Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters
Würth Elektronik has introduced a new High Leakage (HL) variant to its WE-MCRI molded coupled...
Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs
Samsung Electro‑Mechanics has introduced a new line‑up of ultra‑compact, ultra‑high‑capacitance MLCCs aimed at power stabilization...
Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications
Modern pulse power systems rely on capacitors that can store significant energy and release it...
Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs
Bourns has introduced a set of compact LTCC band pass filters aimed at 5G C‑band...
YAGEO Extends its Supercapacitor Series Line-Up
YAGEO Group’s Aluminum Electrolytic division has introduced a structured portfolio of electric double‑layer capacitor (EDLC)...
SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems
The SCHURTER EKO series is a high‑voltage fuse family designed for modern energy infrastructures such...
June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High
AI infrastructure demand is now reshaping the MLCC market in a way that is visible...
TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering
TDK’s new EP21 series SMD common‑mode chokes targets high‑current low‑voltage EMI filtering where PCB area...
Samsung Introduces 1000V C0G and X7 MLCCs for 800V DC Systems
High‑voltage DC systems around 800 V are becoming a mainstream architecture in AI power shelves...
Wk 29 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 7-24-26. DATAPOINT OF THE WEEK: June new car registrations in Europe...
Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends
Bourns has introduced the FDP2009N122157H4, a low temperature co‑fired ceramic (LTCC) diplexer targeting compact GNSS...
TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors
Resistor selection for aerospace and defence designs no longer stops at checking a part number...
Modelithics Extends Models for Microchip PIN and Varactor Diodes
Modelithics has released a new family of nonlinear simulation models for Microchip PIN and varactor...
Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms
The transition to 800V electrical architectures in aviation, defense and eVTOL platforms is driving a...
Wk 28 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 7-17-26. DATAPOINT OF THE WEEK: US EV sales fell 27.8% Y/Y...
Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes
Bourns releases SM91572AL, a dedicated AEC‑Q200 compliant BMS signal transformer that combines functional insulation with...
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Inter-connect, Electro-mechanical and Sensors
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
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Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
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