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Passive Components News
Tapped Inductor Buck Converter Fundamentals
This article based on video tutorial by prof. Sam Ben-Yaakov explains fundamentals, benefits and design...
TAIYO YUDEN Releases Mini Metal Power Inductors
TAIYO YUDEN has expanded its MCOIL LSCN series with nine new multilayer metal SMD power...
Molecular Memristor Shows Record 145 kH Emergent Inductance
Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published...
Planar vs Conventional Transformer: When it Make Sense
This article based on Frenetic webinar summarizes a practical design workflow using Frenetic AI, Frenetic...
Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors
Researchers from Japanese research institutes investigated how to make ferroelectric memory components much thinner without...
Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA
Nichicon has released its ADN‑suffix conductive polymer hybrid aluminum electrolytic capacitors into the EMEA distribution...
Wk 19 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-8-26. DATAPOINT OF THE WEEK: S&P reported Apr Eurozone mfg PMI...
Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature
Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a...
Energy Localization in Tantalum Anode Formation: A Structural Perspective
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, provides deep inside explanation...
Wk 18 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-1-26. DATAPOINT OF THE WEEK: S&P reported US mfg PMI surged...
YAGEO Introduces C0G Flexible Termination Automotive MLCCs
YAGEO introduces VW80808 automotive grade multilayer ceramic capacitors (MLCCs) with flexible terminations and C0G dielectric...
Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF...
Murata Introduces Crystal and NTC Set for Automotive UWB Timing
Murata has introduced a discrete timing solution that combines a high‑precision crystal unit with an...
Modeling Fringing Field Losses in Inductors & Transformers
Fringing field effects at air gaps represent a significant but often underestimated source of additional...
YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range...
Littelfuse Expands High-Voltage TVS Diodes
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression...
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Inter-connect, Electro-mechanical and Sensors
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder Extends NCC Circular Connectors for Harsh Environments
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You
New Technologies & Innovations
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