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Passive Components News
ECIA Industry Pulse April 2026: Sentiment Cools but Stays Strong
Overall ECIA’s April 2026 Industry Pulse shows sales sentiment in the electronic components market remaining...
Industrial Passive Components Markets and Technologies 2026
This post based on article by Dennis Zogbi, Paumanok Inc. published by TTI Market Eye...
Automotive Passive Components Technology Dossier
Passive Components Blog has released the Annual Automotive Passive Components Technology Dossier, a 36‑page comprehensive analysis...
Samsung Electro-Mechanics Signs 1.5T KRW Silicon Capacitor AI Contract
Samsung Electro-Mechanics has signed a large-scale silicon capacitor supply contract worth approximately 1.5 trillion KRW...
Murata Expands Thermistor Production Capacity at Yokaichi Plant
Murata Manufacturing has announced the construction of a new production building at its Yokaichi Plant...
Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters
Qi2 wireless power is pushing classic power‑electronics issues—EMC, magnetics and filter design—into very compact, consumer‑grade...
Samsung Introduced Low ESL 3-Terminal Reverse-Geometry MLCCs for High-Performance ADAS
Samsung Electro-Mechanics has introduced a family of low ESL multilayer ceramic capacitors (MLCCs) targeting high-performance...
Würth Elektronik Presents New Bidirectional Digital Isolators
Digital isolators have become a standard building block wherever sensitive low‑voltage control electronics need to...
ESA SPCD 26 Registration Open
ESA SPCD organizing committee is delighted to announce that the Registration for the 6th edition...
Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You
Nonlinear multilayer ceramic capacitors (MLCCs), especially class II types such as X7R and X5R, are...
Stackpole Releases Automotive Wide‑Termination Resistors
Stackpole Electronics has introduced the RMWA series of automotive‑grade wide termination thick film chip resistors...
How a Digital Structural Twin Can Predict Tantalum Capacitor Reliability
This article written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, shows how a simple...
SCHURTER Buys Biaodi to Boost High-Voltage Protection Portfolio
SCHURTER has acquired a majority stake in Biaodi, a China-based developer of high-voltage circuit protection...
Tapped Inductor Buck Converter Fundamentals
This article based on video tutorial by prof. Sam Ben-Yaakov explains fundamentals, benefits and design...
TAIYO YUDEN Releases Mini Metal Power Inductors
TAIYO YUDEN has expanded its MCOIL LSCN series with nine new multilayer metal SMD power...
Molecular Memristor Shows Record 145 kH Emergent Inductance
Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published...
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Inter-connect, Electro-mechanical and Sensors
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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Magnetics Design in High‑Frequency GaN Converters
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