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Passive Components News
Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors
Nvidia’s Vera Rubin VR200 NVL72 AI rack uses an estimated 182% more MLCC value than...
Stackpole Introduces 1400A Busbar Shunt Resistors
Stackpole Electronics has introduced the HCC series of high current over 1400A busbar shunt resistors,...
Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs
Tecate Group has introduced a new series of 2.3 V supercapacitor cells rated for continuous...
Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection
Bourns has expanded its POWrFuse high‑power fuse family with three new 1000 VDC semiconductor aR...
Passive Components in 2026: From Invisible Commodity to Design Parameter
Passive components rarely make headlines, yet they quietly determine whether new designs can be built...
Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails
Bourns has introduced the MH3261‑T Series high current chip ferrite beads, a 1206 (3216 metric)...
Wk 22 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-29-26. DATAPOINT OF THE WEEK: April new car registrations in Europe...
Vishay Releases High‑Current Radial Inductors up to 209 A
Vishay has expanded its IHXL family of radial through‑hole power inductors with four new high‑current...
How Long-Term Storage Causes Aging in Electronic Components
Electronic components are often treated as static building blocks once sealed in bags and placed...
Nichicon Presents Self-Charging LTO Board for Maintenance-Free IoT Nodes
Nichicon introduced SCBE2500A000400X Self-Charging Battery board that combines a lithium titanate rechargeable cell with an...
Mechanical SSC Testing as a Structural Diagnostic Tool for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Stackpole Introduces High‑Voltage Low VCR Chip Resistors
Stackpole Electronics has introduced the RVCU series of high‑voltage chip resistors, targeting precision voltage divider,...
GDT Gas Discharge Tubes: Surge Protection Fundamentals, Selection, and Design‑in Tips
This article summarizes how GDT (Gas Discharge Tube) work, how they differ from other surge...
YMIN Introduces Vibration Resistant Compact Low ESR Aluminum Capacitors for Home Appliances
High‑speed cordless vacuum cleaners and robot sweepers are pushing their brushless motors and motor control...
Designing a Custom Core Transformer for 10 kW LLC Data Center Power Stages
Custom ferrite cores are becoming a practical necessity in high‑power, high‑frequency data center power supplies....
Magnetics Design in High‑Frequency GaN Converters
Magnetics in High‑Frequency GaN Converters: Design Lessons for the 0.5–1 MHz Era This article summarizes...
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Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement
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