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Passive Components News
June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High
AI infrastructure demand is now reshaping the MLCC market in a way that is visible...
TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering
TDK’s new EP21 series SMD common‑mode chokes targets high‑current low‑voltage EMI filtering where PCB area...
July 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s most recent IP&E update indicates that the broader market recovery is strengthening and...
Samsung Introduces 1000V C0G and X7 MLCCs for 800V DC Systems
High‑voltage DC systems around 800 V are becoming a mainstream architecture in AI power shelves...
Wk 29 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 7-24-26. DATAPOINT OF THE WEEK: June new car registrations in Europe...
Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends
Bourns has introduced the FDP2009N122157H4, a low temperature co‑fired ceramic (LTCC) diplexer targeting compact GNSS...
TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors
Resistor selection for aerospace and defence designs no longer stops at checking a part number...
Modelithics Extends Models for Microchip PIN and Varactor Diodes
Modelithics has released a new family of nonlinear simulation models for Microchip PIN and varactor...
Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression
Murata’s new DE5 series introduces automotive safety-certified lead-type disc ceramic capacitors with X1/Y1 class approval...
SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems
SCHURTER introduces STTP 9550 three‑terminal fuse is a compact protection device specifically designed for lithium‑ion...
Can Copper Conductive Inks Displace Silver in Hybrid Electronics?
Copper has long been viewed as the low‑cost challenger to silver in flake‑based conductive inks,...
Square-Wave Harmonics and RMS Currents in Power Converters
This article explains how decomposing switching waveforms into harmonics can support the design of inductors,...
LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions
LeanBOM is an independent, engineer‑built web tool that lets designers and buyers search and compare...
In the Age of AI, Every Watt Counts: Implications for Components
At GITEX AI Europe 2026 in Berlin, Würth Elektronik eiSos shifted the AI discussion away...
Stackpole Extends Resistance Range of 2512 High‑Power Current Sense Resistors
Stackpole Electronics has expanded its CSSU high‑power metal alloy current sense resistor series with new...
Wk 27 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 7-10-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
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Inter-connect, Electro-mechanical and Sensors
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
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