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Passive Components News
Two‑capacitor paradox explained for engineers
This article based on prof. Sam Ben-Yaakov video explains so‑called two‑capacitor paradox theory and practical...
Circuit Protection Technology Annual Dossier
Passive Components Blog has released the 2026 Annual Circuit Protection Technology Dossier, a 40‑page comprehensive analysis...
ESA SPCD 26 Registration Open
ESA SPCD organizing committee is delighted to announce that the Registration for the 6th edition...
Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You
Nonlinear multilayer ceramic capacitors (MLCCs), especially class II types such as X7R and X5R, are...
Stackpole Releases Automotive Wide‑Termination Resistors
Stackpole Electronics has introduced the RMWA series of automotive‑grade wide termination thick film chip resistors...
How a Digital Structural Twin Can Predict Tantalum Capacitor Reliability
This article written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, shows how a simple...
SCHURTER Buys Biaodi to Boost High-Voltage Protection Portfolio
SCHURTER has acquired a majority stake in Biaodi, a China-based developer of high-voltage circuit protection...
Tapped Inductor Buck Converter Fundamentals
This article based on video tutorial by prof. Sam Ben-Yaakov explains fundamentals, benefits and design...
Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature
Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a...
High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors
Researchers from Northeastern University, Shenyang and the State Key Laboratory of Digital Steel and Hengdian...
European Components Distribution Shows Strong Q1 2026 Growth Amid Geopolitical Uncertainty
European electronic components distribution grew 16.9 percent to €4.63 billion in the first quarter of...
Stackpole Expanded its AlN Thick Film Chip Resistors
Stackpole Electronics has expanded its RMAN series of thick film chip resistors, which use aluminum...
KYOCERA 10 µF 0201 MLCC Brings High‑Capacitance into Mobile Designs
Kyocera has developed what it describes as the world’s first 10 µF multilayer ceramic chip capacitor...
Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive
Würth Elektronik has introduced the WE-SFIA series of SMT flat-wire inductors in compact 2010, 2013,...
KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection
KYOCERA AVX has extended its TransGuard VT Series of multilayer varistors (MLVs) with new versions...
Energy Localization in Tantalum Anode Formation: A Structural Perspective
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, provides deep inside explanation...
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Inter-connect, Electro-mechanical and Sensors
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Two‑capacitor paradox explained for engineers
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