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Passive Components News
Samsung Introduced Low ESL 3-Terminal Reverse-Geometry MLCCs for High-Performance ADAS
Samsung Electro-Mechanics has introduced a family of low ESL multilayer ceramic capacitors (MLCCs) targeting high-performance...
Würth Elektronik Presents New Bidirectional Digital Isolators
Digital isolators have become a standard building block wherever sensitive low‑voltage control electronics need to...
Using Stress–Strain Curves to Diagnose Tantalum Powders for Capacitors
This article based on edited report written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, explains...
Coilcraft Introduces SMT Current Sense Transformers for High‑Performance Power Electronics
Coilcraft has introduced the CSX7030 series of SMT current sense transformers, targeting compact, high‑isolation current...
Samsung Launches Ultra-Compact 008004 High Q MLCC for Next-Generation RF Applications
Samsung Electro-Mechanics has announced the release of a full lineup of 008004 inch High Q...
Nichicon Extends Rechargeable Batteries Temperature to Rival Supercapacitors
Nichicon has expanded its SLB series of small lithium titanate (LTO) rechargeable batteries with a...
Two‑capacitor paradox explained for engineers
This article based on prof. Sam Ben-Yaakov video explains so‑called two‑capacitor paradox theory and practical...
Circuit Protection Technology Annual Dossier
Passive Components Blog has released the 2026 Annual Circuit Protection Technology Dossier, a 40‑page comprehensive analysis...
TAIYO YUDEN Releases Mini Metal Power Inductors
TAIYO YUDEN has expanded its MCOIL LSCN series with nine new multilayer metal SMD power...
Molecular Memristor Shows Record 145 kH Emergent Inductance
Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published...
Planar vs Conventional Transformer: When it Make Sense
This article based on Frenetic webinar summarizes a practical design workflow using Frenetic AI, Frenetic...
Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors
Researchers from Japanese research institutes investigated how to make ferroelectric memory components much thinner without...
Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA
Nichicon has released its ADN‑suffix conductive polymer hybrid aluminum electrolytic capacitors into the EMEA distribution...
Wk 19 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-8-26. DATAPOINT OF THE WEEK: S&P reported Apr Eurozone mfg PMI...
Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature
Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a...
High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors
Researchers from Northeastern University, Shenyang and the State Key Laboratory of Digital Steel and Hengdian...
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Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters
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