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Passive Components News
Samsung Introduces Ultra‑compact, High‑Capacitance MLCCs for AI Edge and Wearable designs
Samsung Electro‑Mechanics has introduced a new line‑up of ultra‑compact, ultra‑high‑capacitance MLCCs aimed at power stabilization...
Knowles Presents Pulse Power Capacitors for Demanding MedTech, Industrial and Defense Applications
Modern pulse power systems rely on capacitors that can store significant energy and release it...
Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs
Bourns has introduced a set of compact LTCC band pass filters aimed at 5G C‑band...
YAGEO Extends its Supercapacitor Series Line-Up
YAGEO Group’s Aluminum Electrolytic division has introduced a structured portfolio of electric double‑layer capacitor (EDLC)...
SCHURTER Presents EKO High‑Voltage Fuses for Global Energy Systems
The SCHURTER EKO series is a high‑voltage fuse family designed for modern energy infrastructures such...
June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High
AI infrastructure demand is now reshaping the MLCC market in a way that is visible...
TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering
TDK’s new EP21 series SMD common‑mode chokes targets high‑current low‑voltage EMI filtering where PCB area...
July 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s most recent IP&E update indicates that the broader market recovery is strengthening and...
Wk 28 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 7-17-26. DATAPOINT OF THE WEEK: US EV sales fell 27.8% Y/Y...
Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes
Bourns releases SM91572AL, a dedicated AEC‑Q200 compliant BMS signal transformer that combines functional insulation with...
Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links
Itelcond has introduced new high‑voltage aluminium electrolytic capacitor series AM and AN aimed at DC‑link...
Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters
Bourns has introduced three new automotive grade shielded power inductor series designed for high‑density DC‑DC...
EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters
Electromagnetic interference (EMI) remains one of the key challenges in modern electronics, affecting both signal...
Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression
Murata’s new DE5 series introduces automotive safety-certified lead-type disc ceramic capacitors with X1/Y1 class approval...
SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems
SCHURTER introduces STTP 9550 three‑terminal fuse is a compact protection device specifically designed for lithium‑ion...
Can Copper Conductive Inks Displace Silver in Hybrid Electronics?
Copper has long been viewed as the low‑cost challenger to silver in flake‑based conductive inks,...
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Inter-connect, Electro-mechanical and Sensors
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
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Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size
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