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Passive Components News
Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations
onsemi reports that solid-state transformers (SSTs) are gaining attention as AI data centers evaluate 800...
TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package
TDK has expanded its CN series of low-resistance soft-termination multilayer ceramic capacitors with new 10...
Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing
Vishay Intertechnology has introduced the RAIK045I MP, a single-turn, off-axis inductive rotary position sensor encoder...
High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors
The study by Ella Paasio and co-authors, involving researchers from the University of Helsinki, Technical...
Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance
Coilcraft has introduced the DFC1210 series, a family of automotive-grade common mode chokes designed for...
Murata Expands Automotive Metal Power Inductor Range
Murata has expanded its DFE2MCPH_JL family of automotive-grade metal power inductors with nine new inductance...
Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model
Modelithics has released version 26.5.11 of its Qorvo GaN Library, adding a nonlinear simulation model...
Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs
Bourns has introduced the Model PER40, a 22 mm low-profile incremental ring encoder for human-machine...
August 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s most recent IP&E update indicates that AI & broader market is stronger again;...
AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection
AEM Components has introduced its CMF High-Power Fuse family for high-current circuit protection in compact...
Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs
Knowles has expanded its Cornell Dubilier Flatpack™ portfolio with the Type CLS, a 105°C-rated family...
Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density
Vishay Intertechnology has introduced the Sfernice CHEP series of thin film chip resistors for RF...
Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract
Samsung Electro-Mechanics has signed a KRW 1.0722 trillion (approximately USD 780 million) supply agreement with...
KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series
KYOCERA AVX has expanded its KGU Series of C0G (NP0) RF multilayer ceramic capacitors with...
Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C
Vishay Intertechnology has introduced the ICMS2321-10 commercial-grade and ICMS2321-1A automotive-grade low-profile common-mode chokes for high-current...
Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection
Bourns has introduced four radial-leaded metal oxide varistor (MOV) series for transient protection in line-voltage...
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Inter-connect, Electro-mechanical and Sensors
Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures
Molex’s new HSAutoLink G automotive Ethernet connector system targets the rapidly growing bandwidth needs in software‑defined vehicles, bringing multi‑gigabit performance...
binder Prints Electronics on 3D Components Connector Surface
binder is introducing printed electronics directly on three‑dimensional connector and device components, allowing sensors, heaters and conductor tracks to be...
Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes
Panasonic’s new HE‑S SC relay family is a compact PCB relay solution designed as the main switching element in next‑generation...
EMC‑Compliant PCB and Connector Design Guidelines
Electromagnetic compatibility (EMC) is decided in the schematic and layout, not in the test chamber. This article distills key lessons...
Hirose Releases Ultra‑low Profile FPC‑to‑board Connector
Hirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained...
Molex Expanded AirBorn SInergy Hybrid Connectors with 25 A Power Modules
Molex has expanded its AirBorn SInergy modular high-speed hybrid connector platform with new high-power modules that deliver up to 25.0...
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
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B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model
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