Electronics Supply Chain Weekly Digest 5-8-26. DATAPOINT OF THE WEEK: S&P reported Apr Eurozone mfg PMI...
Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a...
Researchers from Northeastern University, Shenyang and the State Key Laboratory of Digital Steel and Hengdian...
European electronic components distribution grew 16.9 percent to €4.63 billion in the first quarter of...
Stackpole Electronics has expanded its RMAN series of thick film chip resistors, which use aluminum...
Kyocera has developed what it describes as the world’s first 10 µF multilayer ceramic chip capacitor...
Würth Elektronik has introduced the WE-SFIA series of SMT flat-wire inductors in compact 2010, 2013,...
KYOCERA AVX has extended its TransGuard VT Series of multilayer varistors (MLVs) with new versions...
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range...
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression...
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new...
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the...
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs)...
Electronics Supply Chain Weekly Digest 4-24-26. DATAPOINTS OF THE WEEK: March new car registrations in Europe totaled...
Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers...
Modelithics has released version 26.1 of its Modelithics COMPLETE Library for Keysight Advanced Design System...
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...
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