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Passive Components News
Bourns Unveils High Volt GDT for High‑Energy Surge Protection
Bourns has introduced the GDT225HE Series, a new family of high voltage, high energy gas...
TDK Releases DC Link Aluminum Capacitors for EV On‑Board Chargers
TDK has introduced two new aluminum electrolytic DC link capacitor series, B43655 and B43656, targeted...
Capacitech C-Link Supercapacitors for AI Data Center Voltage Spikes Mitigation
AI data centers are pushing power infrastructures to their limits, with ultra‑fast load steps from...
Wk 8 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 2-20-26. DATAPOINTS OF THE WEEK: S&P reported February Flash Eurozone...
Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components
The Modelithics Library for MathWorks MATLAB provides an extensive set of high‑accuracy, measurement‑based models for...
Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs
Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q...
Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C
A Penn State–led team has developed a new polymer “alloy” capacitor film that stores up...
ECIA January 2026 Reports Strong Sales Confidence
ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in...
TDK Releases High Temp 175C Automotive NTC thermistors
TDK has extended its NTCSP chip thermistor family with new automotive‑grade parts qualified up to...
TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors
Researchers at TU Wien have developed a high‑aspect‑ratio superconducting vacuum gap capacitor NEMS structure with...
2026 Power Magnetics Design Trends: Flyback, DAB and Planar
Power electronics teams entering 2026 face tighter space, efficiency and time‑to‑market constraints, while magnetics must...
Vishay Releases Sulfur‑Resistant Chip Resistors
Vishay’s new RCA‑SR e3 series are AEC‑Q200 qualified thick film chip resistors designed for sulfur‑rich...
Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A
Schurter’s EKO series is a new family of square‑body high‑voltage fuses designed for DC and...
Empower Releases High-Density Embedded Silicon Capacitors
Empower Semiconductor has introduced a new generation of embedded silicon capacitors (ECAPs) aimed at improving...
TDK Unveils 125C Compact DC Link Film Capacitors
TDK has introduced the B3271xP series of DC link film capacitors aimed at demanding automotive...
SCHURTER Releases Coin Cell Supercapacitors for Backup Power
SCHURTER has introduced a new series of 5.5V coin cell supercapacitors designed as compact energy...
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Inter-connect, Electro-mechanical and Sensors
Littelfuse Unveils Ultra-Low-Power TMR Magnetic Switches
Littelfuse has introduced two new omnipolar TMR magnetic switches, LF21173TMR and LF21177TMR, targeting space‑constrained, battery‑powered electronics that need precise, low‑power...
Coaxial Connectors and How to Connect with PCB
This article based on Würth Elektronik webinar presentation discusses in-depth optimizing RF signal integrity for coaxial connectors and coaxial-to-PCB interconnect....
Panasonic Releases Compact Tactile Switch with 3N Operation Force and 500K Cycles Life
Panasonic Industry Europe has launched a new tiny tactile switch which provides a unique tactile feeling and a new operation force of 3 N. The switch’s very small footprint...
PCB Manufacturing, Test Methods, Quality and Reliability
This article based on Würth Elektronik webinar by Andreas Dreher explains PCN Test Methods and how to inspect Quality and...
Molex Introduces Modular Wire-to-Wire Automotive Connectors
Molex introduces MX-DaSH Modular Wire-to-Wire Connectors, combining power and signal terminals in a single, modular system to reduce wiring harness...
Industry Smallest Dual-Pole Reed Relay Wins Elektra Awards 2025
Electronics Weekly announced the winners of the prestigious industry awards Elektra Awards 2025. The nomination in the category of Passive/Interconnection/Electromechanical...
Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate
Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC,...
Key Interconnect Technologies for 2025
This article provides technical insights into four innovations shaping next‑generation high‑speed systems that was presented by Samtec in its blog....
Bishop Reveals Top 10 Connector Manufacturers
Bishop & Associates, a leading market research firm specializing in the electronic connector industry, presents in its TTI MarketEye article...
Samtec Releases Rugged Multi-Port SMPM Interconnects with Threaded Coupling
Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new line of rugged, multi-port...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
2026 Power Magnetics Design Trends: Flyback, DAB and Planar
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