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Passive Components News
Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors
In this article, Dr. Vladimir Azbel presents a virtual anode thermal model that allows engineers to...
Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters
Bourns has introduced the MAG-3002562, a high-current coupled inductor optimized for 48 V to 12...
Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression
Nanocrystalline cable cores of the WE‑NCC series from Würth Elektronik are designed for broadband suppression...
High‑Speed Supercapacitor Balancing for AI Data Center Power Systems
The rapid adoption of artificial intelligence is reshaping the electrical profile of modern data centers....
Bourns Introduced Automotive TVS Diodes for Compact ESD Protection
Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive‑grade bidirectional TVS diode family targeting ESD and...
Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan
TT Electronics has announced that Hallogic OMH3075S Hall‑effect sensors from its Optek portfolio have been...
Bourns Releases Automotive Gate Driver Transformer for Isolated Power
Bourns has introduced the HVMA03F45A‑ST8S, a 3‑watt surface‑mount gate driver transformer designed for automotive and...
Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution
Würth Elektronik’s new WE‑FNCS flexible nanocrystalline sheets target exactly this need by providing a thin,...
Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs
Samsung Electro-Mechanics has introduced an automotive-grade multilayer ceramic capacitor (MLCC) that combines 100 µF capacitance...
YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails
YMIN presents hybrid aluminum electrolytic capacitors from its VHT series as bulk and output filtering...
Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN
Samsung Electro‑Mechanics has introduced a dedicated silicon capacitor lineup targeting high‑performance semiconductor packages, AI servers,...
YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering
YAGEO Group’s SMP253 series is a surface‑mount Y2 safety metallized paper capacitor family rated 310...
DMASS: European Components Distribution Returns To Growth In Q1 2026
The European electronic components distribution market delivered a robust return to growth in the first...
German Component Distribution Market Rebounds in Q1 2026 According to FBDi
The German component distribution market returned to solid growth in Q1 2026, driven by strong...
Nippon Chemi-Con Announces New Capacitor series for AI, Automotive and Immersion Cooling
Nippon Chemi-Con has announced a comprehensive update of its new/under development capacitor portfolio with multiple...
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Inter-connect, Electro-mechanical and Sensors
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
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