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Passive Components News
Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs
Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q...
Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C
A Penn State–led team has developed a new polymer “alloy” capacitor film that stores up...
ECIA January 2026 Reports Strong Sales Confidence
ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in...
Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors
Vishay’s new CRCW0201-AT e3 series extends the company’s thick film chip resistor portfolio into the...
Würth Elektronik Component Data Live in Accuris
Würth Elektronik is providing live, manufacturer‑verified data for more than 22,000 electronic and electromechanical components...
Coilcraft Releases Automotive Common Mode Chokes
Coilcraft’s CMA family is a series of automotive‑qualified surface‑mount common mode chokes designed for EMI...
MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply
AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase...
YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions
YAGEO Group has introduced three new antennas that target high‑reliability wireless connectivity and precision positioning:...
Empower Releases High-Density Embedded Silicon Capacitors
Empower Semiconductor has introduced a new generation of embedded silicon capacitors (ECAPs) aimed at improving...
TDK Unveils 125C Compact DC Link Film Capacitors
TDK has introduced the B3271xP series of DC link film capacitors aimed at demanding automotive...
SCHURTER Releases Coin Cell Supercapacitors for Backup Power
SCHURTER has introduced a new series of 5.5V coin cell supercapacitors designed as compact energy...
Skeleton Technologies Expands in U.S. to Power AI Data Centers
Skeleton Technologies, a global leader in mission-critical power solutions, is expanding its presence in the...
TDK Releases Stackable µPOL 25A Power Modules
TDK has introduced the FS1525, a new member of its µPOL non‑isolated DC‑DC power module...
Wk 6 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 2-6-26. DATAPOINT OF THE WEEK: S&P reported December Eurozone mfg...
Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage
Smoltek has reported a major reliability milestone for its CNF-MIM capacitors, demonstrating more than 1,000...
DigiKey Expands Line Card with 108K Stock Parts and 364 Suppliers
DigiKey has significantly expanded its global electronic components and automation portfolio, adding more than 108,000...
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Inter-connect, Electro-mechanical and Sensors
Coaxial Connectors and How to Connect with PCB
This article based on Würth Elektronik webinar presentation discusses in-depth optimizing RF signal integrity for coaxial connectors and coaxial-to-PCB interconnect....
Panasonic Releases Compact Tactile Switch with 3N Operation Force and 500K Cycles Life
Panasonic Industry Europe has launched a new tiny tactile switch which provides a unique tactile feeling and a new operation force of 3 N. The switch’s very small footprint...
PCB Manufacturing, Test Methods, Quality and Reliability
This article based on Würth Elektronik webinar by Andreas Dreher explains PCN Test Methods and how to inspect Quality and...
Molex Introduces Modular Wire-to-Wire Automotive Connectors
Molex introduces MX-DaSH Modular Wire-to-Wire Connectors, combining power and signal terminals in a single, modular system to reduce wiring harness...
Industry Smallest Dual-Pole Reed Relay Wins Elektra Awards 2025
Electronics Weekly announced the winners of the prestigious industry awards Elektra Awards 2025. The nomination in the category of Passive/Interconnection/Electromechanical...
Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate
Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC,...
Key Interconnect Technologies for 2025
This article provides technical insights into four innovations shaping next‑generation high‑speed systems that was presented by Samtec in its blog....
Bishop Reveals Top 10 Connector Manufacturers
Bishop & Associates, a leading market research firm specializing in the electronic connector industry, presents in its TTI MarketEye article...
Samtec Releases Rugged Multi-Port SMPM Interconnects with Threaded Coupling
Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new line of rugged, multi-port...
Circular Connectors Coding
This post provides a comprehensive technical explanation of connector coding, focusing on the industry-standard M12 and its compact variant M8,...
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2026 Power Magnetics Design Trends: Flyback, DAB and Planar
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