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Passive Components News
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-26-26. DATAPOINT OF THE WEEK: May new car registrations in Europe...
Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers
Skeleton Technologies has announced a new supercapacitor that achieves a UL 810A‑certified peak current of...
Bourns Planar Transformers for SiC and GaN Gate Driver Isolation
Bourns SM9127AL planar isolation transformers help cut EMI in modern SiC and GaN gate‑driver PSUs...
100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms
VINA Enesol, part of VINATech group, has introduced a 100 V hybrid polymer aluminium capacitor...
KYOCERA AVX Releases NTN Antenna Selection Guide Brochure
Non‑terrestrial networks (NTN) are rapidly becoming a core connectivity option for IoT and wireless devices...
Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control
Coilcraft introduces 016008F ferrite-core wirewound chip inductors - ultra‑miniature RF chokes in 0402 (metric 01005)...
DigiKey Releases Season Two of Sustainable Futures Series
DigiKey has released the second season of its Sustainable Futures video series, focusing on how...
Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors
In this article, Dr. Vladimir Azbel presents a virtual anode thermal model that allows engineers to...
Bourns Releases Automotive Gate Driver Transformer for Isolated Power
Bourns has introduced the HVMA03F45A‑ST8S, a 3‑watt surface‑mount gate driver transformer designed for automotive and...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-19-26. DATAPOINT OF THE WEEK: Infineon won two more GaN patent...
Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz
Stackpole Electronics has introduced the RNCQ series of high-frequency thin film chip resistors optimized for...
Knowles Expands High‑Q Ceramic Core Inductors for RF designs
Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a wider range...
Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters
Vishay has introduced the first four members of a new IHDV high voltage power inductor...
SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics
SCHURTER has introduced a new family of polymer PTC (PPTC) resettable fuses in both radial...
TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand
TrendForce’s latest MLCC industry research reveals that the AI arms race among global cloud service...
Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution
Würth Elektronik’s new WE‑FNCS flexible nanocrystalline sheets target exactly this need by providing a thin,...
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Inter-connect, Electro-mechanical and Sensors
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
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