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Passive Components News
AI Hardware Demand for Passive Components Dossier
Passive Components Blog has published its AI Hardware Passive Components Dossier 06/26 technical and market...
June 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s latest IP&E update indicates that the broad-based recovery across the market is still...
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
Kyocera AVX presents Antenna Integrator Studio (AIS) is a browser-based tool for selecting antennas and...
Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization
Simulation tools such as REDEXPERT and eDesignSuite are increasingly central to modern power converter design...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-26-26. DATAPOINT OF THE WEEK: May new car registrations in Europe...
Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers
Skeleton Technologies has announced a new supercapacitor that achieves a UL 810A‑certified peak current of...
Bourns Planar Transformers for SiC and GaN Gate Driver Isolation
Bourns SM9127AL planar isolation transformers help cut EMI in modern SiC and GaN gate‑driver PSUs...
100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms
VINA Enesol, part of VINATech group, has introduced a 100 V hybrid polymer aluminium capacitor...
High‑Speed Supercapacitor Balancing for AI Data Center Power Systems
The rapid adoption of artificial intelligence is reshaping the electrical profile of modern data centers....
Bourns Introduced Automotive TVS Diodes for Compact ESD Protection
Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive‑grade bidirectional TVS diode family targeting ESD and...
Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan
TT Electronics has announced that Hallogic OMH3075S Hall‑effect sensors from its Optek portfolio have been...
Bourns Releases Automotive Gate Driver Transformer for Isolated Power
Bourns has introduced the HVMA03F45A‑ST8S, a 3‑watt surface‑mount gate driver transformer designed for automotive and...
Wk 25 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-19-26. DATAPOINT OF THE WEEK: Infineon won two more GaN patent...
Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz
Stackpole Electronics has introduced the RNCQ series of high-frequency thin film chip resistors optimized for...
Knowles Expands High‑Q Ceramic Core Inductors for RF designs
Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a wider range...
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Inter-connect, Electro-mechanical and Sensors
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
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