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Passive Components News
German Component Distribution Market Rebounds in Q1 2026 According to FBDi
The German component distribution market returned to solid growth in Q1 2026, driven by strong...
Nippon Chemi-Con Announces New Capacitor series for AI, Automotive and Immersion Cooling
Nippon Chemi-Con has announced a comprehensive update of its new/under development capacitor portfolio with multiple...
Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design
Researchers Ji Zhang, and col., working in materials science and electronic ceramics research institutions in...
Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors
Murata has expanded its simulation support for engineers using Ansys tools by making downloadable component...
Sumida Introduces SMD Metal Inductors for High‑Current Automotive DC/DC Converters
Sumida has introduced the WMT1513T150/DS family of AEC‑Q200 qualified SMD metal inductors aimed at high‑reliability...
Imec Presents High-density MIMCAP RF interposer for III-V chiplets
Imec has extended its 300 mm RF silicon interposer platform with high‑density metal–insulator–metal capacitors (MIMCAPs), a...
Wk 24 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-12-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
Bourns Completes Rakon Acquisition, Enters Timing Market
Bourns has completed its acquisition of Rakon and is formally entering the high-performance frequency control...
All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte
Researchers in Europe with expertise in nanofluidics, electrochemistry, clay mineralogy, and electron microscopy to design...
Littelfuse Unveils High‑Current 48V SMD Fuse for AI Data Center Protection
Littelfuse introduces NANO² SMD 708 Series - a compact, surface‑mount fuse family designed for high‑current...
Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys
Modelithics has released version 26.2 of its COMPLETE Library for Keysight RF Synthesis (Genesys), adding...
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
Isolated DC/DC converters seem straightforward on paper, yet many designs only fail when the project...
Wk 23 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-5-26. DATAPOINT OF THE WEEK: S&P reported May Eurozone mfg PMI...
Power Converter Dossier: Passive Components Design and Selection Guide 2026
Passive Components Blog has released the Passive Components for Power Converters Dossier, a 63‑page, application‑driven...
Evans Group Unifies Four High-Rel Capacitor Leaders
Evans Group has introduced a unified brand identity that brings together four established high-reliability capacitor...
Skeleton Releases Graphene‑Based UPS for AI Data Centers
Skeleton Technologies has introduced GrapheneUPS, a high‑density double‑conversion UPS system aimed at AI data centers...
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Inter-connect, Electro-mechanical and Sensors
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
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