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Passive Components News
TAIYO YUDEN Releases 220uF 1210 Automotive MLCC
TAIYO YUDEN has released a new automotive‑grade multilayer ceramic capacitor (MLCC), type MAASA32MAD7227MP1D71, offering 220...
HEICO’s Exxelia Expands High-Voltage Ceramic Capacitor Portfolio with CalRamic Acquisition
HEICO Corporation has announced that its Exxelia subsidiary has acquired a 90% stake in CalRamic...
Vishay Extends Automotive Ferrite Beads for High‑Current EMC Noise Filtering
Vishay has expanded its ILHB series of Automotive Grade multilayer chip ferrite beads, adding higher...
CapXon Earns EcoVadis Bronze Medal for Sustainability Performance
CapXon has been awarded the EcoVadis Bronze Medal, recognizing the company’s sustainability performance and placing...
All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte
Researchers in Europe with expertise in nanofluidics, electrochemistry, clay mineralogy, and electron microscopy to design...
Littelfuse Unveils High‑Current 48V SMD Fuse for AI Data Center Protection
Littelfuse introduces NANO² SMD 708 Series - a compact, surface‑mount fuse family designed for high‑current...
Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys
Modelithics has released version 26.2 of its COMPLETE Library for Keysight RF Synthesis (Genesys), adding...
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
Isolated DC/DC converters seem straightforward on paper, yet many designs only fail when the project...
Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive
Murata has introduced GCJ21BD72A225KE02, an automotive‑grade soft‑termination multilayer ceramic capacitor (MLCC) that delivers World First...
Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications
Murata Manufacturing has signed a memorandum of understanding (MOU) with Xona Space Systems to jointly...
Bourns Offers Custom Magnetics for 3‑Phase Flying Capacitor Inverters
Bourns has released two custom magnetic components, the MAG‑3002584 inductor and the MAG‑3002585 four‑phase line...
YAGEO Releases Cost Efficient Pt‑RTD Sensors with Ni wires
The MB‑Series Pt‑RTD temperature sensors from YAGEO Group Nexensos are designed for demanding, high‑volume applications...
Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors
Nvidia’s Vera Rubin VR200 NVL72 AI rack uses an estimated 182% more MLCC value than...
Stackpole Introduces 1400A Busbar Shunt Resistors
Stackpole Electronics has introduced the HCC series of high current over 1400A busbar shunt resistors,...
Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs
Tecate Group has introduced a new series of 2.3 V supercapacitor cells rated for continuous...
Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection
Bourns has expanded its POWrFuse high‑power fuse family with three new 1000 VDC semiconductor aR...
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Inter-connect, Electro-mechanical and Sensors
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
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