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Passive Components News
TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies
TAIYO YUDEN has introduced the HVX (-K) and HTX (-K) series of conductive polymer hybrid...
ECIA Industry Pulse June 2026 Reaches Five‑Year High
ECIA’s latest Industry Pulse survey reports that the June 2026 electronic components Market Sentiment Index...
YAGEO Announces July 2026 Capacitor Price Increase
YAGEO is implementing a broad, cross-portfolio capacitor price increase effective July 1, 2026, with official...
YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression
YAGEO Group’s SCF‑X and SCT‑X single‑phase common mode chokes are EMI filter components for industrial...
Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures
This article, edited from original article by Mark Laps, MLCC specialist at YAGEO Group, reviews...
Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection
Vishay Intertechnology has introduced six new SMD polymer PTC series that target USB‑C, PoE, battery‑powered...
MLCCs in the Age of AI: Q2 2026 Market Tightness
This overview article summarizes the global MLCC market in Q2/2026, outlines the roles of major...
AI Hardware Demand for Passive Components Dossier
Passive Components Blog has published its AI Hardware Passive Components Dossier 06/26 technical and market...
100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms
VINA Enesol, part of VINATech group, has introduced a 100 V hybrid polymer aluminium capacitor...
KYOCERA AVX Releases NTN Antenna Selection Guide Brochure
Non‑terrestrial networks (NTN) are rapidly becoming a core connectivity option for IoT and wireless devices...
Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control
Coilcraft introduces 016008F ferrite-core wirewound chip inductors - ultra‑miniature RF chokes in 0402 (metric 01005)...
DigiKey Releases Season Two of Sustainable Futures Series
DigiKey has released the second season of its Sustainable Futures video series, focusing on how...
Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors
In this article, Dr. Vladimir Azbel presents a virtual anode thermal model that allows engineers to...
Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters
Bourns has introduced the MAG-3002562, a high-current coupled inductor optimized for 48 V to 12...
Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression
Nanocrystalline cable cores of the WE‑NCC series from Würth Elektronik are designed for broadband suppression...
High‑Speed Supercapacitor Balancing for AI Data Center Power Systems
The rapid adoption of artificial intelligence is reshaping the electrical profile of modern data centers....
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Inter-connect, Electro-mechanical and Sensors
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
YAGEO Releases Compact RJ45 Connector for Multi‑Gigabit Ethernet
YAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Binder Hybrid Connector Simplifies One Cable Automation
The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design
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