- News
- All
- Aerospace & Defence
- Antenna
- Applications
- Automotive
- Capacitors
- Circuit Protection Devices
- electro-mechanical news
- Filters
- Fuses
- Inductors
- Industrial
- Integrated Passives
- inter-connect news
- Market & Supply Chain
- Market Insights
- Medical
- Modelling and Simulation
- New Materials & Supply
- New Technologies
- Non-linear Passives
- Oscillators
- Passive Sensors News
- Resistors
- RF & Microwave
- Telecommunication
- Weekly Digest
- Video
- News
- All
- Aerospace & Defence
- Antenna
- Applications
- Automotive
- Capacitors
- Circuit Protection Devices
- electro-mechanical news
- Filters
- Fuses
- Inductors
- Industrial
- Integrated Passives
- inter-connect news
- Market & Supply Chain
- Market Insights
- Medical
- Modelling and Simulation
- New Materials & Supply
- New Technologies
- Non-linear Passives
- Oscillators
- Passive Sensors News
- Resistors
- RF & Microwave
- Telecommunication
- Weekly Digest
- Video
Passive Components News
Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications
Murata Manufacturing has signed a memorandum of understanding (MOU) with Xona Space Systems to jointly...
Bourns Offers Custom Magnetics for 3‑Phase Flying Capacitor Inverters
Bourns has released two custom magnetic components, the MAG‑3002584 inductor and the MAG‑3002585 four‑phase line...
YAGEO Releases Cost Efficient Pt‑RTD Sensors with Ni wires
The MB‑Series Pt‑RTD temperature sensors from YAGEO Group Nexensos are designed for demanding, high‑volume applications...
Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors
Nvidia’s Vera Rubin VR200 NVL72 AI rack uses an estimated 182% more MLCC value than...
Stackpole Introduces 1400A Busbar Shunt Resistors
Stackpole Electronics has introduced the HCC series of high current over 1400A busbar shunt resistors,...
Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs
Tecate Group has introduced a new series of 2.3 V supercapacitor cells rated for continuous...
Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection
Bourns has expanded its POWrFuse high‑power fuse family with three new 1000 VDC semiconductor aR...
Passive Components in 2026: From Invisible Commodity to Design Parameter
Passive components rarely make headlines, yet they quietly determine whether new designs can be built...
Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool
Planar magnetics are becoming a key enabler for compact, high‑efficiency USB Type‑C power adapters and...
YMIN Releases Square Supercapacitors for AI Server Power System
YMIN introduces SDF square supercapacitors, which serve as an ideal solution to provide a localized,...
Exxelia Extends Temperature Range of its PP Film Capacitors to 140C
Exxelia’s CF-PP140 polypropylene film capacitors extend the usable temperature range of PP technology up to...
How Long-Term Storage Causes Aging in Electronic Components
Electronic components are often treated as static building blocks once sealed in bags and placed...
Nichicon Presents Self-Charging LTO Board for Maintenance-Free IoT Nodes
Nichicon introduced SCBE2500A000400X Self-Charging Battery board that combines a lithium titanate rechargeable cell with an...
Mechanical SSC Testing as a Structural Diagnostic Tool for Tantalum Capacitor Anodes
This article, written by Vladimir Azbel, Ph.D., a semiconductor process reliability engineering consultant, and adapted and edited...
Stackpole Introduces High‑Voltage Low VCR Chip Resistors
Stackpole Electronics has introduced the RVCU series of high‑voltage chip resistors, targeting precision voltage divider,...
GDT Gas Discharge Tubes: Surge Protection Fundamentals, Selection, and Design‑in Tips
This article summarizes how GDT (Gas Discharge Tube) work, how they differ from other surge...
Upcoming Events
Popular Posts
-
Buck Converter Design and Calculation
-
Boost Converter Design and Calculation
-
MLCC and Ceramic Capacitors
-
Flyback Converter Design and Calculation
-
LLC Resonant Converter Design and Calculation
-
Dual Active Bridge (DAB) Topology
-
Capacitor Charging and Discharging
-
What Electronics Engineer Needs to Know About Passive Low Pass Filters
News Archive
Popular Articles
Newsletter Subscription
Inter-connect, Electro-mechanical and Sensors
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement
New Technologies & Innovations
EPCI Members
Core Members
join EPCI membership to get all benefits
© EPCI - Leading Passive Components Educational and Information Site