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Passive Components News
Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models
Modelithics has released COMPLETE+3D Library v26.3 for Ansys HFSS, adding more than 100 models representing...
Samsung Low-Profile and Embedded MLCCs for Compact Devices
Samsung Electro-Mechanics has introduced a low-profile and embedded MLCC lineup aimed at height-constrained and high-density...
Wk 36 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 9-18-26. DATAPOINTS OF THE WEEK: The EU has reportedly asked China to...
Bourns Adds ACXX57SQ Air Coil Inductors for RF Design
Bourns has introduced the ACXX57SQ Series, a surface-mount air coil inductor line aimed at high-frequency...
Samsung MLCC Options for 1 MW AI Rack Power
Samsung Electro-Mechanics has outlined MLCC placement options for power delivery in 1 MW-class AI server...
5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers
High-power AI data-center racks are driving interest in higher-voltage DC distribution and compact isolated conversion...
Exxelia Passive Components Support BepiColombo Mission
Exxelia has announced that PM film capacitors, CMC common-mode chokes and SESI power inductors are...
Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets
Optical isolators transfer signals across a dielectric barrier using light, keeping high-voltage power stages electrically...
Stackpole RNAN AlN Thin-Film Resistors Reach 6 W
Stackpole Electronics has introduced the RNAN series of thin-film chip resistors on aluminium nitride (AlN)...
Bourns Expands Compact Incremental Potentiometer Offering
Bourns has expanded its position-feedback portfolio with the PST065 and PST10 Series incremental potentiometers. The...
Wk 35 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 9-11-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply
Samsung Electro-Mechanics’ multilayer ceramic capacitor business is expected to become a substantially larger contributor to...
ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W
ROHM has introduced the SDR01 series of high anti-surge thick-film chip resistors in the 1005...
ECIA Industry Pulse Moderates as Passive Lead Times Tighten
ECIA’s August and Q3 2026 Industry Pulse shows that electronics-component market sentiment is cooling from...
LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery
LG Innotek has demonstrated flip-chip ball grid array (FC-BGA) substrate samples that embed silicon capacitors...
On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics
Alessandro Paghi, Farbod Abazar and colleagues from the University of Pisa, with contributors from Scuola...
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Connector Industry Performance Accelerates Through Mid-2026
The global connector industry recorded exceptionally strong growth in the first half of 2026, supported by expanding AI and cloud-data-centre...
Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints
Molex’s new MiniMix hybrid power and signal connectors combine 15.0A power delivery with 1Gbps 1000BASE‑T1 Ethernet in an ultra‑compact form...
Littelfuse Releases Toggle Safety Covers for Reliable Control Panels
Spring-loaded toggle safety covers may look like a small mechanical accessory, but in high‑energy and industrial control panels they can...
Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures
Molex’s new HSAutoLink G automotive Ethernet connector system targets the rapidly growing bandwidth needs in software‑defined vehicles, bringing multi‑gigabit performance...
binder Prints Electronics on 3D Components Connector Surface
binder is introducing printed electronics directly on three‑dimensional connector and device components, allowing sensors, heaters and conductor tracks to be...
Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes
Panasonic’s new HE‑S SC relay family is a compact PCB relay solution designed as the main switching element in next‑generation...
EMC‑Compliant PCB and Connector Design Guidelines
Electromagnetic compatibility (EMC) is decided in the schematic and layout, not in the test chamber. This article distills key lessons...
Hirose Releases Ultra‑low Profile FPC‑to‑board Connector
Hirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained...
Molex Expanded AirBorn SInergy Hybrid Connectors with 25 A Power Modules
Molex has expanded its AirBorn SInergy modular high-speed hybrid connector platform with new high-power modules that deliver up to 25.0...
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
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TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation
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