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Passive Components News
Wk 22 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 5-29-26. DATAPOINT OF THE WEEK: April new car registrations in Europe...
Vishay Releases High‑Current Radial Inductors up to 209 A
Vishay has expanded its IHXL family of radial through‑hole power inductors with four new high‑current...
May 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s latest IP&E update argues that fears of a prolonged ‘hybrid for longer’ AI...
Passive Components Enable Safe and Reliable ADAS Architectures
This paper provides a comprehensive overview of passive component requirements in ADAS architectures, illustrated with...
Current Sense Transformer Datasheet and Design‑in Guide
This article based on prof. Sam Ben-Yaakov video summarizes how current sense transformers work, how...
Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool
Planar magnetics are becoming a key enabler for compact, high‑efficiency USB Type‑C power adapters and...
YMIN Releases Square Supercapacitors for AI Server Power System
YMIN introduces SDF square supercapacitors, which serve as an ideal solution to provide a localized,...
Exxelia Extends Temperature Range of its PP Film Capacitors to 140C
Exxelia’s CF-PP140 polypropylene film capacitors extend the usable temperature range of PP technology up to...
Designing a Custom Core Transformer for 10 kW LLC Data Center Power Stages
Custom ferrite cores are becoming a practical necessity in high‑power, high‑frequency data center power supplies....
Magnetics Design in High‑Frequency GaN Converters
Magnetics in High‑Frequency GaN Converters: Design Lessons for the 0.5–1 MHz Era This article summarizes...
ECIA Industry Pulse April 2026: Sentiment Cools but Stays Strong
Overall ECIA’s April 2026 Industry Pulse shows sales sentiment in the electronic components market remaining...
Industrial Passive Components Markets and Technologies 2026
This post based on article by Dennis Zogbi, Paumanok Inc. published by TTI Market Eye...
Automotive Passive Components Technology Dossier
Passive Components Blog has released the Annual Automotive Passive Components Technology Dossier, a 36‑page comprehensive analysis...
Samsung Electro-Mechanics Signs 1.5T KRW Silicon Capacitor AI Contract
Samsung Electro-Mechanics has signed a large-scale silicon capacitor supply contract worth approximately 1.5 trillion KRW...
Murata Expands Thermistor Production Capacity at Yokaichi Plant
Murata Manufacturing has announced the construction of a new production building at its Yokaichi Plant...
Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters
Qi2 wireless power is pushing classic power‑electronics issues—EMC, magnetics and filter design—into very compact, consumer‑grade...
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Inter-connect, Electro-mechanical and Sensors
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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Current Sense Transformer Datasheet and Design‑in Guide
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