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Passive Components News
Bourns Expands Compact Incremental Potentiometer Offering
Bourns has expanded its position-feedback portfolio with the PST065 and PST10 Series incremental potentiometers. The...
Wk 35 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 9-11-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply
Samsung Electro-Mechanics’ multilayer ceramic capacitor business is expected to become a substantially larger contributor to...
ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W
ROHM has introduced the SDR01 series of high anti-surge thick-film chip resistors in the 1005...
ECIA Industry Pulse Moderates as Passive Lead Times Tighten
ECIA’s August and Q3 2026 Industry Pulse shows that electronics-component market sentiment is cooling from...
LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery
LG Innotek has demonstrated flip-chip ball grid array (FC-BGA) substrate samples that embed silicon capacitors...
On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics
Alessandro Paghi, Farbod Abazar and colleagues from the University of Pisa, with contributors from Scuola...
Emerging Capacitor Markets in Fusion Energy
Fusion development creates a new capacitor opportunity. This article based on a MarketEYE analysis by...
Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations
onsemi reports that solid-state transformers (SSTs) are gaining attention as AI data centers evaluate 800...
TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package
TDK has expanded its CN series of low-resistance soft-termination multilayer ceramic capacitors with new 10...
Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing
Vishay Intertechnology has introduced the RAIK045I MP, a single-turn, off-axis inductive rotary position sensor encoder...
High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors
The study by Ella Paasio and co-authors, involving researchers from the University of Helsinki, Technical...
Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance
Coilcraft has introduced the DFC1210 series, a family of automotive-grade common mode chokes designed for...
Murata Expands Automotive Metal Power Inductor Range
Murata has expanded its DFE2MCPH_JL family of automotive-grade metal power inductors with nine new inductance...
Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model
Modelithics has released version 26.5.11 of its Qorvo GaN Library, adding a nonlinear simulation model...
Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs
Bourns has introduced the Model PER40, a 22 mm low-profile incremental ring encoder for human-machine...
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Inter-connect, Electro-mechanical and Sensors
Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints
Molex’s new MiniMix hybrid power and signal connectors combine 15.0A power delivery with 1Gbps 1000BASE‑T1 Ethernet in an ultra‑compact form...
Littelfuse Releases Toggle Safety Covers for Reliable Control Panels
Spring-loaded toggle safety covers may look like a small mechanical accessory, but in high‑energy and industrial control panels they can...
Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures
Molex’s new HSAutoLink G automotive Ethernet connector system targets the rapidly growing bandwidth needs in software‑defined vehicles, bringing multi‑gigabit performance...
binder Prints Electronics on 3D Components Connector Surface
binder is introducing printed electronics directly on three‑dimensional connector and device components, allowing sensors, heaters and conductor tracks to be...
Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes
Panasonic’s new HE‑S SC relay family is a compact PCB relay solution designed as the main switching element in next‑generation...
EMC‑Compliant PCB and Connector Design Guidelines
Electromagnetic compatibility (EMC) is decided in the schematic and layout, not in the test chamber. This article distills key lessons...
Hirose Releases Ultra‑low Profile FPC‑to‑board Connector
Hirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained...
Molex Expanded AirBorn SInergy Hybrid Connectors with 25 A Power Modules
Molex has expanded its AirBorn SInergy modular high-speed hybrid connector platform with new high-power modules that deliver up to 25.0...
Hirose Releases 0.5 mm Floating Board-to-Board Connector for EV Powertrain Designs
Hirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Hirose Expands Compact High‑Voltage EV connectors
Hirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
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