Bourns has expanded its POWrFuse high‑power fuse family with three new 1000 VDC semiconductor aR...
Passive components rarely make headlines, yet they quietly determine whether new designs can be built...
Bourns has introduced the MH3261‑T Series high current chip ferrite beads, a 1206 (3216 metric)...
Electronics Supply Chain Weekly Digest 5-29-26. DATAPOINT OF THE WEEK: April new car registrations in Europe...
Vishay has expanded its IHXL family of radial through‑hole power inductors with four new high‑current...
Edgewater Research’s latest IP&E update argues that fears of a prolonged ‘hybrid for longer’ AI...
This paper provides a comprehensive overview of passive component requirements in ADAS architectures, illustrated with...
This article based on prof. Sam Ben-Yaakov video summarizes how current sense transformers work, how...
Stackpole Electronics has introduced the RVCU series of high‑voltage chip resistors, targeting precision voltage divider,...
This article summarizes how GDT (Gas Discharge Tube) work, how they differ from other surge...
High‑speed cordless vacuum cleaners and robot sweepers are pushing their brushless motors and motor control...
Custom ferrite cores are becoming a practical necessity in high‑power, high‑frequency data center power supplies....
Magnetics in High‑Frequency GaN Converters: Design Lessons for the 0.5–1 MHz Era This article summarizes...
Overall ECIA’s April 2026 Industry Pulse shows sales sentiment in the electronic components market remaining...
This post based on article by Dennis Zogbi, Paumanok Inc. published by TTI Market Eye...
Passive Components Blog has released the Annual Automotive Passive Components Technology Dossier, a 36‑page comprehensive analysis...
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
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