Partial Micro-Vias; WE PCB Design Webinar

Partial Micro-Vias; WE PCB Design Webinar

Wed, Nov 8, 2023 11:00 AM – 12:00 PM CET

Partial vias play a decisive role in the miniaturization of printed circuit boards. These are buried vias and microvias, which can be combined in different ways. We call microvias placed directly in solder pads “microvia-in-pad”. This saves valuable space, and since microvias are very small blind holes, they can also be integrated into very small solder pads. This is crucial for unbundling miniaturized or complex components such as micro BGAs.

Learn more in this Würth Elektronik webinar about

• our sample WE.microbga and what you can learn from it
• the current design rules of the MICROVIA.hdi technology and their application
• the routing of a BGA component with pitch 0.4 mm
• the advantages of MICROVIA.hdi technology in terms of signal integrity
• impedance calculations

The webinar is interesting for purchasing, developers and students. We will be happy to answer questions again in the Q&A session of the live event, which will not be included in the recording – so it’s worth joining us live.