Microwave Packaging Technology

Microwave Packaging Technology

Instructor: Thomas Green

Description: Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material tradeoffs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military, space and other hi reliability commercial and medical device applications.

The course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.

Topics include:

Session 1

• Introduction to Microwave Technology
• Military Requirements Flow Down and Design Guidelines
• Manufacturing Assembly Process Overview
• Wafer Fabrication Processes
• Substrate Technology
• Thin Film Processes on Ceramic
• Material and Process Fundamentals for Component Attach
• Eutectic Soldering Processes

Session 2

• Die, substrate and package compatibility
• Thermal Impedance and Importance of Minimizing Junction Temperature
• Packaging Design Considerations
• Review of Defects from the Component Attach Process
• Overview of Common Cleaning Processes and Potential Problems
• Wirebonding and Interconnect Process Overview
• Gap Welding
• Factors that affect yield and reliability

Session 3

• Hermetic Packaging Process Overview
• Hermeticity Testing
• Near Hermetic Packaging Options
• Design for Manufacturability (DFM)