The Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded...
This article based on video tutorial by prof. Sam Ben-Yaakov explains fundamentals, benefits and design notes related...
TAIYO YUDEN has expanded its MCOIL LSCN series with nine new multilayer metal SMD power inductors in...
Researchers from RIKEN Pioneering Research Institute, Nagoya University, and Tohoku University demonstrated in article published by Nature...
This article based on Frenetic webinar summarizes a practical design workflow using Frenetic AI, Frenetic Simulator and...
Researchers from Japanese research institutes investigated how to make ferroelectric memory components much thinner without losing performance....
Nichicon has released its ADN‑suffix conductive polymer hybrid aluminum electrolytic capacitors into the EMEA distribution channel, targeting...
Electronics Supply Chain Weekly Digest 5-8-26. DATAPOINT OF THE WEEK: S&P reported Apr Eurozone mfg PMI increased to...
Researchers from University of Cambridge, UK, led by M. Romero and colleagues, have reported a new class...
Researchers from Northeastern University, Shenyang and the State Key Laboratory of Digital Steel and Hengdian Group DMEGC...
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