Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review […]
Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different […]
