Definition of component heating of power inductors in switching regulators using IEC 62024 - Partnered with Digi-Key Electronics 28. November 2023, 16:00 - 17:00 CET The heating of components is a central issue in any design. It is often the case that the heating of the application is kept as low as possible. Interpreting the […]
Film Capacitors: The Versatility and Stability TTI & Eaton Webinar Date: December 4, 2023 Time: 2 PM EST (11 AM PST / 8:00 PM CET) Duration: 1 hour In this webinar, Eaton will discuss design and selection considerations for film capacitors. What makes capacitors truly versatile is their adaptability, and film capacitors exhibit remarkable stability even in substantial temperature […]
High Voltage Power Distribution Units and Fuse Selection Importance Tue, Dec 5, 2023 3:00 PM - 4:00 PM CET As the vehicle electrification continues, the demand for robust and more power distribution solutions, thus effective protection measures, increases. The design of an HV Power Distribution Unit stands as a central point in ensuring the integrity […]
Würth Elektronik Webinar: Miniaturization, mechatronics, microvia: SLIM.flex PCB sample WE.scope! Wed, Dec 6, 2023 11:00 AM - 12:00 PM CET Dive into the fascinating world of miniaturization of printed circuit boards with partial vias. Microvias that are combined with each other in different ways. When it comes to connecting all copper layers with only the […]
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, will host “Strategic Procurement for 2024: A Live Fireside Chat” on Wednesday, Dec. 6, at 11 a.m. CDT. The virtual event will feature procurement experts from DigiKey who will discuss the keys to a […]
Microwave Design Principles for the Practicing RF Engineer Instructor: Chandra Gupta, PhD, MBA Description: Are you an engineer looking to expand your knowledge and skills in RF and Microwave technologies? Join this RF and Microwave Practical Course designed specifically for engineers like you and hone in your skills. Gain practical theory, get insights, learn practical techniques, […]
Creating Compact and Efficient Power Supplies Using GaN for Up to 100 Watts Presented by Würth Elektronik and STMicroelectronics Tuesday, January 16th 2024 @ 4:00PM CET The recent GaN technology can operate at very high frequencies and deliver major efficiency gains. When used with optimized controllers, this wide bandgap material can significantly reduce the size of auxiliary […]
Microwave Packaging Technology Instructor: Thomas Green Description: Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments, such as next generation 5G modules. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares […]
Power supply efficiency improvements at low load conditions Presented by Würth Elektronik and NXP Semiconductors Tuesday, January 23rd 2024 @ 10:00AM CET Traditionally, power supply efficiency is important for high power levels to reduce energy consumption of the overall application during normal operation. Designers must minimize the size and cost of component and power supplies […]
Heat-Resilient Innovation Murata High-Temperature Film Capacitor for xEV Power Electronics 6th February 2024 11:00 AM IST time / 1:30 PM SGT In the ever-evolving landscape of mobility solutions, where innovation propels the industry forward, Murata's High-Temperature Film Capacitors (HTFC) take centre stage. While conventional film capacitors typically guarantee operation up to 105°C, Murata's HTFC breaks […]
Webinar: Miniaturization, function, reliability: DEVICE.embedding PCB sample WE.embed! Wed, Feb 7, 2024 11:00 AM - 12:00 PM CET LET THERE BE LIGHT! Dive into the fascinating world of miniaturization of printed circuit boards with embedded active and passive components. The efficient use of ever smaller housing volumes and tiny surfaces is becoming increasingly important. Embedding […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]
