Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past, gold wire was the dominant material in use, but in 2015 copper and palladium coated copper wire captured more than 51% of […]

PCIM Europe 11-13.6. Nuernberg Germany The Power Electronics industry has been meeting in Nuremberg since 1979. The exhibition and conference is the leading international platform showcasing current products, topics and trends in power electronics and applications. PCIM Europe – Excelling in Power Electronics As the leading international exhibition and conference for Power Electronics, Intelligent Motion, […]

Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review of the Mil Spec test methods in place to prevent moisture related failures in hermetically sealed microelectronics where functional reliability is of utmost importance (e.g. […]