Wed, May 15, 2024 11:00 AM – 12:00 PM CEST
Our RIGID.flex physical PCB sample WE.flexone shows you the diverse mechatronic possibilities of this PCB technology with external flex layers. This makes the difference between one and two copper layers in the two flex areas literally tangible. In addition, the different coatings of the flex areas can be compared with both flexible solder resist and coverlay.
The sample shows a clever form of the popular ZIF contact and a flexibly connected high-frequency connector. A detachable lift-off area stimulates the senses and can trigger new product ideas.
In our webinar on May 15, 2024 at 11:00 a.m., we will offer you insights into:
The webinar is of interest to PCB designers, developers and students who want to gain an insight into the world of innovative PCB technologies.
© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site