Webinar: Cost-efficient flexibility: Physical PCB sample WE.bend! Wed, Nov 6, 2024 11:00 AM - 12:00 PM CET WE.flex again: Following the presentation of the two RIGID.flex samples, we are now entering the third round. Our combined WE.bend physical PCB sample shows a combination of the SEMI.flex and BEND.flex technologies and thus enables a direct comparison. […]
Messe Munchen
Trade Fair Center Messe München, München, Germany
electronica 2024 November 12-15 World’s leading trade fair and conference for electronics Electronica in Munich is the world's leading trade fair for electronics, it covers the entire spectrum of modern electronics and offers plenty of space for professional exchange and networking with three accompanying trade conferences and its comprehensive supporting program.
Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different approach from a design, production, testing, and qualification standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. Fick’s law […]
Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard for Smart Homes in our webinar for manufacturers! Find out how Matter improves interoperability and what framework conditions need to be considered when using it. […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing process for the production of the module or the entire electronic assembly from the PCB to the end product? True to the motto “more than […]
MIL-STD-883 TM 2010 Instructor: Thomas Green Description: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll discuss the strategies for reducing your Bill of Materials (BoM) while enhancing Common Mode noise reduction. We will introduce a method to design compliant filters […]
Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review of the Mil Spec test methods in place to prevent moisture related failures in hermetically sealed microelectronics where functional reliability is of utmost importance (e.g. […]
Retrofitting with FeatherWings - How to digitize your analog systems Webinar by Würth Elektronik Tuesday, December 17th 2024 @ 4:00PM CET Discover in our webinar everything about retrofitting with FeatherWings and learn how to quickly and easily digitize your analog systems! Find out how FeatherWings can help you equip older systems with state-of-the-art IoT technology […]
EMC Challenges for high speed signal immunity and low EMI power delivery Webinar by Würth Elektronik Tuesday, January 14th 2025 @ 4:00PM CET presented by Lorandt Fölkel Würth Elektronik eiSos Arno Distel Valens Semiconductor
Generate LTspice Files for Any Topology - Try it yourself! Frenetic Webinar Join us for an exclusive hands-on webinar where you’ll discover how to instantly generate LTspice files for any topology with FreneticAI. Learn how this innovative tool simplifies power electronics design by automating circuit generation and simulation.
Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) Instructor: Thomas Green Description: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the […]